Da: ThriftBooks-Atlanta, AUSTELL, GA, U.S.A.
Hardcover. Condizione: Good. No Jacket. Pages can have notes/highlighting. Spine may show signs of wear. ~ ThriftBooks: Read More, Spend Less.
Da: Better World Books: West, Reno, NV, U.S.A.
Condizione: Good. Former library copy. Pages intact with minimal writing/highlighting. The binding may be loose and creased. Dust jackets/supplements are not included. Includes library markings. Stock photo provided. Product includes identifying sticker. Better World Books: Buy Books. Do Good.
Da: GreatBookPrices, Columbia, MD, U.S.A.
EUR 167,23
Quantità: Più di 20 disponibili
Aggiungi al carrelloCondizione: As New. Unread book in perfect condition.
Da: GreatBookPricesUK, Woodford Green, Regno Unito
EUR 176,90
Quantità: Più di 20 disponibili
Aggiungi al carrelloCondizione: As New. Unread book in perfect condition.
Da: GreatBookPricesUK, Woodford Green, Regno Unito
EUR 202,34
Quantità: Più di 20 disponibili
Aggiungi al carrelloCondizione: New.
EUR 166,05
Quantità: Più di 20 disponibili
Aggiungi al carrelloGebunden. Condizione: New. System-on-Package (SOP) is an emerging microelectronic technology that places an entire system on a single chip-size package. This book explains the basic parameters, design functions, and manufacturing issues, showing electronic designers how this packag.
Da: GreatBookPrices, Columbia, MD, U.S.A.
EUR 224,03
Quantità: Più di 20 disponibili
Aggiungi al carrelloCondizione: New.
EUR 230,74
Quantità: 2 disponibili
Aggiungi al carrelloBuch. Condizione: Neu. Neuware - System-on-Package (SOP) is an emerging microelectronic technology that places an entire system on a single chip-size package. Where 'systems' used to be bulky boxes housing hundreds of components, SOP saves interconnection time and heat generation by keep a full system with computing, communications, and consumer functions all in a single chip. Written by the Georgia Tech developers of the technology, this book explains the basic parameters, design functions, and manufacturing issues, showing electronic designers how this radical new packaging technology can be used to solve pressing electronics design challenges.