Fundamentals of Device and Systems Packaging: Technologies and Applications, Second Edition

Lingua: inglese

Editore: McGraw-Hill Education, US, 2019

1259861554 / 9781259861550

Da: Rarewaves USA, HEBRON, KY, U.S.A.Rarewaves USA

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Publisher's Note: Products purchased from Third Party sellers are not guaranteed by the publisher for quality,  authenticity, or access to any online entitlements included with the product.A fully updated, comprehensive guide to microelectronic device and systems packaging principles and practicesThis thoroughly revised book offers the latest, comprehensive fundamentals in device and systems packaging technologies and applications. You will get in-depth explanations of the 15 core packaging technologies that make up any electronic system, including electrical design for power, signal, and EMI; thermal design by conduction, convection,and radiation heat transfer; thermo-mechanical failures and reliability;advanced packaging materials at micro and nanoscales; ceramic, organic, glass,and silicon substrates. This resource also discusses passive components such as capacitors, inductors, and resistors and their proximity integration with actives; chip-to-package interconnections and assembly; wafer and panel embedding technologies; 3D packaging with and without TS; RF and millimeter-wave packaging; role of optoelectronics; mems and sensor packaging;encapsulation, molding and sealing; and printed wiring board and its assembly to form end-product systems. Fundamentals of Device and Systems Packaging: Technologies and Applications, Second Edition introduces the concept of Moore's Law for packaging, as Moore's Law for ICs is coming to an end due to physical, material, electrical, and financial limitations. Moore's Law for Packaging (MLP) can be viewed as interconnecting and integrating many smaller chips with high aggregate transistor density, at higher performance and lower cost than Moore's Law for ICs. This book lays the groundwork for Moore's Law for Packaging by showing how I/Os have evolved from one package family node to the next, starting with.

Codice articolo LU-9781259861550

Titolo
Fundamentals of Device and Systems Packaging: Technologies and Applications, Second Edition
Autore
Rao Tummala
Editore
McGraw-Hill Education, US
Anno di pubblicazione
2019
Condizione
New
Rilegatura
Hardback
Lingua
inglese
ISBN 10
1259861554
ISBN 13
9781259861550
Edizione
seconda edizione
Peso dell'articolo
1658 grammi

Rarewaves USA

HEBRON, KY, U.S.A.

Venditore con 5 stelle

Venditore AbeBooks dal 10 giugno 2025

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