Chiplet Design and Heterogeneous Integration Packaging - Brossura

Lau, John H.

Brossura

ISBN 10: 981199918X ISBN 13: 9789811999185

Casa editrice: Springer, 2023

Riassunto

The book focuses on the design, materials, process, fabrication, and reliability of chiplet design and heterogeneous integraton packaging. Both principles and engineering practice have been addressed, with more weight placed on engineering practice. This is achieved by providing in-depth study on a number of major topics such as chip partitioning, chip splitting, multiple system and heterogeneous integration with TSV-interposers, multiple system and heterogeneous integration with TSV-less interposers, chiplets lateral communication, system-in-package, fan-out wafer/panel-level packaging, and various Cu-Cu hybrid bonding. The book can benefit researchers, engineers, and graduate students in fields of electrical engineering, mechanical engineering, materials sciences, and industry engineering, etc.

Dettagli dell'edizione

• Editore: Springer
• Data di pubblicazione: 2023
• Lingua: Inglese
• ISBN 10: 981199918X
• ISBN 13: 9789811999185
• Rilegatura: Copertina flessibile
• Numero di pagine: 548
• Contatto del produttore: non disponibile
• Persona responsabile: CMN Printpool Inh. Mathis Neumann; https://www.also.com/ec/cms5/en_6000/6000/index.jsp; ; Friedrich-Karl-Str. 9; Hamburg; Germania