Modeling and Simulation of High Speed VLSI Interconnects brings together in one place important contributions and state-of-the-art research results in this rapidly advancing area.
Le informazioni nella sezione "Riassunto" possono far riferimento a edizioni diverse di questo titolo.
Guest Editors' Introduction; M.S. Nakhla, Q.J.Zhang. Efficient Transient Analysis of Nonlinearly Loaded Low-Loss Multiconductor Interconnects; I. Maio, S. Pignari, F. Canavero. A Simplified Synthesis of Transmission Lines with a Tree Structure; D. Zhou, S. Su, F. Tsui, D.S. Gao, J.S. Cong. An Interconnect Model for Arbitrary Terminations Based on Scattering Parameters; G.V. Devarayanadurg, M. Soma. Electromagnetic Analysis of Multiconductor Losses and Dispersion in High-Speed Interconnects; Ke Wu. Circuit Modelling of General Hybrid Uniform Waveguide Structures in Chiral Anisotropic Inhomogeneous Media; T. Dhaene, F. Olyslager, D. De Zutter. An Efficient, CAD-Oriented Model for the Characteristic Parameters of Multiconductor Buses in High-Speed Digital GaAs ICs; G. Ghione. Full-Wave Analysis of Radiation Effect of Microstrip Transmission Lines; Guangwen Pan, Jilin Tan. Optimizing VLSI Interconnect Model for SPICE Simulation; J. Poltz. Statistical Simulation and Optimization of High-Speed VLSI Interconnects; Qi-jun Zhang, M.S. Nakhla.
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Da: PsychoBabel & Skoob Books, Didcot, Regno Unito
Hardcover. Condizione: Good. Condizione sovraccoperta: No Dust Jacket. Hardcover without jacket. Minor dents on rear upper edge; leading corners are very slightly bent and worn. Spine head a little bumped. A few superficial scores elsewhere on boards. Previous owner's name inked on FEP. Small stain on rear pastedown, imprinted onto BEP. Pages remain sound and clean; text and diagrams clear throughout. Reprinted from a Special Issue of 'Analog Integrated Circuits and Signal Processing: An International Journal', Vol. 5, No. 1 (1994). TS. Used. Codice articolo 264019
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Da: Poverty Hill Books, Mt. Prospect, IL, U.S.A.
Hardcover. Condizione: New. HARDCOVER, BRAND NEW COPY, Perfect Shape, No Black Remainder Mark, 517-709Fast Shipping With Online Tracking, International Orders shipped Global Priority Air Mail, All orders handled with care and shipped promptly in secure packaging, we ship Mon-Sat and send shipment confirmation emails. Our customer service is friendly, we answer emails fast, accept returns and work hard to deliver 100% Customer Satisfaction! Codice articolo 0907260075
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Da: Ria Christie Collections, Uxbridge, Regno Unito
Condizione: New. In. Codice articolo ria9780792394419_new
Quantità: Più di 20 disponibili
Da: Kennys Bookshop and Art Galleries Ltd., Galway, GY, Irlanda
Condizione: New. Offers insight into some of the issues in the field of Modeling and Simulation of High Speed Vlsi Interconnects. Editor(s): Nakhla, Michel S.; Zhang, Q. J. Num Pages: 108 pages, biography. BIC Classification: TJFC; UY. Category: (P) Professional & Vocational; (UP) Postgraduate, Research & Scholarly; (UU) Undergraduate. Dimension: 279 x 210 x 7. Weight in Grams: 418. . 1994. Reprinted from ANALOG INTEGRATED CIRCUITS AND SIG. Hardback. . . . . Codice articolo V9780792394419
Quantità: 15 disponibili
Da: Books Puddle, New York, NY, U.S.A.
Condizione: New. pp. 112. Codice articolo 263099364
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Da: Majestic Books, Hounslow, Regno Unito
Condizione: New. Print on Demand pp. 112 68:B&W 7 x 10 in or 254 x 178 mm Case Laminate on White w/Gloss Lam. Codice articolo 5829947
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Da: Biblios, Frankfurt am main, HESSE, Germania
Condizione: New. PRINT ON DEMAND pp. 112. Codice articolo 183099374
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Da: BennettBooksLtd, Los Angeles, CA, U.S.A.
hardcover. Condizione: New. In shrink wrap. Looks like an interesting title! Codice articolo Q-0792394410
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Da: Kennys Bookstore, Olney, MD, U.S.A.
Condizione: New. Offers insight into some of the issues in the field of Modeling and Simulation of High Speed Vlsi Interconnects. Editor(s): Nakhla, Michel S.; Zhang, Q. J. Num Pages: 108 pages, biography. BIC Classification: TJFC; UY. Category: (P) Professional & Vocational; (UP) Postgraduate, Research & Scholarly; (UU) Undergraduate. Dimension: 279 x 210 x 7. Weight in Grams: 418. . 1994. Reprinted from ANALOG INTEGRATED CIRCUITS AND SIG. Hardback. . . . . Books ship from the US and Ireland. Codice articolo V9780792394419
Quantità: 15 disponibili
Da: moluna, Greven, Germania
Condizione: New. Modeling and Simulation of High Speed VLSI Interconnects brings together in one place important contributions and state-of-the-art research results in this rapidly advancing area. Modeling and Simulation of High Speed VLSI Interconnec. Codice articolo 5971489
Quantità: Più di 20 disponibili