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Electronics has become the largest industry, surpassing agriculture, auto, and heavy metal industries. It has become the industry of choice for a country to prosper, already having given rise to the phenomenal prosperity of Japan, Korea, Singapore, Hong Kong, and Ireland among others. At the current growth rate, total worldwide semiconductor sales will reach $300B by the year 2000. The key electronic technologies responsible for the growth of the industry include semiconductors, the packaging of semiconductors for systems use in auto, telecom, computer, consumer, aerospace, and medical industries, displays, magnetic, and optical storage as well as software and system technologies. There has been a paradigm shift, however, in these technologies, from mainframe and supercomputer applications at any cost, to consumer applications at approximately one-tenth the cost and size. Personal computers are a good example, going from $500IMIP when products were first introduced in 1981, to a projected $IIMIP within 10 years. Thin, light portable, user friendly and very low-cost are, therefore, the attributes of tomorrow's computing and communications systems. Electronic packaging is defined as interconnection, powering, cool ing, and protecting semiconductor chips for reliable systems. It is a key enabling technology achieving the requirements for reducing the size and cost at the system and product level.
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Recensione
`A most comprehensive book set, both well presented and well illustrated.'
IEEE Electrical Insulation Magazine, September/October 1997
Contenuti
Part I: Foreword. Preface. Conversion Factors. Summary Contents. 1. Microelectronics packaging: An overview. 2. Package wiring and terminals. 3. Package electrical design. 4. Heat transfer in electronic packages. 5. Package reliability. 6. Package manufacture. Glossary and Symbols. Authors' Biographies. Index. Part II: 7. Microelectronics packaging: An overview. 8. Chip-to-package interconnection. 9. Ceramic packaging. 10. Plastic packaging. 11. Polymers in packaging. 12. Thin-film packaging. 13. Package electrical testing. 14. Package sealing and encapsulation. Part III: 15. Microelectronics packaging: An overview. 16. Package-to-board interconnections. 17. Printed-wiring board packaging. 18. Coated-metal packaging. 19. Connector and cable packaging. 20. Packaging of optoelectronics with electronics.
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Microelectronics Packaging Handbook: Semiconductor Packaging (Volume 2)
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Condizione: Good. Volume 2. This is an ex-library book and may have the usual library/used-book markings inside.This book has hardback covers. In good all round condition. Please note the Image in this listing is a stock photo and may not match the covers of the actual item,1650grams, ISBN:9780412084416. Codice articolo 5582661
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Microelectronics Packaging Handbook, Part II: Semiconductor Packaging (Second Edition)
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ISBN 13: 9780412084416
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Hard cover. Condizione: Good. No jacket. Second edition. Part II only. Small dents along cover board edges. Cover corners are bumped and worn. Spine is slightly shaken, but binding is secure. Previous owner's name in ink on front endpaper, but pages themselves are clean and unmarked. Codice articolo 1148741
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Microelectronics Packaging Handbook, Part 2: Semiconductor Packaging
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Condizione: acceptable. A readable copy. All pages are intact, and the cover is intact. Dust jacket may be missing. Pages can include considerable highlighting markings writing but cannot obscure the text. May be an Ex-lib. copy and have standard library stamps and or stickers. May NOT include discs, or access code or other supplemental material. We ship Monday-Saturday and respond to inquiries within 24 hours. Codice articolo BXM.8DPG
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Microelectronics Packaging Handbook, Part 2: Semiconductor Packaging
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Springer-Verlag Publishing, 1997
ISBN 10: 0412084414
ISBN 13: 9780412084416
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Condizione: Good. 2. Good+; Hardcover; Former corporate library copy with company stamp to the right textblock edge, inside each cover, and to the first and last endpapers; Covers are clean and glossy; Text pages are clean and unmarked; The binding is excellent with a straight spine; This book will be shipped in a sturdy cardboard box with foam padding; Medium Format (8.5" - 9.75" tall); Purple and orange covers with title in white and yellow lettering; 2nd Edition; 1997, Springer-Verlag Publishing; 1030 pages; "Microelectronics Packaging Handbook, Part 2: Semiconductor Packaging," by R.R. Tummala, et al. Codice articolo SKU-0475AF02103032
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Microelectronics Packaging Handbook, Part 2: Semiconductor Packaging
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Microelectronics Packaging Handbook
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Bundle. Condizione: New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. Electronics has become the largest industry, surpassing agriculture, auto, and heavy metal industries. It has become the industry of choice for a country to prosper, already having given rise to the phenomenal prosperity of Japan, Korea, Singapore, Hong Kon. Codice articolo 5914106
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Microelectronics Packaging Handbook, Part 2: Semiconductor Packaging
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Microelectronics Packaging Handbook
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Buch. Condizione: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -Electronics has become the largest industry, surpassing agriculture, auto, and heavy metal industries. It has become the industry of choice for a country to prosper, already having given rise to the phenomenal prosperity of Japan, Korea, Singapore, Hong Kong, and Ireland among others. At the current growth rate, total worldwide semiconductor sales will reach $300B by the year 2000. The key electronic technologies responsible for the growth of the industry include semiconductors, the packaging of semiconductors for systems use in auto, telecom, computer, consumer, aerospace, and medical industries, displays, magnetic, and optical storage as well as software and system technologies. There has been a paradigm shift, however, in these technologies, from mainframe and supercomputer applications at any cost, to consumer applications at approximately one-tenth the cost and size. Personal computers are a good example, going from $500IMIP when products were first introduced in 1981, to a projected $IIMIP within 10 years. Thin, light portable, user friendly and very low-cost are, therefore, the attributes of tomorrow's computing and communications systems. Electronic packaging is defined as interconnection, powering, cool ing, and protecting semiconductor chips for reliable systems. It is a key enabling technology achieving the requirements for reducing the size and cost at the system and product level. 1072 pp. Englisch. Codice articolo 9780412084416
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Microelectronics Packaging Handbook
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Springer US, Springer New York Jan 1997, 1997
ISBN 10: 0412084414
ISBN 13: 9780412084416
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Buch. Condizione: Neu. Neuware -Electronics has become the largest industry, surpassing agriculture, auto, and heavy metal industries. It has become the industry of choice for a country to prosper, already having given rise to the phenomenal prosperity of Japan, Korea, Singapore, Hong Kong, and Ireland among others. At the current growth rate, total worldwide semiconductor sales will reach $300B by the year 2000. The key electronic technologies responsible for the growth of the industry include semiconductors, the packaging of semiconductors for systems use in auto, telecom, computer, consumer, aerospace, and medical industries, displays, magnetic, and optical storage as well as software and system technologies. There has been a paradigm shift, however, in these technologies, from mainframe and supercomputer applications at any cost, to consumer applications at approximately one-tenth the cost and size. Personal computers are a good example, going from $500IMIP when products were first introduced in 1981, to a projected $IIMIP within 10 years. Thin, light portable, user friendly and very low-cost are, therefore, the attributes of tomorrow's computing and communications systems. Electronic packaging is defined as interconnection, powering, cool ing, and protecting semiconductor chips for reliable systems. It is a key enabling technology achieving the requirements for reducing the size and cost at the system and product level.Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg 1072 pp. Englisch. Codice articolo 9780412084416
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Microelectronics Packaging Handbook : Semiconductor Packaging
Editore:
Springer US, Springer New York, 1997
ISBN 10: 0412084414
ISBN 13: 9780412084416
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Da: AHA-BUCH GmbH, Einbeck, Germania
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Buch. Condizione: Neu. Druck auf Anfrage Neuware - Printed after ordering - Electronics has become the largest industry, surpassing agriculture, auto, and heavy metal industries. It has become the industry of choice for a country to prosper, already having given rise to the phenomenal prosperity of Japan, Korea, Singapore, Hong Kong, and Ireland among others. At the current growth rate, total worldwide semiconductor sales will reach $300B by the year 2000. The key electronic technologies responsible for the growth of the industry include semiconductors, the packaging of semiconductors for systems use in auto, telecom, computer, consumer, aerospace, and medical industries, displays, magnetic, and optical storage as well as software and system technologies. There has been a paradigm shift, however, in these technologies, from mainframe and supercomputer applications at any cost, to consumer applications at approximately one-tenth the cost and size. Personal computers are a good example, going from $500IMIP when products were first introduced in 1981, to a projected $IIMIP within 10 years. Thin, light portable, user friendly and very low-cost are, therefore, the attributes of tomorrow's computing and communications systems. Electronic packaging is defined as interconnection, powering, cool ing, and protecting semiconductor chips for reliable systems. It is a key enabling technology achieving the requirements for reducing the size and cost at the system and product level. Codice articolo 9780412084416
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