Avoiding Inelastic Strains in Solder Joint Interconnections of IC Devices - Brossura

Suhir, Ephraim

 
9780367635886: Avoiding Inelastic Strains in Solder Joint Interconnections of IC Devices
Brossura
ISBN 10: 0367635887 ISBN 13: 9780367635886
Casa editrice: CRC Press, 2024

Sinossi

Avoiding Inelastic Strains in Solder Joint Interconnections of IC Devices addresses analytical (mathematical) modeling approaches aimed at understanding the underlying physics and mechanics of the behavior and performance of solder materials and solder joint interconnections of IC devices. The emphasis is on design for reliability, including probabilistic predictions of the solder lifetime.

  • Describes how to use the developed methods of analytical predictive modeling to minimize thermal stresses and strains in solder joint of IC devices
  • Shows how to build the preprocessing models in finite-element analyses (FEA) by comparing the FEA and analytical data
  • Covers how to design the most effective test vehicles for testing solder joints
  • Details how to design and organize, in addition to or sometimes even instead of highly accelerated life tests (HALT), highly focused and highly cost-effective failure oriented accelerated testing (FOAT) to understand the physic of failure of solder joint interconnections
  • Outlines how to convert the low cycle fatigue conditions into elastic fatigue conditions and to assess the fatigue lifetime in such cases
  • Illustrates ways to replace time- and labor-consuming, expensive, and possibly misleading temperature cycling tests with simpler and physically meaningful accelerated tests

This book is aimed towards professionals in electronic and photonic packaging, electronic and optical materials, materials engineering, and mechanical design.

Le informazioni nella sezione "Riassunto" possono far riferimento a edizioni diverse di questo titolo.

Editore
CRC Press
Data di pubblicazione
2024
Lingua
Inglese
ISBN 10 
0367635887
ISBN 13 
9780367635886
Rilegatura
Copertina flessibile
Numero edizione
1
Numero di pagine
382
Contatto del produttore
Taylor and Francis, GPSR Taylor and Francis
gpsr@taylorandfrancis.com

Taylor & Francis Verlag GmbH, Kaufingerstraße 24
München
80331
Germania

Altre edizioni note dello stesso titolo

9781138624733: Avoiding Inelastic Strains in Solder Joint Interconnections of IC Devices

Edizione in evidenza

ISBN 10:  113862473X ISBN 13:  9781138624733
Casa editrice: CRC Press, 2021
Rilegato