9780792383642 - package electrical modeling, thermal modeling, and processing for gaas wireless applications: 2 di monthei, dean l. (18 risultati)
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Da: Mike's Library LLC, Plymouth, PA, U.S.A.Mike's Library LLC
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EUR 62,47
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Hardcover. Condizione: Very Good. No Dust Jacket. Library stamps/marks/labels/pocket, otherwise light wear. Solid hardcover.; "Package Electrical Modeling, Thermal Modeling, and Processing for GaAs Wireless Applications reviews the practical aspects of electrical and thermal modeling of packages and has no equivalent on the mark…et, since it discusses analog (microwave) packaging as opposed to digital packaging. This book emphasizes low-cost industry-standard packages; however, the principles translate well to other categories of packages. The need for this book arises from the fact that low-cost packages have not been optimized for high-frequency use. With high-volume commercial wireless markets now expanding and cost reduction a primary concern, the interest in modeling as a significant cost-cutting tool is high. Package Electrical Modeling, Thermal Modeling, and Processing for GaAs Wireless Applications addresses this interest and need, providing a comprehensive approach to the state-of-the-art modeling and processing techniques that professional engineers are just beginning to utilize. Engineers and professionals in the field of wireless packaging will find this book interesting and of great value to their work."; Electronic Packaging And Interconnects, 2; Ex-Library; 248 pages.
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Da: GreatBookPrices, Columbia, MD, U.S.A.GreatBookPrices
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EUR 120,45
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Condizione: As New. Unread book in perfect condition.
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Da: Ria Christie Collections, Uxbridge, Regno UnitoRia Christie Collections
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EUR 116,65
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Condizione: New. In.
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Da: GreatBookPricesUK, Woodford Green, Regno UnitoGreatBookPricesUK
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EUR 116,64
EUR 17,54 spedizioneSpedito da Regno Unito a U.S.A.Quantità: Più di 20 disponibili
Condizione: New.
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Da: GreatBookPrices, Columbia, MD, U.S.A.GreatBookPrices
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EUR 131,05
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Condizione: New.
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Da: GreatBookPricesUK, Woodford Green, Regno UnitoGreatBookPricesUK
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EUR 127,23
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Condizione: As New. Unread book in perfect condition.
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Da: Kennys Bookshop and Art Galleries Ltd., Galway, GY, IrlandaKennys Bookshop and Art Galleries Ltd.
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EUR 134,02
EUR 9,50 spedizioneSpedito da Irlanda a U.S.A.Quantità: 15 disponibili
Condizione: New. Reviews the practical aspects of electrical and thermal modeling of packages. This book emphasizes low-cost industry-standard packages. It is suitable for engineers and professionals in the field of wireless packaging. Series: Electronic Packaging and Interconnects. Num Pages: 234 pages, 62 black & white illustr…ations, biography. BIC Classification: TJFN. Category: (P) Professional & Vocational; (UP) Postgraduate, Research & Scholarly; (UU) Undergraduate. Dimension: 234 x 156 x 15. Weight in Grams: 1170. . 1998. Hardback. . . . .
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Da: Books Puddle, New York, NY, U.S.A.Books Puddle
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EUR 142,81
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Condizione: New. pp. 252.
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Da: Buchpark, Trebbin, GermaniaBuchpark
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EUR 58,17
EUR 105,00 spedizioneSpedito da Germania a U.S.A.Quantità: 2 disponibili
Condizione: Gut. Zustand: Gut | Sprache: Englisch | Produktart: Bücher | This book discusses the practical aspects of electrical and thermal modeling of packages. In addition, processing concerns for plastic packaged GaAs parts are also covered. The book emphasizes low cost industry standard packages. However, the principles inv…olved translate well to other categories of packages. Digital issues such as crosstalk are well documented in other books and are therefore not covered in detail in this text. The principles for generation of equivalent circuit package models applies to both digital and analog parts. Digital designers and packaging engineers should still find this text useful. Subtleties often overlooked by standard methods of modeling packages for digital applications are considered and will become more important to the digital packaging engineer as frequencies continue to increase. It is hoped this book will be useful to both microwave and digital integrated circuit (Ie) designers as well as packaging engineers. In the past these disciplines were distinct. Packaging engineers typically were concerned with only materials and mechanical issues of the package. As long as there was an electrical connection made from the die to the external pin, packaging engineers had the freedom to do anything they wanted between these two points. At high frequency the issues change. Packaging engineers now have to work with die level designers to either create a package that performs well at high frequencies or to use readily available low cost packages that happen to meet the needs of the application.
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Da: Kennys Bookstore, Olney, MD, U.S.A.Kennys Bookstore
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EUR 167,82
EUR 9,10 spedizioneSpedito in U.S.A.Quantità: 15 disponibili
Condizione: New. Reviews the practical aspects of electrical and thermal modeling of packages. This book emphasizes low-cost industry-standard packages. It is suitable for engineers and professionals in the field of wireless packaging. Series: Electronic Packaging and Interconnects. Num Pages: 234 pages, 62 black & white illustr…ations, biography. BIC Classification: TJFN. Category: (P) Professional & Vocational; (UP) Postgraduate, Research & Scholarly; (UU) Undergraduate. Dimension: 234 x 156 x 15. Weight in Grams: 1170. . 1998. Hardback. . . . . Books ship from the US and Ireland.
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Da: AHA-BUCH GmbH, Einbeck, GermaniaAHA-BUCH GmbH
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EUR 114,36
EUR 62,74 spedizioneSpedito da Germania a U.S.A.Quantità: 1 disponibili
Buch. Condizione: Neu. Druck auf Anfrage Neuware - Printed after ordering - This book discusses the practical aspects of electrical and thermal modeling of packages. In addition, processing concerns for plastic packaged GaAs parts are also covered. The book emphasizes low cost industry standard packages. However, the principles…involved translate well to other categories of packages. Digital issues such as crosstalk are well documented in other books and are therefore not covered in detail in this text. The principles for generation of equivalent circuit package models applies to both digital and analog parts. Digital designers and packaging engineers should still find this text useful. Subtleties often overlooked by standard methods of modeling packages for digital applications are considered and will become more important to the digital packaging engineer as frequencies continue to increase. It is hoped this book will be useful to both microwave and digital integrated circuit (Ie) designers as well as packaging engineers. In the past these disciplines were distinct. Packaging engineers typically were concerned with only materials and mechanical issues of the package. As long as there was an electrical connection made from the die to the external pin, packaging engineers had the freedom to do anything they wanted between these two points. At high frequency the issues change. Packaging engineers now have to work with die level designers to either create a package that performs well at high frequencies or to use readily available low cost packages that happen to meet the needs of the application.
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Da: Basi6 International, Irving, TX, U.S.A.Basi6 International
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EUR 99,31
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Condizione: Brand New. New. US edition. Print on demand title. Delivery takes 20-25 days. Excellent Customer Service.
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Da: moluna, Greven, Germaniamoluna
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EUR 92,27
EUR 48,99 spedizioneSpedito da Germania a U.S.A.Quantità: Più di 20 disponibili
Gebunden. Condizione: New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. This book discusses the practical aspects of electrical and thermal modeling of packages. In addition, processing concerns for plastic packaged GaAs parts are also covered. The book emphasizes low cost indu…stry standard packages. However, the principles inv.
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Da: Majestic Books, Hounslow, Regno UnitoMajestic Books
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EUR 147,57
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Condizione: New. Print on Demand pp. 252 Illus.
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Da: Biblios, frankfurt am main, HESSE, GermaniaBiblios
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EUR 150,81
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Condizione: New. PRINT ON DEMAND pp. 252.
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Da: preigu, Osnabrück, Germaniapreigu
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EUR 95,70
EUR 70,00 spedizioneSpedito da Germania a U.S.A.Quantità: 5 disponibili
Buch. Condizione: Neu. Package Electrical Modeling, Thermal Modeling, and Processing for GaAs Wireless Applications | Dean L. Monthei | Buch | Einband - fest (Hardcover) | Englisch | 1998 | Springer US | EAN 9780792383642 | Verantwortliche Person für die EU: Springer Heidelberg, Tiergartenstr. 17, 69121 Heidelberg, buchhandel-bu…ch[at]springer[dot]com | Anbieter: preigu Print on Demand.
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Da: buchversandmimpf2000, Emtmannsberg, BAYE, Germaniabuchversandmimpf2000
Contatta il venditoreVenditore con 5 stelleCondizione: Nuovo
EUR 106,99
EUR 60,00 spedizioneSpedito da Germania a U.S.A.Quantità: 1 disponibili
Buch. Condizione: Neu. This item is printed on demand - Print on Demand Titel. Neuware -This book discusses the practical aspects of electrical and thermal modeling of packages. In addition, processing concerns for plastic packaged GaAs parts are also covered. The book emphasizes low cost industry standard packages. However, the… principles involved translate well to other categories of packages. Digital issues such as crosstalk are well documented in other books and are therefore not covered in detail in this text. The principles for generation of equivalent circuit package models applies to both digital and analog parts. Digital designers and packaging engineers should still find this text useful. Subtleties often overlooked by standard methods of modeling packages for digital applications are considered and will become more important to the digital packaging engineer as frequencies continue to increase. It is hoped this book will be useful to both microwave and digital integrated circuit (Ie) designers as well as packaging engineers. In the past these disciplines were distinct. Packaging engineers typically were concerned with only materials and mechanical issues of the package. As long as there was an electrical connection made from the die to the external pin, packaging engineers had the freedom to do anything they wanted between these two points. At high frequency the issues change. Packaging engineers now have to work with die level designers to either create a package that performs well at high frequencies or to use readily available low cost packages that happen to meet the needs of the application.Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg 252 pp. Englisch.
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Da: BuchWeltWeit Ludwig Meier e.K., Bergisch Gladbach, GermaniaBuchWeltWeit Ludwig Meier e.K.
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EUR 181,85
EUR 23,00 spedizioneSpedito da Germania a U.S.A.Quantità: 2 disponibili
Buch. Condizione: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -This book discusses the practical aspects of electrical and thermal modeling of packages. In addition, processing concerns for plastic packaged GaAs parts are also covered. The book emphasizes low cost industry standard packages. However,… the principles involved translate well to other categories of packages. Digital issues such as crosstalk are well documented in other books and are therefore not covered in detail in this text. The principles for generation of equivalent circuit package models applies to both digital and analog parts. Digital designers and packaging engineers should still find this text useful. Subtleties often overlooked by standard methods of modeling packages for digital applications are considered and will become more important to the digital packaging engineer as frequencies continue to increase. It is hoped this book will be useful to both microwave and digital integrated circuit (Ie) designers as well as packaging engineers. In the past these disciplines were distinct. Packaging engineers typically were concerned with only materials and mechanical issues of the package. As long as there was an electrical connection made from the die to the external pin, packaging engineers had the freedom to do anything they wanted between these two points. At high frequency the issues change. Packaging engineers now have to work with die level designers to either create a package that performs well at high frequencies or to use readily available low cost packages that happen to meet the needs of the application. 252 pp. Englisch.
