9787515921648 (1 risultati)
3D Integration Handbook Volume 3 Three-Dimensional Process Technology(Chinese Edition)
[ MEI ] FEI LI PU· JIA LUO ( Philip Garrou ) . [ RI ] XIAO LIU GUANG ZHENG ( Mitsumasa Koyanagi ) . [ DE ] BI DE· LA MU ( Peter Ramm ) . WU DAO WEI . WANG WEI . LIU JIAN JUN . YU HUAN DENG YI
Lingua: Inglese
- Rilegato
Da: liu xing, Nanjing, JS, Cinaliu xing
Contatta il venditoreVenditore con 5 stelleCondizione: Nuovo
EUR 143,47
EUR 15,74 spedizioneSpedito da Cina a U.S.A.Quantità: 3 disponibili
Hardcover. Condizione: New. HardCover.Pub Date:2022-10 Pages:369 Language:ChinesePublisher:China Aerospace PressSelf-operated3D Integration Handbook Volume 3 Three-Dimensional Process Technologyis divided into 22 chapters. namely: 3D IC integration since 2008. main applications and market trends of 3D integration and interposer…technology. economic drivers and barriers to 2.5D/3D integration. interposer technology. TSV manufacturing overview. TSV unit process and integration. TSV preparation of ASET. laser-assisted wafe.
