Articoli correlati a Microscale Heat Conduction in Integrated Circuits and...
Sinossi
Advances in the semiconductor technology have enabled steady, exponential im provement in the performance of integrated circuits. Miniaturization allows the integration of a larger number of transistors with enhanced switching speed. Novel transistor structures and passivation materials diminish circuit delay by minimizing parasitic electrical capacitance. These advances, however, pose several challenges for the thermal engineering of integrated circuits. The low thermal conductivities of passivation layers result in large temperature rises and temperature gradient magni tudes, which degrade electrical characteristics of transistors and reduce lifetimes of interconnects. As dimensions of transistors and interconnects decrease, the result ing changes in current density and thermal capacitance make these elements more susceptible to failure during brief electrical overstress. This work develops a set of high-resolution measurement techniques which de termine temperature fields in transistors and interconnects, as well as the thermal properties of their constituent films. At the heart of these techniques is the thermore flectance thermometry method, which is based on the temperature dependence of the reflectance of metals. Spatial resolution near 300 nm and temporal resolution near IOns are demonstrated by capturing transient temperature distributions in intercon nects and silicon-on-insulator (SOl) high-voltage transistors. Analyses of transient temperature data obtained from interconnect structures yield thermal conductivities and volumetric heat capacities of thin films.
Le informazioni nella sezione "Riassunto" possono far riferimento a edizioni diverse di questo titolo.
Contenuti
Preface. Foreword. Acknowledgements. Nomenclature. 1. Introduction. 2. Review of Microscale Thermometry Techniques. 3. High Spatial and Temporal Resolution Thermometry. 4. Thermal Properties of Amorphous Dielectric Films. 5. Heat Conduction in Crystalline Silicon Films. 6. Summary and Recommendations. Bibliography. A. Uncertainty Analysis.
Product Description
Book by Sungtaek Ju Y Goodson Kenneth E
Le informazioni nella sezione "Su questo libro" possono far riferimento a edizioni diverse di questo titolo.
Altre edizioni note dello stesso titolo
Risultati della ricerca per Microscale Heat Conduction in Integrated Circuits and...
Immagini fornite dal venditore
Microscale Heat Conduction in Integrated Circuits and Their Constituent Films
Print on DemandDa: BuchWeltWeit Ludwig Meier e.K., Bergisch Gladbach, Germania
Valutazione del venditore 5 su 5 stelle
Taschenbuch. Condizione: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -Advances in the semiconductor technology have enabled steady, exponential im provement in the performance of integrated circuits. Miniaturization allows the integration of a larger number of transistors with enhanced switching speed. Novel transistor structures and passivation materials diminish circuit delay by minimizing parasitic electrical capacitance. These advances, however, pose several challenges for the thermal engineering of integrated circuits. The low thermal conductivities of passivation layers result in large temperature rises and temperature gradient magni tudes, which degrade electrical characteristics of transistors and reduce lifetimes of interconnects. As dimensions of transistors and interconnects decrease, the result ing changes in current density and thermal capacitance make these elements more susceptible to failure during brief electrical overstress. This work develops a set of high-resolution measurement techniques which de termine temperature fields in transistors and interconnects, as well as the thermal properties of their constituent films. At the heart of these techniques is the thermore flectance thermometry method, which is based on the temperature dependence of the reflectance of metals. Spatial resolution near 300 nm and temporal resolution near IOns are demonstrated by capturing transient temperature distributions in intercon nects and silicon-on-insulator (SOl) high-voltage transistors. Analyses of transient temperature data obtained from interconnect structures yield thermal conductivities and volumetric heat capacities of thin films. 128 pp. Englisch. Codice articolo 9781461373742
Compra nuovo
EUR 53,49
Spedizione EUR 23,00
Spedito da Germania a U.S.A.
Spedito da Germania a U.S.A.
Quantità: 2 disponibili
Foto dell'editore
Microscale Heat Conduction in Integrated Circuits and Their Constituent Films (eng)
Print on DemandDa: Brook Bookstore On Demand, Napoli, NA, Italia
Valutazione del venditore 5 su 5 stelle
Condizione: new. Questo è un articolo print on demand. Codice articolo 7JWVDF6CMN
Compra nuovo
EUR 86,24
Spedizione EUR 4,00
Spedito da Italia a U.S.A.
Spedito da Italia a U.S.A.
Quantità: Più di 20 disponibili
Foto dell'editore
Microscale Heat Conduction in Integrated Circuits
Da: Basi6 International, Irving, TX, U.S.A.
Valutazione del venditore 5 su 5 stelle
Condizione: Brand New. New. Delivery takes 25-30 days. Excellent Customer Service. Codice articolo POD-66009
Compra nuovo
EUR 98,48
Spedizione gratuita
Spedito in U.S.A.
Spedito in U.S.A.
Quantità: 10 disponibili
Immagini fornite dal venditore
Microscale Heat Conduction in Integrated Circuits and Their Constituent Films
Da: AHA-BUCH GmbH, Einbeck, Germania
Valutazione del venditore 5 su 5 stelle
Taschenbuch. Condizione: Neu. Druck auf Anfrage Neuware - Printed after ordering - Advances in the semiconductor technology have enabled steady, exponential im provement in the performance of integrated circuits. Miniaturization allows the integration of a larger number of transistors with enhanced switching speed. Novel transistor structures and passivation materials diminish circuit delay by minimizing parasitic electrical capacitance. These advances, however, pose several challenges for the thermal engineering of integrated circuits. The low thermal conductivities of passivation layers result in large temperature rises and temperature gradient magni tudes, which degrade electrical characteristics of transistors and reduce lifetimes of interconnects. As dimensions of transistors and interconnects decrease, the result ing changes in current density and thermal capacitance make these elements more susceptible to failure during brief electrical overstress. This work develops a set of high-resolution measurement techniques which de termine temperature fields in transistors and interconnects, as well as the thermal properties of their constituent films. At the heart of these techniques is the thermore flectance thermometry method, which is based on the temperature dependence of the reflectance of metals. Spatial resolution near 300 nm and temporal resolution near IOns are demonstrated by capturing transient temperature distributions in intercon nects and silicon-on-insulator (SOl) high-voltage transistors. Analyses of transient temperature data obtained from interconnect structures yield thermal conductivities and volumetric heat capacities of thin films. Codice articolo 9781461373742
Compra nuovo
EUR 58,39
Spedizione EUR 61,04
Spedito da Germania a U.S.A.
Spedito da Germania a U.S.A.
Quantità: 1 disponibili
Immagini fornite dal venditore
Microscale Heat Conduction in Integrated Circuits and Their Constituent Films
Da: preigu, Osnabrück, Germania
Valutazione del venditore 5 su 5 stelle
Taschenbuch. Condizione: Neu. Microscale Heat Conduction in Integrated Circuits and Their Constituent Films | Y. Sungtaek Ju (u. a.) | Taschenbuch | Microsystems | xxi | Englisch | 2012 | Springer | EAN 9781461373742 | Verantwortliche Person für die EU: Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg, juergen[dot]hartmann[at]springer[dot]com | Anbieter: preigu. Codice articolo 105997405
Compra nuovo
EUR 50,40
Spedizione EUR 70,00
Spedito da Germania a U.S.A.
Spedito da Germania a U.S.A.
Quantità: 5 disponibili
Foto dell'editore
Microscale Heat Conduction in Integrated Circuits and Their Constituent Films (Microsystems, 6)
Da: Ria Christie Collections, Uxbridge, Regno Unito
Valutazione del venditore 5 su 5 stelle
Condizione: New. In. Codice articolo ria9781461373742_new
Compra nuovo
EUR 114,72
Spedizione EUR 13,98
Spedito da Regno Unito a U.S.A.
Spedito da Regno Unito a U.S.A.
Quantità: Più di 20 disponibili
Immagini fornite dal venditore
Microscale Heat Conduction in Integrated Circuits and Their Constituent Films
Print on DemandDa: moluna, Greven, Germania
Valutazione del venditore 5 su 5 stelle
Condizione: New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. Preface. Foreword. Acknowledgements. Nomenclature. 1. Introduction. 2. Review of Microscale Thermometry Techniques. 3. High Spatial and Temporal Resolution Thermometry. 4. Thermal Properties of Amorphous Dielectric Films. 5. Heat Conduction in Crystalli. Codice articolo 4195515
Compra nuovo
EUR 92,27
Spedizione EUR 48,99
Spedito da Germania a U.S.A.
Spedito da Germania a U.S.A.
Quantità: Più di 20 disponibili
Immagini fornite dal venditore
Microscale Heat Conduction in Integrated Circuits and Their Constituent Films
Editore:
Springer, Springer Nov 2012, 2012
ISBN 10: 1461373743
ISBN 13: 9781461373742
Nuovo
Taschenbuch
Da: buchversandmimpf2000, Emtmannsberg, BAYE, Germania
Valutazione del venditore 5 su 5 stelle
Taschenbuch. Condizione: Neu. This item is printed on demand - Print on Demand Titel. Neuware -1 Introduction.- 1.1 Thermal Issues in Integrated Circuit Elements.- 1.2 Scope of Research.- 1.3 Book Overview.- 2 Review of Microscale Thermometry Techniques.- 2.1 Electrical Methods.- 2.2 Optical Methods.- 3 High Spatial and Temporal Resolution Thermometry.- 3.1 Thermoreflectance Thermometry Technique.- 3.2 Thermal Characterization of Silicon-on-Insulator High-Voltage Transistors.- 3.3 Thermal Characterization of Interconnects.- 4 Thermal Properties of Amorphous Dielectric Films.- 4.1 Thermal Characterization Techniques for Dielectric Films.- 4.2 Heat Transport in Amorphous Silicon Dioxide.- 5 Heat Conduction in Crystalline Silicon Films.- 5.1 Phonon Dispersion and its Implication on the Estimation of the Phonon Mean Free Path.- 5.2 Measurements of In-Plane Thermal Conductivities of Silicon Films.- 5.3 Heat Conduction in Semiconductors at High Temperatures.- 5.4 Prediction of the In-Plane Thermal Conductivity of Silicon Thin Films.- 5.5 Simplified Phonon Transport Equations Accounting for Phonon Dispersion.- 5.6 Hot Phonon Effects.- 6 Summary and Recommendations.- 6.1 Atomistic Simulations of Heat Transport.- 6.2 Thermal Conductivities of Nanostructures.- 6.3 Detailed Simulations of Semiconductor Device.- A Uncertainty Analysis.- A.1 Uncertainly in the Temperature Rise.- A.2 Uncertainly in the Thermal Properties of Dielectric Films.- A.3 Uncertainly in the In-Plane Thermal Conductivity of Thin Films.Springer-Verlag KG, Sachsenplatz 4-6, 1201 Wien 128 pp. Englisch. Codice articolo 9781461373742
Compra nuovo
EUR 106,99
Spedizione EUR 60,00
Spedito da Germania a U.S.A.
Spedito da Germania a U.S.A.
Quantità: 1 disponibili