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摩尔时代电子封装建模分析设计与测试 Modeling,Analysis,Design and Tests for Electronics Packaging beyond Moore 电子封装书 - Rilegato
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Modeling. Analysis. Design and Tests for Electronics Packaging beyond Moore(Chinese Edition)
Da: liu xing, Nanjing, JS, Cina
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Hardcover. Condizione: New. HardCover.Pub Date:2021-03-01 Pages:420 Language:English Publisher:Chemical Industry Press This book systematically introduces the theoretical model. analysis and new simulation results of advanced packaging in the ultra-molecular era. The content involves the electrical properties. thermal properties. thermomechanical properties. heat dissipation issues. reliability issues. electrical crosstalk of 2.5D. 3D. wafer-level packaging. etc. A modeling method based on the volume average theory of p. Codice articolo NX046096
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