Advanced Flip Chip Packaging presents past, present and future advances and trends in areas such as substrate technology, material development, and assembly processes. Flip chip packaging is now in widespread use in computing, communications, consumer and automotive electronics, and the demand for flip chip technology is continuing to grow in order to meet the need for products that offer better performance, are smaller, and are environmentally sustainable.
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Advanced Flip Chip Packaging presents past, present and future advances and trends in areas such as substrate technology, material development, and assembly processes. Flip chip packaging is now in widespread use in computing, communications, consumer and automotive electronics, and the demand for flip chip technology is continuing to grow in order to meet the need for products that offer better performance, are smaller, and are environmentally sustainable.
This book also:
Advanced Flip Chip Packaging is an ideal book for engineers, researchers, and graduate students interested in the field of flip chip packaging.
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Da: Brook Bookstore On Demand, Napoli, NA, Italia
Condizione: new. Questo è un articolo print on demand. Codice articolo 9e905342e25a969222d5736275bf1551
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Da: moluna, Greven, Germania
Condizione: New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. Broad-ranging chapters with a focus on IC-package-system integrationProvides viewpoints from leading industry executives and expertsDetails state-of-the-art achievements in process technologies and scientific researchPresents a clear. Codice articolo 458511201
Quantità: Più di 20 disponibili
Da: BuchWeltWeit Ludwig Meier e.K., Bergisch Gladbach, Germania
Taschenbuch. Condizione: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -Advanced Flip Chip Packaging presents past, present and future advances and trends in areas such as substrate technology, material development, and assembly processes. Flip chip packaging is now in widespread use in computing, communications, consumer and automotive electronics, and the demand for flip chip technology is continuing to grow in order to meet the need for products that offer better performance, are smaller, and are environmentally sustainable. 568 pp. Englisch. Codice articolo 9781489979339
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Da: AHA-BUCH GmbH, Einbeck, Germania
Taschenbuch. Condizione: Neu. Druck auf Anfrage Neuware - Printed after ordering - Advanced Flip Chip Packaging presents past, present and future advances and trends in areas such as substrate technology, material development, and assembly processes. Flip chip packaging is now in widespread use in computing, communications, consumer and automotive electronics, and the demand for flip chip technology is continuing to grow in order to meet the need for products that offer better performance, are smaller, and are environmentally sustainable. Codice articolo 9781489979339
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Da: preigu, Osnabrück, Germania
Taschenbuch. Condizione: Neu. Advanced Flip Chip Packaging | Ho-Ming Tong (u. a.) | Taschenbuch | vii | Englisch | 2016 | Springer | EAN 9781489979339 | Verantwortliche Person für die EU: Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg, juergen[dot]hartmann[at]springer[dot]com | Anbieter: preigu. Codice articolo 109983155
Quantità: 5 disponibili
Da: buchversandmimpf2000, Emtmannsberg, BAYE, Germania
Taschenbuch. Condizione: Neu. This item is printed on demand - Print on Demand Titel. Neuware -Advanced Flip Chip Packaging presents past, present and future advances and trends in areas such as substrate technology, material development, and assembly processes. Flip chip packaging is now in widespread use in computing, communications, consumer and automotive electronics, and the demand for flip chip technology is continuing to grow in order to meet the need for products that offer better performance, are smaller, and are environmentally sustainable.Springer-Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg 568 pp. Englisch. Codice articolo 9781489979339
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Da: Mispah books, Redhill, SURRE, Regno Unito
Paperback. Condizione: Like New. LIKE NEW. SHIPS FROM MULTIPLE LOCATIONS. book. Codice articolo ERICA80014899793366
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Da: Biblios, Frankfurt am main, HESSE, Germania
Condizione: New. PRINT ON DEMAND pp. 567. Codice articolo 18382221492
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Da: Majestic Books, Hounslow, Regno Unito
Condizione: New. Print on Demand pp. 567. Codice articolo 381649761
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Da: Books Puddle, Woodside, NY, U.S.A.
Condizione: New. pp. 567. Codice articolo 26382221502
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