9781574446746 - handbook of semiconductor interconnection technology di shwartz, geraldine cogin (17 risultati)
Handbook of Semiconductor Interconnection Technology, 2nd Edition (Original Price £ 153.00)
Geraldine Cogin Shwartz, Geraldine C. Schwartz, Kris V. Srikrishnan
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- Edizione Internazionale
Da: Basi6 International, Irving, TX, U.S.A.Basi6 International
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EUR 82,60
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Condizione: Brand New. New.SoftCover International edition. Different ISBN and Cover image but contents are same as US edition.Expediting shipping for all USA and Europe orders excluding PO Box. Excellent Customer Service.
Handbook of Semiconductor Interconnection Technology
Shwartz, Geraldine Cogin; Schwartz, Geraldine C. [Editor]; Srikrishnan, Kris V. [Editor];
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Da: BennettBooksLtd, Los Angeles, CA, U.S.A.BennettBooksLtd
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Hardcover. Condizione: New. In shrink wrap. Looks like an interesting title.
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Da: PBShop.store UK, Fairford, GLOS, Regno UnitoPBShop.store UK
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HRD. Condizione: New. New Book. Shipped from UK. Established seller since 2000.
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Da: GreatBookPrices, Columbia, MD, U.S.A.GreatBookPrices
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Condizione: New.
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Da: GreatBookPricesUK, Woodford Green, Regno UnitoGreatBookPricesUK
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EUR 290,11
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Condizione: New.
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Da: GreatBookPrices, Columbia, MD, U.S.A.GreatBookPrices
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Condizione: As New. Unread book in perfect condition.
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Da: GreatBookPricesUK, Woodford Green, Regno UnitoGreatBookPricesUK
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EUR 315,26
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Condizione: As New. Unread book in perfect condition.
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Da: Grand Eagle Retail, Bensenville, IL, U.S.A.Grand Eagle Retail
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EUR 362,44
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Hardcover. Condizione: new. Hardcover. First introduced about a decade ago, the first edition of the Handbook of Semiconductor Interconnection Technology became widely popular for its thorough, integrated treatment of interconnect technologies and its forward-looking perspective. The field has grown tremendously in the interim a…nd many of the "likely directions" outlined in the first edition are now standard in modern facilities. Reflecting those advances, this edition delves into the practical aspects of interconnections for manufacturing. It examines the interconnect and fabrication technologies now available, with an examination of future prospects for the field.What's in this Edition: Detailed discussion of electrochemical equipment for plating copper Information on tools used for evaporation, chemical vapor deposition, and plasma processes Emphasis on measurement of mechanical and thermal properties of insulators Methods for characterizing porous dielectric thin films Greater focus on integration issues and properties of titanium, cobalt, and nickel silicides Process schemes based on the increased need for borderless contact gates and source/drain Expanded discussion on choices for low-dielectric insulators Concentration on electroplated copper, especially morphology of plated films and their properties Developments in thin film liners and barriers Expanded material on copper reliability Describes the equipment used in manufacturing for deposition and etching, such as electrochemical deposition equipment used for plating copper. This book emphasizes the measurement of mechanical and thermal properties as well as the use of EELS, energy filtering TEM, and atomic force microscopy. Shipping may be from multiple locations in the US or from the UK, depending on stock availability.
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Da: Books Puddle, New York, NY, U.S.A.Books Puddle
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EUR 361,10
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Condizione: New. pp. 536 2nd Edition.
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Da: moluna, Greven, Germaniamoluna
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EUR 313,20
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Condizione: New. Geraldine C. Schwartz, Geraldine Cogin Shwartz, Kris V. SrikrishnanFirst introduced about a decade ago, the first edition of the Handbook of Semiconductor Interconnection Technology became widely popular for its thorough, integrated .
Handbook of Semiconductor Interconnection Technology, Second Edition
Schwartz, Geraldine C. (Edited by)/ Srikrishnan, Kris V. (Edited by)
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Da: Revaluation Books, Exeter, Regno UnitoRevaluation Books
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EUR 367,85
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Hardcover. Condizione: Brand New. 2nd edition. 520 pages. 10.00x6.75x1.00 inches. In Stock.
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Da: Biblios, frankfurt am main, HESSE, GermaniaBiblios
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EUR 387,57
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Condizione: New. pp. 536.
Handbook of Semiconductor Interconnection Technology
Schwartz, Geraldine Cogin; Srikrishnan, Kris V.; Bross, Arthur. Ed(s): Schwartz, Geraldine Cogin; Srikrishnan, Kris V.
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Da: Kennys Bookshop and Art Galleries Ltd., Galway, GY, IrlandaKennys Bookshop and Art Galleries Ltd.
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EUR 403,73
EUR 9,50 spedizioneSpedito da Irlanda a U.S.A.Quantità: 10 disponibili
Condizione: New. Describes the equipment used in manufacturing for deposition and etching, such as electrochemical deposition equipment used for plating copper. This book emphasizes the measurement of mechanical and thermal properties as well as the use of EELS, energy filtering TEM, and atomic force microscopy. Editor(s): Schwa…rtz, Geraldine Cogin; Srikrishnan, Kris V. Num Pages: 536 pages, 227 black & white illustrations, 12 black & white tables, 1 black & white halftones. BIC Classification: TJFC. Category: (P) Professional & Vocational. Dimension: 254 x 178 x 30. Weight in Grams: 1133. . 2006. 2 Rev ed. Hardback. . . . .
Handbook of Semiconductor Interconnection Technology, Second Edition
Schwartz, Geraldine C. (Edited by)/ Srikrishnan, Kris V. (Edited by)
- Rilegato
Da: Revaluation Books, Exeter, Regno UnitoRevaluation Books
Contatta il venditoreVenditore con 5 stelleCondizione: Nuovo
EUR 455,81
EUR 17,45 spedizioneSpedito da Regno Unito a U.S.A.Quantità: 1 disponibili
Hardcover. Condizione: Brand New. 2nd edition. 520 pages. 10.00x6.75x1.00 inches. In Stock.
Handbook of Semiconductor Interconnection Technology
Schwartz, Geraldine Cogin; Srikrishnan, Kris V.; Bross, Arthur. Ed(s): Schwartz, Geraldine Cogin; Srikrishnan, Kris V.
- Rilegato
Da: Kennys Bookstore, Olney, MD, U.S.A.Kennys Bookstore
Contatta il venditoreVenditore con 5 stelleCondizione: Nuovo
EUR 496,05
EUR 9,03 spedizioneSpedito in U.S.A.Quantità: 10 disponibili
Condizione: New. Describes the equipment used in manufacturing for deposition and etching, such as electrochemical deposition equipment used for plating copper. This book emphasizes the measurement of mechanical and thermal properties as well as the use of EELS, energy filtering TEM, and atomic force microscopy. Editor(s): Schwa…rtz, Geraldine Cogin; Srikrishnan, Kris V. Num Pages: 536 pages, 227 black & white illustrations, 12 black & white tables, 1 black & white halftones. BIC Classification: TJFC. Category: (P) Professional & Vocational. Dimension: 254 x 178 x 30. Weight in Grams: 1133. . 2006. 2 Rev ed. Hardback. . . . . Books ship from the US and Ireland.
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Da: AussieBookSeller, Truganina, VIC, AustraliaAussieBookSeller
Contatta il venditoreVenditore con 5 stelleCondizione: Nuovo
EUR 573,86
EUR 31,82 spedizioneSpedito da Australia a U.S.A.Quantità: 1 disponibili
Hardcover. Condizione: new. Hardcover. First introduced about a decade ago, the first edition of the Handbook of Semiconductor Interconnection Technology became widely popular for its thorough, integrated treatment of interconnect technologies and its forward-looking perspective. The field has grown tremendously in the interim a…nd many of the "likely directions" outlined in the first edition are now standard in modern facilities. Reflecting those advances, this edition delves into the practical aspects of interconnections for manufacturing. It examines the interconnect and fabrication technologies now available, with an examination of future prospects for the field.What's in this Edition: Detailed discussion of electrochemical equipment for plating copper Information on tools used for evaporation, chemical vapor deposition, and plasma processes Emphasis on measurement of mechanical and thermal properties of insulators Methods for characterizing porous dielectric thin films Greater focus on integration issues and properties of titanium, cobalt, and nickel silicides Process schemes based on the increased need for borderless contact gates and source/drain Expanded discussion on choices for low-dielectric insulators Concentration on electroplated copper, especially morphology of plated films and their properties Developments in thin film liners and barriers Expanded material on copper reliability Describes the equipment used in manufacturing for deposition and etching, such as electrochemical deposition equipment used for plating copper. This book emphasizes the measurement of mechanical and thermal properties as well as the use of EELS, energy filtering TEM, and atomic force microscopy. Shipping may be from our Sydney, NSW warehouse or from our UK or US warehouse, depending on stock availability.
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- Print on Demand
Da: Majestic Books, Hounslow, Regno UnitoMajestic Books
Contatta il venditoreVenditore con 4 stelleCondizione: Nuovo
EUR 336,53
EUR 7,56 spedizioneSpedito da Regno Unito a U.S.A.Quantità: 3 disponibili
Condizione: New. pp. 536 Illus. This item is printed on demand.
