EUR 139,60
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Aggiungi al carrelloTaschenbuch. Condizione: Neu. Advanced Flip Chip Packaging | Ho-Ming Tong (u. a.) | Taschenbuch | vii | Englisch | 2016 | Springer | EAN 9781489979339 | Verantwortliche Person für die EU: Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg, juergen[dot]hartmann[at]springer[dot]com | Anbieter: preigu.
EUR 165,91
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Aggiungi al carrelloTaschenbuch. Condizione: Neu. Druck auf Anfrage Neuware - Printed after ordering - Advanced Flip Chip Packaging presents past, present and future advances and trends in areas such as substrate technology, material development, and assembly processes. Flip chip packaging is now in widespread use in computing, communications, consumer and automotive electronics, and the demand for flip chip technology is continuing to grow in order to meet the need for products that offer better performance, are smaller, and are environmentally sustainable.
EUR 317,16
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Aggiungi al carrelloPaperback. Condizione: Like New. LIKE NEW. SHIPS FROM MULTIPLE LOCATIONS. book.
Condizione: New. pp. 567.
Da: Brook Bookstore On Demand, Napoli, NA, Italia
EUR 125,89
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Aggiungi al carrelloCondizione: new. Questo è un articolo print on demand.
Da: moluna, Greven, Germania
EUR 132,36
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Aggiungi al carrelloCondizione: New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. Broad-ranging chapters with a focus on IC-package-system integrationProvides viewpoints from leading industry executives and expertsDetails state-of-the-art achievements in process technologies and scientific researchPresents a clear.
Da: BuchWeltWeit Ludwig Meier e.K., Bergisch Gladbach, Germania
EUR 159,99
Quantità: 2 disponibili
Aggiungi al carrelloTaschenbuch. Condizione: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -Advanced Flip Chip Packaging presents past, present and future advances and trends in areas such as substrate technology, material development, and assembly processes. Flip chip packaging is now in widespread use in computing, communications, consumer and automotive electronics, and the demand for flip chip technology is continuing to grow in order to meet the need for products that offer better performance, are smaller, and are environmentally sustainable. 568 pp. Englisch.
Lingua: Inglese
Editore: Springer US, Springer Aug 2016, 2016
ISBN 10: 1489979336 ISBN 13: 9781489979339
Da: buchversandmimpf2000, Emtmannsberg, BAYE, Germania
EUR 159,99
Quantità: 1 disponibili
Aggiungi al carrelloTaschenbuch. Condizione: Neu. This item is printed on demand - Print on Demand Titel. Neuware -Advanced Flip Chip Packaging presents past, present and future advances and trends in areas such as substrate technology, material development, and assembly processes. Flip chip packaging is now in widespread use in computing, communications, consumer and automotive electronics, and the demand for flip chip technology is continuing to grow in order to meet the need for products that offer better performance, are smaller, and are environmentally sustainable.Springer-Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg 568 pp. Englisch.
Da: Biblios, Frankfurt am main, HESSE, Germania
EUR 314,01
Quantità: 4 disponibili
Aggiungi al carrelloCondizione: New. PRINT ON DEMAND pp. 567.
Da: Majestic Books, Hounslow, Regno Unito
EUR 331,25
Quantità: 4 disponibili
Aggiungi al carrelloCondizione: New. Print on Demand pp. 567.