Influence of Temperature on Microelectronics and System Reliability: A Physics of Failure Approach (Electronic Packaging)

Lall, Pradeep; Pecht, Michael G.; Hakim, Edward B.

ISBN 10: 0849394503 / ISBN 13: 9780849394508

Editore: CRC Press, 1997

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This book is seriously flawed by the fact that pages 289 to 307 function as an insert. They are completely separated from the binding. But the book is all there and is otherwise in new condition. There are no tears or signs of wear to the clean pages or the cover.

Codice articolo 4198

Dati bibliografici

• Titolo: Influence of Temperature on Microelectronics and System Reliability: A Physics of Failure Approach (Electronic Packaging)
• Editore: CRC Press
• Data di pubblicazione: 1997
• Lingua: Inglese
• ISBN 10: 0849394503
• ISBN 13: 9780849394508
• Rilegatura: Hardcover
• Edizione: 1st Edition
• Condizione: Fair
• Condizione della sovraccoperta: No Jacket

Descrizione articolo

Riassunto

This book raises the level of understanding of thermal design criteria. It provides the design team with sufficient knowledge to help them evaluate device architecture trade-offs and the effects of operating temperatures. The author provides readers a sound scientific basis for system operation at realistic steady state temperatures without reliability penalties. Higher temperature performance than is commonly recommended is shown to be cost effective in production for life cycle costs. The microelectronic package considered in the book is assumed to consist of a semiconductor device with first-level interconnects that may be wirebonds, flip-chip, or tape automated bonds; die attach; substrate; substrate attach; case; lid; lid seal; and lead seal. The temperature effects on electrical parameters of both bipolar and MOSFET devices are discussed, and models quantifying the temperature effects on package elements are identified. Temperature-related models have been used to derive derating criteria for determining the maximum and minimum allowable temperature stresses for a given microelectronic package architecture. The first chapter outlines problems with some of the current modeling strategies. The next two chapters present microelectronic device failure mechanisms in terms of their dependence on steady state temperature, temperature cycle, temperature gradient, and rate of change of temperature at the chip and package level. Physics-of-failure based models used to characterize these failure mechanisms are identified and the variabilities in temperature dependence of each of the failure mechanisms are characterized. Chapters 4 and 5 describe the effects of temperature on the performance characteristics of MOS and bipolar devices. Chapter 6 discusses using high-temperature stress screens, including burn-in, for high-reliability applications. The burn-in conditions used by some manufacturers are examined and a physics-of-failure approach is described. The

Informazioni sull?autore

Lall, Pradeep; Pecht, Michael; Hakim, Edward B.