Design-for-Test and Test Optimization Techniques for TSV-based 3D Stacked ICs

Noia, Brandon, Chakrabarty, Krishnendu

ISBN 10: 3319345346 / ISBN 13: 9783319345345

Editore: Springer, 2016

Riguardo questo articolo

Like New.

Codice articolo ERICA79733193453466

Dati bibliografici

• Titolo: Design-for-Test and Test Optimization Techniques for TSV-based 3D Stacked ICs
• Editore: Springer
• Data di pubblicazione: 2016
• Lingua: Inglese
• ISBN 10: 3319345346
• ISBN 13: 9783319345345
• Rilegatura: Paperback
• Condizione: Like New
• Tipo di libro: book

Descrizione articolo

Riassunto

This volume encompasses the latest, innovative methods of testing three-dimensional integrated circuits, incorporating pre-bond and post-bond tests as well as the test optimization and scheduling necessary to ensure that 3D testing remains cost-effective.

Informazioni sull?autore

Krishnendu Chakrabarty is a Professor of Electrical and Computer Engineering at Duke University. He received his PhD from University of Michigan. He is a Fellow of IEEE and a Distinguished Engineer of ACM.