Reliability, Yield, and Stress Burn-In: A Unified Approach for Microelectronics Systems Manufacturing & Software Development - Rilegato
Sinossi
This text explains reliability issues in microelectronics systems manufacturing and software development with an emphasis on evolving manufacturing technology for the semiconductor industry. Since most microelectronics components have an infant mortality period of about one year under ordinary operating conditions, and many modern systems, such as PCs, are heavily used in the first few years, the reliability problem in the infant mortality period becomes extremely important. Burn-in is an accelerated screening procedure that eliminates infant mortalities early on in the shop before shipping out the products to the customers. This book should also help readers to analyze systems that exhibit high failure rate during a long infant mortality period. The text presents ways to systematically analyze burn-in policy at the component, sub-system, and system levels. Various statistical methods are addressed including parametric, nonparametric, and Bayesian approaches. Many case studies are introduced in combination with the developed theories. Included in the book is an introduction to software reliability. The book should help manufacturers and system designers to understand and to design a more reliable product given constraints specified by the users and designers. An understanding of the infant mortality period may solve many reliability problems, including those faced in the semiconductor industry and software industry.
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Contenuti
Preface. 1. Overview of Design, Manufacture, and Reliability. 2. Integrating Reliability into Microelectronics Manufacturing. 3. Basic Reliability Concept. 4. Yield and Modeling Yield. 5. Reliability Stress Tests. 6. Burn-In Performance, Cost, and Statistical Analysis. 7. Nonparametric Reliability Analysis. 8. Parametric Approaches to Decide Optimal System Burn-In Time. 9. Nonparametric Approach and Its Applications to Burn-In. 10. Nonparametric Bayesian Approach for Optimal Burn-In. 11. The Dirichlet Process for Reliability Analysis. 12. Software Reliability and Infant Mortality Period of the Bathtub Curve. Epilogue: Cost-Effective Design for Stress Burn-In. References. Appendices: A. Notation and Nomenclature. B. Failure Modes for Parts. C. Common Probability Distributions. D. Simulation for U-Shaped Hazard Rate Curves. E. Sample Programs. Index.
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Buch. Condizione: Neu. Reliability, Yield, and Stress Burn-In | A Unified Approach for Microelectronics Systems Manufacturing & Software Development | Way Kuo (u. a.) | Buch | xxvi | Englisch | 1998 | Springer US | EAN 9780792381075 | Verantwortliche Person für die EU: Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg, juergen[dot]hartmann[at]springer[dot]com | Anbieter: preigu Print on Demand. Codice articolo 102563076
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Buch. Condizione: Neu. This item is printed on demand - Print on Demand Titel. Neuware -The international market is very competitive for high-tech manufacturers to day. Achieving competitive quality and reliability for products requires leader ship from the top, good management practices, effective and efficient operation and maintenance systems, and use of appropriate up-to-date engineering de sign tools and methods. Furthermore, manufacturing yield and reliability are interrelated. Manufacturing yield depends on the number of defects found dur ing both the manufacturing process and the warranty period, which in turn determines the reliability. the production of microelectronics has evolved into Since the early 1970's, one of the world's largest manufacturing industries. As a result, an important agenda is the study of reliability issues in fabricating microelectronic products and consequently the systems that employ these products, particularly, the new generation of microelectronics. Such an agenda should include: ¿ the economic impact of employing the microelectronics fabricated by in dustry, ¿ a study of the relationship between reliability and yield, ¿ the progression toward miniaturization and higher reliability, and ¿ the correctness and complexity of new system designs, which include a very significant portion of software.Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg 428 pp. Englisch. Codice articolo 9780792381075
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Condizione: Sehr gut. Zustand: Sehr gut | Seiten: 428 | Sprache: Englisch | Produktart: Bücher | The international market is very competitive for high-tech manufacturers to day. Achieving competitive quality and reliability for products requires leader ship from the top, good management practices, effective and efficient operation and maintenance systems, and use of appropriate up-to-date engineering de sign tools and methods. Furthermore, manufacturing yield and reliability are interrelated. Manufacturing yield depends on the number of defects found dur ing both the manufacturing process and the warranty period, which in turn determines the reliability. the production of microelectronics has evolved into Since the early 1970's, one of the world's largest manufacturing industries. As a result, an important agenda is the study of reliability issues in fabricating microelectronic products and consequently the systems that employ these products, particularly, the new generation of microelectronics. Such an agenda should include: ¿ the economic impact of employing the microelectronics fabricated by in dustry, ¿ a study of the relationship between reliability and yield, ¿ the progression toward miniaturization and higher reliability, and ¿ the correctness and complexity of new system designs, which include a very significant portion of software. Codice articolo 1361243/202
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Buch. Condizione: Neu. Druck auf Anfrage Neuware - Printed after ordering - The international market is very competitive for high-tech manufacturers to day. Achieving competitive quality and reliability for products requires leader ship from the top, good management practices, effective and efficient operation and maintenance systems, and use of appropriate up-to-date engineering de sign tools and methods. Furthermore, manufacturing yield and reliability are interrelated. Manufacturing yield depends on the number of defects found dur ing both the manufacturing process and the warranty period, which in turn determines the reliability. the production of microelectronics has evolved into Since the early 1970's, one of the world's largest manufacturing industries. As a result, an important agenda is the study of reliability issues in fabricating microelectronic products and consequently the systems that employ these products, particularly, the new generation of microelectronics. Such an agenda should include: - the economic impact of employing the microelectronics fabricated by in dustry, - a study of the relationship between reliability and yield, - the progression toward miniaturization and higher reliability, and - the correctness and complexity of new system designs, which include a very significant portion of software. Codice articolo 9780792381075
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