Editore: People's Posts and Telecommunications Press, 2000
ISBN 10: 7115153922 ISBN 13: 9787115153920
Lingua: Cinese
Da: liu xing, Nanjing, JS, Cina
EUR 48,62
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Aggiungi al carrellopaperback. Condizione: New. Paperback. Pub Date: 2007 Pages: 181 Publisher: People's Posts and Telecommunications Press title: the phone circuit principle and maintenance Original Price: 23.00 yuan Author: Zhang Xingwei editor of Press: People's Posts and Telecommunications Press Publication Date: January 1. 2007 ISBN : 7115153922 words: Page: 181 Edition: 1 Format: Folio: Editor's book is a vocational school materials from the point of view of practical and fast skills training. attention to the training of basic knowl.
ISBN 10: 7115115095 ISBN 13: 9787115115096
Da: liu xing, Nanjing, JS, Cina
EUR 50,98
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Aggiungi al carrellopaperback. Condizione: New. Paperback Pages Number: 275 Language: Chinese. CDMA mobile phone circuit principle and maintenance. focuses on the circuit schematic and maintenance of the CDMA mobile phones. The book contains three aspects: Firstly. the most basic circuit structure of the CDMA Communication Theory and CDMA mobile phones; then some typical CDMA mobile phones. for example. about the circuit schematic of CDMA handsets and CDMA mobile phones. troubleshooting methods; about some of the CDMA phones repair softwar.
Editore: People Post Press Pub. Date :2010-06-29, 2000
ISBN 10: 7115186820 ISBN 13: 9787115186829
Lingua: Cinese
Da: liu xing, Nanjing, JS, Cina
EUR 72,46
Convertire valutaQuantità: 1 disponibili
Aggiungi al carrellopaperback. Condizione: New. Paperback. Pub Date: 2009 Pages: 415 Language: Chinese in Publisher: People's Posts and Telecommunications Press the refined solution Sony Ericsson mobile phone circuit principle and maintenance technology (2) focuses on a Sony Ericsson mobile phones Ericsson Mobile Platforms (EMP) circuit characteristics and fault repair techniques. At the same time. also part oadcom baseband solution Sony Ericsson mobile phone circuit schematic. Chapter 1 introduces the Ericsson Mobile Platforms chips. Chap.