Chiplet Design and Heterogeneous Integration Packaging - Brossura

Lau, John H.

 
9789811999192: Chiplet Design and Heterogeneous Integration Packaging
Brossura
ISBN 10: 9811999198 ISBN 13: 9789811999192
Casa editrice: Springer-Verlag GmbH, 2024

Sinossi

The book focuses on the design, materials, process, fabrication, and reliability of chiplet design and heterogeneous integraton packaging. Both principles and engineering practice have been addressed, with more weight placed on engineering practice. This is achieved by providing in-depth study on a number of major topics such as chip partitioning, chip splitting, multiple system and heterogeneous integration with TSV-interposers, multiple system and heterogeneous integration with TSV-less interposers, chiplets lateral communication, system-in-package, fan-out wafer/panel-level packaging, and various Cu-Cu hybrid bonding. The book can benefit researchers, engineers, and graduate students in fields of electrical engineering, mechanical engineering, materials sciences, and industry engineering, etc.

Le informazioni nella sezione "Riassunto" possono far riferimento a edizioni diverse di questo titolo.

Informazioni sull?autore

For Internal Use Only:


John H Lau, Ph.D., P.E., IEEE Fellow, ASME Fellow, IMAPS Fellow

Unimicron Technology Corporation, John_Lau@unimicron.com

 

SPECIALIZED PROFESSIONAL COMPETENCIES

[1] Design, analysis, materials, process, manufacturing, qualification, reliability, testing, and thermal management of electronic and optoelectronic components and systems. Fan-out/fan-in WLP, MEMS, LED, CIS, TSV, 3D IC integration, heterogeneous integration/SiP and SMT. Leadfree soldering, manufacturing, and solder joint reliability.

[2] Manage R&D teams to develop new and useful technologies for semiconductor advanced packaging.

[3] Provide recent advances and trends in advanced packaging to upper managements and guidance to young engineers and managers.

Over 22 books (all are the first author), 517 peer-reviewed papers (out of which 375 are principal investigator), 40 issued and pending US patents (out of which 25 are principal inventor), and 325 keynotes/lectures.

Dalla quarta di copertina

The book focuses on the design, materials, process, fabrication, and reliability of chiplet design and heterogeneous integraton packaging. Both principles and engineering practice have been addressed, with more weight placed on engineering practice. This is achieved by providing in-depth study on a number of major topics such as chip partitioning, chip splitting, multiple system and heterogeneous integration with TSV-interposers, multiple system and heterogeneous integration with TSV-less interposers, chiplets lateral communication, system-in-package, fan-out wafer/panel-level packaging, and various Cu-Cu hybrid bonding. The book can benefit researchers, engineers, and graduate students in fields of electrical engineering, mechanical engineering, materials sciences, and industry engineering, etc.

Le informazioni nella sezione "Su questo libro" possono far riferimento a edizioni diverse di questo titolo.

Editore
Springer-Verlag GmbH
Data di pubblicazione
2024
Lingua
Inglese
ISBN 10 
9811999198
ISBN 13 
9789811999192
Rilegatura
Copertina flessibile
Numero di pagine
548
Contatto del produttore
ProductSafety@springernature.com
ProductSafety@springernature.com

Poststr. 9
Darmstadt
64293
Germania

Altre edizioni note dello stesso titolo

9789811999161: Chiplet Design and Heterogeneous Integration Packaging

Edizione in evidenza

ISBN 10:  9811999163 ISBN 13:  9789811999161
Casa editrice: Springer Nature, 2023
Rilegato