Editore: Springer Berlin Heidelberg, 2011
ISBN 10: 3642231195 ISBN 13: 9783642231193
Lingua: Inglese
Da: Buchpark, Trebbin, Germania
Condizione: Sehr gut. Zustand: Sehr gut | Seiten: 212 | Sprache: Englisch | Produktart: Bücher.
Da: California Books, Miami, FL, U.S.A.
EUR 61,44
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Editore: Springer Berlin Heidelberg, 2013
ISBN 10: 3642270727 ISBN 13: 9783642270727
Lingua: Inglese
Da: AHA-BUCH GmbH, Einbeck, Germania
EUR 53,49
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Aggiungi al carrelloTaschenbuch. Condizione: Neu. Druck auf Anfrage Neuware - Printed after ordering - This book contains extended and revised versions of the best papers presented at the 17th IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2009, held in Florianópolis, Brazil, in October 2009. The 8 papers included in the book together with two keynote talks were carefully reviewed and selected from 27 papers presented at the conference. The papers cover a wide variety of excellence in VLSI technology and advanced research addressing the current trend toward increasing chip integration and technology process advancements bringing about stimulating new challenges both at the physical and system-design levels, as well as in the test of theses systems.
Editore: Springer Berlin Heidelberg, 2011
ISBN 10: 3642231195 ISBN 13: 9783642231193
Lingua: Inglese
Da: AHA-BUCH GmbH, Einbeck, Germania
EUR 53,49
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Aggiungi al carrelloBuch. Condizione: Neu. Druck auf Anfrage Neuware - Printed after ordering - This book contains extended and revised versions of the best papers presented at the 17th IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2009, held in Florianópolis, Brazil, in October 2009. The 8 papers included in the book together with two keynote talks were carefully reviewed and selected from 27 papers presented at the conference. The papers cover a wide variety of excellence in VLSI technology and advanced research addressing the current trend toward increasing chip integration and technology process advancements bringing about stimulating new challenges both at the physical and system-design levels, as well as in the test of theses systems.
Editore: Springer Berlin Heidelberg, Springer Berlin Heidelberg Aug 2011, 2011
ISBN 10: 3642231195 ISBN 13: 9783642231193
Lingua: Inglese
Da: buchversandmimpf2000, Emtmannsberg, BAYE, Germania
EUR 53,49
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Aggiungi al carrelloBuch. Condizione: Neu. Neuware -This book contains extended and revised versions of the best papers presented at the 17th IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2009, held in Florianópolis, Brazil, in October 2009. The 8 papers included in the book together with two keynote talks were carefully reviewed and selected from 27 papers presented at the conference. The papers cover a wide variety of excellence in VLSI technology and advanced research addressing the current trend toward increasing chip integration and technology process advancements bringing about stimulating new challenges both at the physical and system-design levels, as well as in the test of theses systems.Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg 212 pp. Englisch.
Da: GreatBookPrices, Columbia, MD, U.S.A.
EUR 55,01
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Da: GreatBookPrices, Columbia, MD, U.S.A.
EUR 65,03
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Aggiungi al carrelloCondizione: As New. Unread book in perfect condition.
Da: GreatBookPricesUK, Woodford Green, Regno Unito
EUR 68,06
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Da: GreatBookPricesUK, Woodford Green, Regno Unito
EUR 71,72
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Aggiungi al carrelloCondizione: As New. Unread book in perfect condition.
Editore: Springer-Verlag New York Inc, 2011
ISBN 10: 3642231195 ISBN 13: 9783642231193
Lingua: Inglese
Da: Revaluation Books, Exeter, Regno Unito
EUR 79,82
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Aggiungi al carrelloHardcover. Condizione: Brand New. 2011 edition. 197 pages. 9.25x6.25x0.50 inches. In Stock.
Da: Revaluation Books, Exeter, Regno Unito
EUR 85,90
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Aggiungi al carrelloPaperback. Condizione: Brand New. 2011 edition. 223 pages. 9.10x6.10x0.60 inches. In Stock.
Da: Ria Christie Collections, Uxbridge, Regno Unito
EUR 93,88
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Da: Lucky's Textbooks, Dallas, TX, U.S.A.
EUR 53,80
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Da: Mispah books, Redhill, SURRE, Regno Unito
EUR 101,44
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Aggiungi al carrelloPaperback. Condizione: Like New. Like New. book.
Editore: Springer Berlin Heidelberg, 2013
ISBN 10: 3642270727 ISBN 13: 9783642270727
Lingua: Inglese
Da: moluna, Greven, Germania
EUR 48,37
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Aggiungi al carrelloCondizione: New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. State-of-the-art researchFast-track conference proceedingsUnique visibilityThis book contains extended and revised versions of the best papers presented at the 17th IFIP WG 10.5/IEEE International Conference on Very Large Scale Inte.
Editore: Springer Berlin Heidelberg, 2011
ISBN 10: 3642231195 ISBN 13: 9783642231193
Lingua: Inglese
Da: moluna, Greven, Germania
EUR 48,37
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Aggiungi al carrelloGebunden. Condizione: New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. State-of-the-art researchFast-track conference proceedingsUnique visibilityThis book contains extended and revised versions of the best papers presented at the 17th IFIP WG 10.5/IEEE International Conference on Very Large Scale Inte.
Editore: Springer Berlin Heidelberg Nov 2013, 2013
ISBN 10: 3642270727 ISBN 13: 9783642270727
Lingua: Inglese
Da: BuchWeltWeit Ludwig Meier e.K., Bergisch Gladbach, Germania
EUR 53,49
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Aggiungi al carrelloTaschenbuch. Condizione: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -This book contains extended and revised versions of the best papers presented at the 17th IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2009, held in Florianópolis, Brazil, in October 2009. The 8 papers included in the book together with two keynote talks were carefully reviewed and selected from 27 papers presented at the conference. The papers cover a wide variety of excellence in VLSI technology and advanced research addressing the current trend toward increasing chip integration and technology process advancements bringing about stimulating new challenges both at the physical and system-design levels, as well as in the test of theses systems. 212 pp. Englisch.
Editore: Springer Berlin Heidelberg Aug 2011, 2011
ISBN 10: 3642231195 ISBN 13: 9783642231193
Lingua: Inglese
Da: BuchWeltWeit Ludwig Meier e.K., Bergisch Gladbach, Germania
EUR 53,49
Convertire valutaQuantitą: 2 disponibili
Aggiungi al carrelloBuch. Condizione: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -This book contains extended and revised versions of the best papers presented at the 17th IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2009, held in Florianópolis, Brazil, in October 2009. The 8 papers included in the book together with two keynote talks were carefully reviewed and selected from 27 papers presented at the conference. The papers cover a wide variety of excellence in VLSI technology and advanced research addressing the current trend toward increasing chip integration and technology process advancements bringing about stimulating new challenges both at the physical and system-design levels, as well as in the test of theses systems. 212 pp. Englisch.
Editore: Springer Berlin Heidelberg, Springer Berlin Heidelberg Nov 2013, 2013
ISBN 10: 3642270727 ISBN 13: 9783642270727
Lingua: Inglese
Da: buchversandmimpf2000, Emtmannsberg, BAYE, Germania
EUR 53,49
Convertire valutaQuantitą: 1 disponibili
Aggiungi al carrelloTaschenbuch. Condizione: Neu. This item is printed on demand - Print on Demand Titel. Neuware -This book contains extended and revised versions of the best papers presented at the 17th IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2009, held in Florianópolis, Brazil, in October 2009. The 8 papers included in the book together with two keynote talks were carefully reviewed and selected from 27 papers presented at the conference. The papers cover a wide variety of excellence in VLSI technology and advanced research addressing the current trend toward increasing chip integration and technology process advancements bringing about stimulating new challenges both at the physical and system-design levels, as well as in the test of theses systems.Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg 212 pp. Englisch.