Package Electrical Modeling, Thermal Modeling, and Processing for GaAs Wireless Applications: 2 - Rilegato

Monthei, Dean L.

Rilegato

ISBN 10: 0792383648 ISBN 13: 9780792383642

Casa editrice: Springer-Verlag GmbH, 1998

Riassunto

This volume reviews the practical aspects of electrical and thermal modelling of GaAs wireless applications, discussing analogue (microwave) packaging as opposed to digital packaging. It emphasizes low-cost industry-standard packages; however, the principles translate well to other categories of packages. The need for this book arises from the fact that low-cost packages have not been optimized for high-frequency use. With high-volume commercial wireless markets now expanding and cost reduction a primary concern, the interest in modelling as a significant cost-cutting tool is high. This text addresses this interest and need, providing a comprehensive approach to the state-of-the-art modeling and processing techniques that professional engineers are just beginning to utilize. Engineers and professionals in the field of wireless packaging should find this book interesting and of value to their work.

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Contenuti

Preface. I: High Frequency Issues. 1. Tutorial On Microwave Concepts. 2. The Smith Chart and S-Parameters. II: Electrical Modeling of Packages. 3. Equivalent Circuit Models. 4. Creating Models from Measurements. 5. Creating a Model Using EM Simulators. III: Thermal Modeling. 6. Basics of Thermal Analysis. 7. Quick Thermal Analysis. 8. Finite Element Analysis. 9. Computational Fluid Dynamics. 10. Transient Thermal. 11. Thermal Measurement. IV: Processing Issues with Packaging GaAs High Frequency Components. 12. Package Families for Wireless. 13. Optimizing Electrical Performance. 14. Production Process Issues. 15. Die Attach Issues. Appendix A. Electrical Conductivities of Packaging Materials. Appendix B. Dielectric Properties of Packaging Materials. Appendix C. Thermal Conductivities of Packaging Materials. Appendix D. Thermal Modeling Software and Information. Appendix E. Thermal Analysis Equipment and Materials. Appendix F. Electromagnetic Simulator Software. Appendix G. Electrical Probing Tools. Appendix H. Circuit Simulator Software. Index.

Product Description

Book by Monthei Dean L

Dettagli dell'edizione

• Editore: Springer-Verlag GmbH
• Data di pubblicazione: 1998
• Lingua: Inglese
• ISBN 10: 0792383648
• ISBN 13: 9780792383642
• Rilegatura: Copertina rigida
• Numero di pagine: 252
• Contatto del produttore: ProductSafety@springernature.com; ProductSafety@springernature.com; ; Poststr. 9; Darmstadt; 64293; Germania