RF and Microwave Microelectronics Packaging - Brossura

 
9781489983244: RF and Microwave Microelectronics Packaging
Brossura
ISBN 10: 1489983244 ISBN 13: 9781489983244
Casa editrice: Springer, 2014

Sinossi

RF and Microwave Microelectronics Packaging presents the latest developments in packaging for high-frequency electronics. It will appeal to practicing engineers in the electronic packaging and high-frequency electronics fields and to academic researchers interested in understanding leading issues in the commercial sector. It covers the latest developments in thermal management, electrical/RF/thermal-mechanical designs and simulations, packaging and processing methods as well as other RF/MW packaging-related fields.

Le informazioni nella sezione "Riassunto" possono far riferimento a edizioni diverse di questo titolo.

Dalla quarta di copertina

RF and Microwave Microelectronics Packaging presents the latest developments in packaging for high-frequency electronics. It will appeal to practicing engineers in the electronic packaging and high-frequency electronics fields and to academic researchers interested in understanding leading issues in the commercial sector. It covers the latest developments in thermal management, electrical/RF/thermal-mechanical designs and simulations, packaging and processing methods as well as other RF/MW packaging-related fields.

Bringing together years of experience in the field, lead authors Ken Kuang, Franklin Kim and Sean Cahill have brought together leading engineers working in electronics to explore the most recent developments of microelectronic packaging. RF and Microwave Microelectronics Packaging also:

  • Presents methods and techniques used for measuring and testing of the electronic materials properties.
  • Engages in an in-depth discussion of ceramic materials for RF/MW packaging.
  • Offers numerical simulation methods and techniques used in analysis of electronic devices and materials.
  • Discusses thermal management issues for RF/MW packaging.
  • Creates a RF/Microwave Packaging Roadmap for Portable Devices.

Le informazioni nella sezione "Su questo libro" possono far riferimento a edizioni diverse di questo titolo.

Editore
Springer
Data di pubblicazione
2014
Lingua
Inglese
ISBN 10 
1489983244
ISBN 13 
9781489983244
Rilegatura
Copertina flessibile
Numero di pagine
304
Redattore
Kuang Ken, Kim Franklin, Cahill Sean S.
Contatto del produttore
non disponibile
Persona responsabile
CMN Printpool Inh. Mathis Neumann
https://www.also.com/ec/cms5/en_6000/6000/index.jsp

Friedrich-Karl-Str. 9
Hamburg
Germania

Altre edizioni note dello stesso titolo

9781441909831: RF and Microwave Microelectronics Packaging

Edizione in evidenza

ISBN 10:  1441909834 ISBN 13:  9781441909831
Casa editrice: Springer Verlag, 2009
Rilegato