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Microelectronic Interconnections and Assembly: Proceedings of the NATO Advanced Research Workshop, Prague, Czech Republic, 18-21 May 1996: v. 54 - Rilegato
Sinossi
Contains 28 presentations and three abstracts from the May 1996 workshop, which was devoted to the technical aspects of advanced interconnections and micro-assembly, but also included papers on the education issues required to prepare students to work in these areas. Several papers predict the future directions of packaging and interconnection. Other papers discuss wire bonding and Tape Automated Bonding (TAB). In addition, the solder metallurgy as well as the production technology of flip chip interconnections are described. Multichip Module and thick-film hybrid substrate interconnections are also covered. Annotation c. by Book News, Inc., Portland, Or.
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Contenuti
Preface. 1. Packaging and Interconnection Trends - Present and Future. 2. Solder and Flip Chip Interconnections and Assembly. 3. Single Chip Interconnection and Qualification: Wire Bonding and TAB. 4. Multichip Module Interconnections and Assembly I. 5. Discussion with the Dean and Vice Chancellor of the Czech Technical University and People from the Czech and the Slovak ISHM Chapters. 6. Multichip Module Interconnections and Assembly II. 7. Thick Film Interconnections and Metallurgical Interactions I. 8. Thick Film Interconnections and Metallurgical Interactions II. Subject Index.
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Buch. Condizione: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -The Workshop is devoted to the technical aspects of advanced interconnections and microassembly and also includes papers on the education issues needed to prepare students for work in these areas. The future direction that such technologies may take is also dealt with. The basic issue is that the miniaturisation of electronic systems continues, and performance must continue to improve. The newest packages are often based on the selection of an appropriate interconnection method. Advances in chip-scale, chip-flip, and direct chip attachments are described. Although wire bonding currently dominates the market, the consensus is that flip chip interconnection will rapidly increase its market share. Tape automated bonding is also discussed, primarily for special applications. Solder metallurgy and flip chip production technology receive attention in several papers. Solderability, reliability and fatigue of the joints are modelled, and mechanical stresses resulting from temperature cycling are reported. Multichip module and thick-film hybrid substrate interconnections are reported in several papers. These include thick and thin film metals, as well as low temperature polymer inks. Several papers describe diffusion and other metallurgical interactions in thick film surfaces. 316 pp. Englisch. Codice articolo 9780792351399
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Buch. Condizione: Neu. Druck auf Anfrage Neuware - Printed after ordering - The Workshop is devoted to the technical aspects of advanced interconnections and microassembly and also includes papers on the education issues needed to prepare students for work in these areas. The future direction that such technologies may take is also dealt with. The basic issue is that the miniaturisation of electronic systems continues, and performance must continue to improve. The newest packages are often based on the selection of an appropriate interconnection method. Advances in chip-scale, chip-flip, and direct chip attachments are described. Although wire bonding currently dominates the market, the consensus is that flip chip interconnection will rapidly increase its market share. Tape automated bonding is also discussed, primarily for special applications. Solder metallurgy and flip chip production technology receive attention in several papers. Solderability, reliability and fatigue of the joints are modelled, and mechanical stresses resulting from temperature cycling are reported. Multichip module and thick-film hybrid substrate interconnections are reported in several papers. These include thick and thin film metals, as well as low temperature polymer inks. Several papers describe diffusion and other metallurgical interactions in thick film surfaces. Codice articolo 9780792351399
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Microelectronic Interconnections and Assembly: Proceedings of the NATO Advanced Research Workshop, Prague, Czech Republic, 18-21 May 1996
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Springer Netherlands|Springer, Berlin, 1998
ISBN 10: 0792351398
ISBN 13: 9780792351399
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