Advanced Flip Chip Packaging. Questo articolo non è disponibile.
Lingua: inglese
Editore: Springer, 2016
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EUR 139,70
Descrizione dell’articolo da parte del venditore
Advanced Flip Chip Packaging | Ho-Ming Tong (u. a.) | Taschenbuch | vii | Englisch | 2016 | Springer | EAN 9781489979339 | Verantwortliche Person für die EU: Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg, juergen[dot]hartmann[at]springer[dot]com | Anbieter: preigu.
Codice articolo 109983155
- Titolo
- Advanced Flip Chip Packaging
- Autore
- Ho-Ming Tong (u. a.)
- Editore
- Springer
- Anno di pubblicazione
- 2016
- Condizione
- Neu
- Rilegatura
- Taschenbuch
- Lingua
- inglese
- ISBN 10
- 1489979336
- ISBN 13
- 9781489979339
- Peso dell'articolo
- 953 grammi
- Dimensioni
- 235 x 155 x 29 mm
- Cataloghi dei venditori
- Bücher
Advanced Flip Chip Packaging presents past, present and future advances and trends in areas such as substrate technology, material development, and assembly processes. Flip chip packaging is now in widespread use in computing, communications, consumer and automotive electronics, and the demand for flip chip technology is continuing to grow in order to meet the need for products that offer better performance, are smaller, and are environmentally sustainable.
"Riassunto" può appartenere a un’altra edizione di questo titolo.
Dalla quarta di copertina
Advanced Flip Chip Packaging presents past, present and future advances and trends in areas such as substrate technology, material development, and assembly processes. Flip chip packaging is now in widespread use in computing, communications, consumer and automotive electronics, and the demand for flip chip technology is continuing to grow in order to meet the need for products that offer better performance, are smaller, and are environmentally sustainable.
This book also:
- Offers broad-ranging chapters with a focus on IC-package-system integration
- Provides viewpoints from leading industry executives and experts
- Details state-of-the-art achievements in process technologies and scientific research
- Presents a clear development history and touches on trends in the industry while also discussing up-to-date technology information
Advanced Flip Chip Packaging is an ideal book for engineers, researchers, and graduate students interested in the field of flip chip packaging.
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