This comprehensive book will provide both fundamental and applied aspects of adhesion pertaining to microelectronics in a single and easily accessible source. Among the topics to be covered include;
Le informazioni nella sezione "Riassunto" possono far riferimento a edizioni diverse di questo titolo.
Kashmiri Lal Mittal was employed by the IBM Corporation from 1972 through 1993. Currently, he is teaching and consulting worldwide in the broad areas of adhesion as well as surface cleaning. He has received numerous awards and honors including the title of doctor honoris causa from Maria Curie-Sk?odowska University, Lublin, Poland. He is the editor of more than 110 volumes dealing with adhesion measurement, adhesion of polymeric coatings, polymer surfaces, adhesive joints, adhesion promoters, thin films, polyimides, surface modification, surface cleaning, and surfactants. Dr. Mittal is also the Founding Editor of the journal Reviews of Adhesion and Adhesives.
Tanweer Ahsan is a scientist engineer at Henkel Electronic Materials LLC in Irvine, California.
Le informazioni nella sezione "Su questo libro" possono far riferimento a edizioni diverse di questo titolo.
Da: PBShop.store UK, Fairford, GLOS, Regno Unito
HRD. Condizione: New. New Book. Shipped from UK. Established seller since 2000. Codice articolo GB-9781118831335
Quantità: 2 disponibili
Da: GreatBookPrices, Columbia, MD, U.S.A.
Condizione: New. Codice articolo 20089168-n
Quantità: Più di 20 disponibili
Da: Grand Eagle Retail, Bensenville, IL, U.S.A.
Hardcover. Condizione: new. Hardcover. This comprehensive book will provide both fundamental and applied aspects of adhesion pertaining to microelectronics in a single and easily accessible source. Among the topics to be covered include; Various theories or mechanisms of adhesionSurface (physical or chemical) characterization of materials as it pertains to adhesionSurface cleaning as it pertains to adhesionWays to improve adhesionUnraveling of interfacial interactions using an array of pertinent techniquesCharacterization of interfaces / interphasesPolymer-polymer adhesionMetal-polymer adhesion (metallized polymers)Polymer adhesion to various substratesAdhesion of thin filmsAdhesion of underfillsAdhesion of molding compoundsAdhesion of different dielectric materialsDelamination and reliability issues in packaged devicesInterface mechanics and crack propagationAdhesion measurement of thin films and coatings This comprehensive book will provide both fundamental and applied aspects of adhesion pertaining to microelectronics in a single and easily accessible source. Shipping may be from multiple locations in the US or from the UK, depending on stock availability. Codice articolo 9781118831335
Quantità: 1 disponibili
Da: GreatBookPricesUK, Woodford Green, Regno Unito
Condizione: New. Codice articolo 20089168-n
Quantità: Più di 20 disponibili
Da: Ria Christie Collections, Uxbridge, Regno Unito
Condizione: New. In. Codice articolo ria9781118831335_new
Quantità: 2 disponibili
Da: Kennys Bookshop and Art Galleries Ltd., Galway, GY, Irlanda
Condizione: New. This comprehensive book will provide both fundamental and applied aspects of adhesion pertaining to microelectronics in a single and easily accessible source. Series: Adhesion and Adhesives: Fundamental and Applied Aspects. Num Pages: 368 pages, black & white illustrations, black & white line drawings, black & white tables, figures. BIC Classification: TDCB; TJF. Category: (P) Professional & Vocational. Dimension: 244 x 163 x 25. Weight in Grams: 636. . 2014. Hardback. . . . . Codice articolo V9781118831335
Quantità: 15 disponibili
Da: Ubiquity Trade, Miami, FL, U.S.A.
Condizione: New. Brand new! Please provide a physical shipping address. Codice articolo 9781118831335
Quantità: Più di 20 disponibili
Da: Rarewaves USA, HEBRON, KY, U.S.A.
Hardback. Condizione: New. This comprehensive book will provide both fundamental and applied aspects of adhesion pertaining to microelectronics in a single and easily accessible source. Among the topics to be covered include; Various theories or mechanisms of adhesionSurface (physical or chemical) characterization of materials as it pertains to adhesionSurface cleaning as it pertains to adhesionWays to improve adhesionUnraveling of interfacial interactions using an array of pertinent techniquesCharacterization of interfaces / interphasesPolymer-polymer adhesionMetal-polymer adhesion (metallized polymers)Polymer adhesion to various substratesAdhesion of thin filmsAdhesion of underfillsAdhesion of molding compoundsAdhesion of different dielectric materialsDelamination and reliability issues in packaged devicesInterface mechanics and crack propagationAdhesion measurement of thin films and coatings. Codice articolo LU-9781118831335
Quantità: 1 disponibili
Da: Rarewaves.com USA, London, LONDO, Regno Unito
Hardback. Condizione: New. This comprehensive book will provide both fundamental and applied aspects of adhesion pertaining to microelectronics in a single and easily accessible source. Among the topics to be covered include; Various theories or mechanisms of adhesionSurface (physical or chemical) characterization of materials as it pertains to adhesionSurface cleaning as it pertains to adhesionWays to improve adhesionUnraveling of interfacial interactions using an array of pertinent techniquesCharacterization of interfaces / interphasesPolymer-polymer adhesionMetal-polymer adhesion (metallized polymers)Polymer adhesion to various substratesAdhesion of thin filmsAdhesion of underfillsAdhesion of molding compoundsAdhesion of different dielectric materialsDelamination and reliability issues in packaged devicesInterface mechanics and crack propagationAdhesion measurement of thin films and coatings. Codice articolo LU-9781118831335
Quantità: 1 disponibili
Da: CitiRetail, Stevenage, Regno Unito
Hardcover. Condizione: new. Hardcover. This comprehensive book will provide both fundamental and applied aspects of adhesion pertaining to microelectronics in a single and easily accessible source. Among the topics to be covered include; Various theories or mechanisms of adhesionSurface (physical or chemical) characterization of materials as it pertains to adhesionSurface cleaning as it pertains to adhesionWays to improve adhesionUnraveling of interfacial interactions using an array of pertinent techniquesCharacterization of interfaces / interphasesPolymer-polymer adhesionMetal-polymer adhesion (metallized polymers)Polymer adhesion to various substratesAdhesion of thin filmsAdhesion of underfillsAdhesion of molding compoundsAdhesion of different dielectric materialsDelamination and reliability issues in packaged devicesInterface mechanics and crack propagationAdhesion measurement of thin films and coatings This comprehensive book will provide both fundamental and applied aspects of adhesion pertaining to microelectronics in a single and easily accessible source. Shipping may be from our UK warehouse or from our Australian or US warehouses, depending on stock availability. Codice articolo 9781118831335
Quantità: 1 disponibili