Interlayer Thermal Management of High-Performance Microprocessor Chip Stacks

Lingua: inglese

Editore: Cuvillier Apr 2012, 2012

3954040344 / 9783954040346

Da: BuchWeltWeit Ludwig Meier e.K., Bergisch Gladbach, GermaniaBuchWeltWeit Ludwig Meier e.K.

Venditore con 5 stelle

Venditore AbeBooks dal 11 gennaio 2012

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Descrizione dell’articolo da parte del venditore

This item is printed on demand - it takes 3-4 days longer - Neuware -Vertical integration of integrated circuit dies offers tremendous opportunities from an architectural as well as from an economical standpoint. Memory proximity supports performance scaling, and might enable significant energy savings. Partitioning of the corresponding functionalities and technologies into individual tiers can improve yield and modularity substantially.The paradigm change of stacking active components has a direct impact on heat-removal concepts and is therefore the motivation of this thesis. A stack comprised of a single logic layer in combination with multiple memory dies was identified as the limit for traditional back-side heat removal. To minimize junction temperatures, a stacking sequence with the high heat-flux component in close proximity to the cold plate is proposed.Interlayer cooling is the only volumetric heat-removal solution that scales with the number of dies in the stack. Hence, the focus of this thesis has been to identify the potential of interlayer cooling and to provide a modeling framework. Fundamental heat-transfer building blocks, such as unit-cell geometries, fluid structure modulation, fluid focusing, as well as four-port fluid delivery supporting power-map-aware heat removal, are discussed. Moreover, the theoretical foundation was experimentally validated on resistively heated convective test cavities. Therefore, specific bonding and insulation schemes were developed. Finally, the interlayer cooling performance was demonstrated on a pyramid chip stack. 172 pp. Englisch.…

Codice articolo 9783954040346

Dati bibliografici

Titolo
Interlayer Thermal Management of High-Performance Microprocessor Chip Stacks
Autore
Thomas Brunschwiler
Editore
Cuvillier Apr 2012
Anno di pubblicazione
2012
Condizione
Neu
Rilegatura
Taschenbuch
Lingua
inglese
ISBN 10
3954040344
ISBN 13
9783954040346
Peso dell'articolo
231 grammi
Dimensioni
210x148x10 mm

BuchWeltWeit Ludwig Meier e.K.

Bergisch Gladbach, Germania

Venditore con 5 stelle

Venditore AbeBooks dal 11 gennaio 2012

Tariffe di spedizione da Germania a U.S.A.

ArticoloDa 5 a 15 giorni lavorativiDa 5 a 15 giorni lavorativi
Primo articoloEUR 23,00EUR 23,00
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BuchWeltWeit Ludwig Meier e.K.

Germania