Design-for-Test and Test Optimization Techniques for TSV-based 3D Stacked ICs

Noia, Brandon

ISBN 10: 3319345346 / ISBN 13: 9783319345345

Editore: Springer, 2016

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Codice articolo 18378180867

Dati bibliografici

• Titolo: Design-for-Test and Test Optimization Techniques for TSV-based 3D Stacked ICs
• Editore: Springer
• Data di pubblicazione: 2016
• Lingua: Inglese
• ISBN 10: 3319345346
• ISBN 13: 9783319345345
• Rilegatura: Brossura
• Condizione: New

Descrizione articolo

Riassunto

This volume encompasses the latest, innovative methods of testing three-dimensional integrated circuits, incorporating pre-bond and post-bond tests as well as the test optimization and scheduling necessary to ensure that 3D testing remains cost-effective.

Informazioni sull?autore

Krishnendu Chakrabarty is a Professor of Electrical and Computer Engineering at Duke University. He received his PhD from University of Michigan. He is a Fellow of IEEE and a Distinguished Engineer of ACM.