Fundamentals of Device and Systems Packaging: Technologies and Applications, Second Edition

Lingua: inglese

Editore: McGraw-Hill Education, 2019

1259861554 / 9781259861550

Da: World of Books (was SecondSale), Montgomery, IL, U.S.A.World of Books (was SecondSale)

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Venditore AbeBooks dal 20 dicembre 2007

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Descrizione dell’articolo da parte del venditore

Publisher's Note: Products purchased from Third Party sellers are not guaranteed by the publisher for quality,  authenticity, or access to any online entitlements included with the product.A fully updated, comprehensive guide to microelectronic device and systems packaging principles and practicesThis thoroughly revised book offers the latest, comprehensive fundamentals in device and systems packaging technologies and applications. You will get in-depth explanations of the 15 core packaging technologies that make up any electronic system, including electrical design for power, signal, and EMI; thermal design by conduction, convection,and radiation heat transfer; thermo-mechanical failures and reliability;advanced packaging materials at micro and nanoscales; ceramic, organic, glass,and silicon substrates. This resource also discusses passive components such as capacitors, inductors, and resistors and their proximity integration with actives; chip-to-package interconnections and assembly; wafer and panel embedding technologies; 3D packaging with and without TS; RF and millimeter-wave packaging; role of optoelectronics; mems and sensor packaging;encapsulation, molding and sealing; and printed wiring board and its assembly to form end-product systems. Fundamentals of Device and Systems Packaging: Technologies and Applications, Second Edition introduces the concept of Moore?s Law for packaging, as Moore?s Law for ICs is coming to an end due to physical, material, electrical, and financial limitations. Moore?s Law for Packaging (MLP) can be viewed as interconnecting and integrating many smaller chips with high aggregate transistor density, at higher performance and lower cost than Moore?s Law for ICs. This book lays the groundwork for Moore?s Law for Packaging by showing how I/Os have evolved from one package family node to the next, starting with.…

Codice articolo 00104994992

Titolo
Fundamentals of Device and Systems Packaging: Technologies and Applications, Second Edition
Autore
Rao Tummala
Editore
McGraw-Hill Education
Anno di pubblicazione
2019
Condizione
Very Good
Rilegatura
Hardback
Lingua
inglese
ISBN 10
1259861554
ISBN 13
9781259861550
Edizione
seconda edizione

World of Books (was SecondSale)

Montgomery, IL, U.S.A.

Venditore con 5 stelle

Venditore AbeBooks dal 20 dicembre 2007

Tariffe di spedizione nazionale per U.S.A.

ArticoloDa 4 a 12 giorni lavorativiDa 3 a 6 giorni lavorativi
Primo articoloEUR 0,00EUR 9,66
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Founded in 2002, World of Books is a leading online destination for buying and selling both preloved and new books, committed to making sustainable reading accessible to all. With a mission to help people read more and waste less, World of Books offers a huge range of affordable, high-quality books — giving both new and preloved titles a second life. The company also operates World of Books – Sell Your Books, an easy-to-use platform that allows customers to trade in unwanted books for cash, helping to keep books in circulation while promoting sustainability. As a Certified B Corp, World of Books is driven by a vision to become the world’s largest and most sustainable dedicated online bookstore. The company measures its success through the positive environmental impact it creates, the value it provides to customers, and its ability to operate profitably while supporting its sustainable mission …

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