9787122379528 - 摩尔时代电子封装建模分析设计与测试 modeling,analysis,design and tests for electronics packaging beyond moore 电子封装书 (1 risultati)
- Rilegato
Da: liu xing, Nanjing, JS, Cinaliu xing
Contatta il venditoreVenditore con 5 stelleCondizione: Nuovo
EUR 361,53
EUR 15,53 spedizioneSpedito da Cina a U.S.A.Quantità: 1 disponibili
Hardcover. Condizione: New. HardCover.Pub Date:2021-03-01 Pages:420 Language:English Publisher:Chemical Industry Press This book systematically introduces the theoretical model. analysis and new simulation results of advanced packaging in the ultra-molecular era. The content involves the electrical properties. thermal properties…. thermomechanical properties. heat dissipation issues. reliability issues. electrical crosstalk of 2.5D. 3D. wafer-level packaging. etc. A modeling method based on the volume average theory of p.
