This is an ex-library book and may have the usual library/used-book markings inside.This book has hardback covers. Clean from markings With owner's name inside cover. In good all round condition. Please note the Image in this listing is a stock photo and may not match the covers of the actual item,1100grams, ISBN:9780412084515.

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Dati bibliografici

Titolo

Microelectronics Packaging Handbook: Subsystem Packaging Part III

Editore

Kluwer Academic

Data di pubblicazione

1997

Lingua

Inglese

ISBN 10

0412084511

ISBN 13

9780412084515

Rilegatura

Rilegato

Edizione

seconda edizione

Condizione

Good

Peso

1100 grammi

Cataloghi dei venditori

Engineering

Descrizione articolo

Riassunto

This thoroughly revised and updated three volume set continues to be the standard reference in the field, providing the latest in microelectronics design methods, modeling tools, simulation techniques, and manufacturing procedures. Unlike reference books that focus only on a few aspects of microelectronics packaging, these outstanding volumes discuss state-of-the-art packages that meet the power, cooling, protection, and interconnection requirements of increasingly dense and fast microcircuitry. Providing an excellent balance of theory and practical applications, this dynamic compilation features step-by-step examples and vital technical data, simplifying each phase of package design and production. In addition, the volumes contain over 2000 references, 900 figures, and 250 tables.
Part I: Technology Drivers covers the driving force of microelectronics packaging - electrical, thermal, and reliability. It introduces the technology developer to aspects of manufacturing that must be considered during product development.
Part II: Semiconductor Packaging discusses the interconnection of the IC chip to the first level of packaging and all first level packages. Electrical test, sealing, and encapsulation technologies are also covered in detail.
Part III: Subsystem Packaging explores board level packaging as well as connectors, cables, and optical packaging.

Recensione

`A most comprehensive book set, both well presented and well illustrated.'
IEEE Electrical Insulation Magazine, September/October 1997

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Descrizione libreria

Based in central Lincoln, Anybook Ltd. sells exclusively on line. We specialise in academic works. All our books are in good condition or better, unless otherwise described. We will respond to your enquiry promptly and mail books out within 24 hours of receiving payment. We use Royal Mail and other reputable couriers at greatly discounted postage rates. If you find cheaper postage from the UK, we'll match it. Remember if you are unsatisfied in any way with any purchase, we will give you a complete and unconditional refund. All books are hand wrapped. All e-mails answered personally. All books are offered subject to being unsold.

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