Design-for-Test and Test Optimization Techniques for TSV-based 3D Stacked ICs - Brossura

Noia, Brandon

 
9783319345345: Design-for-Test and Test Optimization Techniques for TSV-based 3D Stacked ICs
Brossura
ISBN 10: 3319345346 ISBN 13: 9783319345345
Casa editrice: Springer, 2016

Sinossi

This volume encompasses the latest, innovative methods of testing three-dimensional integrated circuits, incorporating pre-bond and post-bond tests as well as the test optimization and scheduling necessary to ensure that 3D testing remains cost-effective.

Le informazioni nella sezione "Riassunto" possono far riferimento a edizioni diverse di questo titolo.

Informazioni sull?autore

Krishnendu Chakrabarty is a Professor of Electrical and Computer Engineering at Duke University. He received his PhD from University of Michigan. He is a Fellow of IEEE and a Distinguished Engineer of ACM.

Dalla quarta di copertina


This book describes innovative techniques to address the testing needs of 3D stacked integrated circuits (ICs) that utilize through-silicon-vias (TSVs) as vertical interconnects. The authors identify the key challenges facing 3D IC testing and present results that have emerged from cutting-edge research in this domain. Coverage includes topics ranging from die-level wrappers, self-test circuits, and TSV probing to test-architecture design, test scheduling, and optimization. Readers will benefit from an in-depth look at test-technology solutions that are needed to make 3D ICs a reality and commercially viable.

Provides a comprehensive guide to the challenges and solutions for the testing of TSV-based 3D stacked ICs;
Includes in-depth explanation of key test and design-for-test technologies, emerging standards, and test- architecture and test-schedule optimizations;
Encompasses all aspects of test as related to 3D ICs, including pre-bond and post-bond test as well as the test optimization and scheduling necessary to ensure that 3D testing remains cost-effective.

Le informazioni nella sezione "Su questo libro" possono far riferimento a edizioni diverse di questo titolo.

Editore
Springer
Data di pubblicazione
2016
Lingua
Inglese
ISBN 10 
3319345346
ISBN 13 
9783319345345
Rilegatura
Copertina flessibile
Numero di pagine
264
Contatto del produttore
non disponibile
Persona responsabile
CMN Printpool Inh. Mathis Neumann
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Hamburg
Germania

Altre edizioni note dello stesso titolo

9783319023779: Design-for-test and Test Optimization Techniques for Tsv-based 3d Stacked Ics

Edizione in evidenza

ISBN 10:  3319023772 ISBN 13:  9783319023779
Casa editrice: Springer Nature, 2013
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