Presents an up-to-date, pragmatic overview of packaging and interconnect technology from the perspective of workers in the field, as a reference for practicing engineers in both microelectronic packaging and in general electronic system design, or as a supplemental text at the advanced undergraduate or graduate level, assuming previous exposure to the fundamental engineering sciences (mechanics, electromagnetics, heat transfer, and materials science). It emphasizes the interaction and trade-offs required across the various disciplines in the realization of effective product designs. Annotation copyright Book News, Inc. Portland, Or.
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Book by Hannermann Robert J Kraus Allan D
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EUR 9,90 per la spedizione da Germania a Italia
Destinazione, tempi e costiDa: Buchpark, Trebbin, Germania
Condizione: Gut. Zustand: Gut | Seiten: 898 | Sprache: Englisch | Produktart: Bücher. Codice articolo 42672081/3
Quantità: 2 disponibili
Da: Phatpocket Limited, Waltham Abbey, HERTS, Regno Unito
Condizione: Good. Your purchase helps support Sri Lankan Children's Charity 'The Rainbow Centre'. Ex-library, so some stamps and wear, but in good overall condition. Our donations to The Rainbow Centre have helped provide an education and a safe haven to hundreds of children who live in appalling conditions. Codice articolo Z1-V-014-02199
Quantità: 1 disponibili