System on Package: Miniaturization of the Entire System - Rilegato

Tummala, Rao

 
9780071459068: System on Package: Miniaturization of the Entire System
Rilegato
ISBN 10: 0071459065 ISBN 13: 9780071459068
Casa editrice: McGraw Hill, 2008

Sinossi

System-on-Package (SOP) is an emerging microelectronic technology that places an entire system on a single chip-size package. Where systems used to be bulky boxes housing hundreds of components, SOP saves interconnection time and heat generation by keep a full system with computing, communications, and consumer functions all in a single chip. Written by the Georgia Tech developers of the technology, this book explains the basic parameters, design functions, and manufacturing issues, showing electronic designers how this radical new packaging technology can be used to solve pressing electronics design challenges.

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Informazioni sull?autore

Rao Tummala is a Chair professor and Director of the Microsystems Packaging Center at the Georgia Institute of Technology. The author of Microelectronics Packaging Handbook, Volumes I, II, and III, the best-selling reference that defines the entire field, he is an electronics and materials engineer and an experienced designer of microelectronics. He was a longtime packaging technologist and IBM Fellow at IBM.

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Editore
McGraw Hill
Data di pubblicazione
2008
Lingua
Inglese
ISBN 10 
0071459065
ISBN 13 
9780071459068
Rilegatura
Copertina rigida
Numero edizione
1
Numero di pagine
785
Contatto del produttore
non disponibile
Persona responsabile
Ufficio Anagrafiche Messaggerie
0039 0245774342
ufficio.anagrafiche@meli.it

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