Modeling and Simulation of High Speed VLSI Interconnects: A Special Issue of Analog Integrated Circuits and Signal Processing an International Journal Vol. 5, No. 1 1994 - Brossura

Brossura

ISBN 10: 1461361710 ISBN 13: 9781461361718

Casa editrice: Springer, 2012

Riassunto

Modeling and Simulation of High Speed VLSI Interconnects brings together in one place important contributions and state-of-the-art research results in this rapidly advancing area. Modeling and Simulation of High Speed VLSI Interconnects serves as an excel

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Contenuti

Guest Editors' Introduction; M.S. Nakhla, Q.J.Zhang. Efficient Transient Analysis of Nonlinearly Loaded Low-Loss Multiconductor Interconnects; I. Maio, S. Pignari, F. Canavero. A Simplified Synthesis of Transmission Lines with a Tree Structure; D. Zhou, S. Su, F. Tsui, D.S. Gao, J.S. Cong. An Interconnect Model for Arbitrary Terminations Based on Scattering Parameters; G.V. Devarayanadurg, M. Soma. Electromagnetic Analysis of Multiconductor Losses and Dispersion in High-Speed Interconnects; Ke Wu. Circuit Modelling of General Hybrid Uniform Waveguide Structures in Chiral Anisotropic Inhomogeneous Media; T. Dhaene, F. Olyslager, D. De Zutter. An Efficient, CAD-Oriented Model for the Characteristic Parameters of Multiconductor Buses in High-Speed Digital GaAs ICs; G. Ghione. Full-Wave Analysis of Radiation Effect of Microstrip Transmission Lines; Guangwen Pan, Jilin Tan. Optimizing VLSI Interconnect Model for SPICE Simulation; J. Poltz. Statistical Simulation and Optimization of High-Speed VLSI Interconnects; Qi-jun Zhang, M.S. Nakhla.

Product Description

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Dettagli dell?edizione

• Editore: Springer
• Data di pubblicazione: 2012
• ISBN 10: 1461361710
• ISBN 13: 9781461361718
• Rilegatura: Copertina flessibile
• Lingua: Inglese
• Numero di pagine: 112
• Redattore: Nakhla Michel S.
• Contatto del produttore: non disponibile