Titolo: Introduction to System-on-package Sop : Miniaturization of the Entire System
Editore: McGraw Hill
Data di pubblicazione: 2008
Lingua: Inglese
ISBN 10: 0071459065
ISBN 13: 9780071459068
Rilegatura: Rilegato
Condizione: As New

Descrizione articolo

Riassunto

System-on-Package (SOP) is an emerging microelectronic technology that places an entire system on a single chip-size package. Where systems used to be bulky boxes housing hundreds of components, SOP saves interconnection time and heat generation by keep a full system with computing, communications, and consumer functions all in a single chip. Written by the Georgia Tech developers of the technology, this book explains the basic parameters, design functions, and manufacturing issues, showing electronic designers how this radical new packaging technology can be used to solve pressing electronics design challenges.

Informazioni sull?autore

Rao Tummala is a Chair professor and Director of the Microsystems Packaging Center at the Georgia Institute of Technology. The author of Microelectronics Packaging Handbook, Volumes I, II, and III, the best-selling reference that defines the entire field, he is an electronics and materials engineer and an experienced designer of microelectronics. He was a longtime packaging technologist and IBM Fellow at IBM.

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