Materials, Processes, Integration and Reliability in Advanced Interconnects for Micro- and Nanoelectronics: Volume 990: Symposium Held April 10–12, 2007, San Francisco, California, U.S.A. - Rilegato

Rilegato

ISBN 10: 1558999507 ISBN 13: 9781558999503

Casa editrice: Cambridge University Press, 2007

Riassunto

The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners.

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Descrizione del libro

This book provides a forum to exchange advances in materials, processes, integration, and reliability in advanced interconnects and packaging. The book also addresses interconnects for emerging technologies, including 3D chip stacking and optical interconnects, as well as interconnects for optoelectronics, plastic electronics and molecular electronics.

Dettagli dell?edizione

• Editore: Cambridge University Press
• Data di pubblicazione: 2007
• Lingua: Inglese
• ISBN 10: 1558999507
• ISBN 13: 9781558999503
• Rilegatura: Copertina rigida
• Numero di pagine: 360
• Redattore: Lin Qinghuang, Ryan E. Todd, Wu Wen-li, Yoon Do Yeung
• Contatto del produttore: non disponibile
• Persona responsabile: Avery; https://www.avery.fr/; ; chemin des peupliers 27; Dardilly; Francia