Microstructure properties high performance copper di wang chang (1 risultati)
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Da: liu xing, Nanjing, JS, Cinaliu xing
Contatta il venditoreVenditore con 5 stelleCondizione: Nuovo
EUR 62,05
EUR 15,70 spedizioneSpedito da Cina a U.S.A.Quantità: 5 disponibili
paperback. Condizione: New. Language:Chinese.Paperback. Pub Date: 2015-12-01 Publisher: Tsinghua University Press book selected industrialized micron SiC powder materials. chemical copper plating process for preparing a Cu-coated SiCp composite powders. and composite powders and composition morphology was analyzed. In the compos…ite powder as raw material. the use of vacuum sintering and non-vacuum sintering two processes to prepare SiCp volume fraction of 30%. 40% and 50% of SiCpCu composites and microstructure and Comp.
