First introduced about a decade ago, the first edition of the Handbook of Semiconductor Interconnection Technology became widely popular for its thorough, integrated treatment of interconnect technologies and its forward-looking perspective. The field has grown tremendously in the interim and many of the "likely directions" outlined in the first edition are now standard in modern facilities. Reflecting those advances, this edition delves into the practical aspects of interconnections for manufacturing. It examines the interconnect and fabrication technologies now available, with an examination of future prospects for the field.
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Geraldine C. Schwartz, Geraldine Cogin Shwartz, Kris V. Srikrishnan
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Da: Basi6 International, Irving, TX, U.S.A.
Condizione: Brand New. New.SoftCover International edition. Different ISBN and Cover image but contents are same as US edition.Expediting shipping for all USA and Europe orders excluding PO Box. Excellent Customer Service. Codice articolo ABEOCT25-362665
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Da: BennettBooksLtd, Los Angeles, CA, U.S.A.
Hardcover. Condizione: New. In shrink wrap. Looks like an interesting title! Codice articolo Q-1574446746
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HRD. Condizione: New. New Book. Shipped from UK. Established seller since 2000. Codice articolo FT-9781574446746
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Da: Majestic Books, Hounslow, Regno Unito
Condizione: New. pp. 536 Illus. This item is printed on demand. Codice articolo 6343309
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Da: moluna, Greven, Germania
Condizione: New. Geraldine C. Schwartz, Geraldine Cogin Shwartz, Kris V. SrikrishnanFirst introduced about a decade ago, the first edition of the Handbook of Semiconductor Interconnection Technology became widely popular for its thorough, integrated . Codice articolo 904351919
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Da: Grand Eagle Retail, Bensenville, IL, U.S.A.
Hardcover. Condizione: new. Hardcover. First introduced about a decade ago, the first edition of the Handbook of Semiconductor Interconnection Technology became widely popular for its thorough, integrated treatment of interconnect technologies and its forward-looking perspective. The field has grown tremendously in the interim and many of the "likely directions" outlined in the first edition are now standard in modern facilities. Reflecting those advances, this edition delves into the practical aspects of interconnections for manufacturing. It examines the interconnect and fabrication technologies now available, with an examination of future prospects for the field.What's in this Edition: Detailed discussion of electrochemical equipment for plating copper Information on tools used for evaporation, chemical vapor deposition, and plasma processes Emphasis on measurement of mechanical and thermal properties of insulators Methods for characterizing porous dielectric thin films Greater focus on integration issues and properties of titanium, cobalt, and nickel silicides Process schemes based on the increased need for borderless contact gates and source/drain Expanded discussion on choices for low-dielectric insulators Concentration on electroplated copper, especially morphology of plated films and their properties Developments in thin film liners and barriers Expanded material on copper reliability Describes the equipment used in manufacturing for deposition and etching, such as electrochemical deposition equipment used for plating copper. This book emphasizes the measurement of mechanical and thermal properties as well as the use of EELS, energy filtering TEM, and atomic force microscopy. Shipping may be from multiple locations in the US or from the UK, depending on stock availability. Codice articolo 9781574446746
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