Babu suryadevara (32 risultati)

Soft cover. Condizione: New. Contents Preface. 1. States of matter. 2. Thermodynamics. 3. Physical properties of drug molecules. 4. Solutions of non electrolytes. 5. Solutions of electrolytes. 6. Ionic equilibria. 7. Buffers and buffered isotonic solutions. 8. Electrochemistry. 9. Viscosity. 10. Photochemistry. Physical Pharmacy is one of the important subjects for pharmacy students. The book on physical pharmaceutics is written with an idea to provide the coverage of syllabus in the subjects covered for students of both undergraduate and postgraduate level in pharmacy. This book is designed to help students understand the basic concepts and physico chemical principles involved in the manufacture of various dosage forms. Salient features Presentation of fundamental concepts in a very simplified an self explanatory form. Serves the needs of the pharmacy students with core concepts which will help them in consequent years. 262 pp. …

paperback. Condizione: Good.

paperback. Condizione: Fine.

Condizione: As New. Unread book in perfect condition.

Condizione: New.

Condizione: New.

Paperback. Condizione: New. St ed.

Condizione: New.

Condizione: As New. Unread book in perfect condition.

Paperback. Condizione: New. St ed.

paperback. Condizione: Like New. LIKE NEW. SHIPS FROM MULTIPLE LOCATIONS. book.

Taschenbuch. Condizione: Neu. Advances in Chemical Mechanical Planarization (CMP) | Babu Suryadevara | Taschenbuch | Einband - flex.(Paperback) | Englisch | 2021 | Woodhead Publishing | EAN 9780128217917 | Verantwortliche Person für die EU: Elsevier B.V., Radarweg 29, 1043 NX AMSTERDAM, NIEDERLANDE, productsafety[at]elsevier[dot]com | Anbieter: preigu. …

Condizione: New.

Condizione: New.

Condizione: As New. Unread book in perfect condition.

Condizione: New.

Condizione: New.

Condizione: As New. Unread book in perfect condition.

Condizione: As New. Unread book in perfect condition.

Condizione: As New. Unread book in perfect condition.

Gebunden. Condizione: New. Considers techniques and processes for CMP of dielectric and metal films Includes chapters devoted to CMP for particular materials Addresses consumables and process control for improved CMPRedaktion: Babu Suryade.

Condizione: New. Reviews the most relevant techniques and processes for CMP of dielectric and metal films Includes chapters devoted to CMP for current and emerging materials Addresses consumables and process control for improved CMP, including pos.

PAP. Condizione: New. New Book. Delivered from our UK warehouse in 4 to 14 business days. THIS BOOK IS PRINTED ON DEMAND. Established seller since 2000.

Hardback. Condizione: New. This item is printed on demand. New copy - Usually dispatched within 5-9 working days.

Condizione: New. Print on Demand pp. 278.

Condizione: New. Print on Demand pp. 278.

Condizione: New. PRINT ON DEMAND pp. 278.

Condizione: New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. &Uumlber den AutorrnrnDr. S. Vidyadhara, studied at J.S.S. College of Pharmacy, Ooty, J.S.S. University for his graduation and awarded Ph.D in Pharmacy by JNTU, Hyderabad. Presently he is serving as Professor and Principal of Chebrolu Hanumaiah.…

Buch. Condizione: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -Advances in Chemical Mechanical Planarization (CMP) provides the latest information on a mainstream process that is critical for high-volume, high-yield semiconductor manufacturing, and even more so as device dimensions continue to shrink. The technology has grown to encompass the removal and planarization of multiple metal and dielectric materials and layers both at the device and the metallization levels, using different tools and parameters, requiring improvements in the control of topography and defects. This important book offers a systematic review of fundamentals and advances in the area. Part One covers CMP of dielectric and metal films, with chapters focusing on the use of particular techniques and processes, and on CMP of particular various materials, including ultra low-k materials and high-mobility channel materials, and ending with a chapter reviewing the environmental impacts of CMP processes. Part Two addresses consumables and process control for improved CMP, and includes chapters on the preparation and characterization of slurry, diamond disc pad conditioning, the use of FTIR spectroscopy for characterization of surface processes, and approaches for defection characterization, mitigation, and reduction. Englisch.…

Taschenbuch. Condizione: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -Advances in Chemical Mechanical Planarization (CMP), Second Edition provides the latest information on a mainstream process that is critical for high-volume, high-yield semiconductor manufacturing, and even more so as device dimensions continue to shrink. The second edition includes the recent advances of CMP and its emerging materials, methods, and applications, including coverage of post-CMP cleaning challenges and tribology of CMP. This important book offers a systematic review of fundamentals and advances in the area. Part one covers CMP of dielectric and metal films, with chapters focusing on the use of current and emerging techniques and processes and on CMP of various materials, including ultra low-k materials and high-mobility channel materials, and ending with a chapter reviewing the environmental impacts of CMP processes. New content addressed includes CMP challenges with tungsten, cobalt, and ruthenium as interconnect and barrier films, consumables for ultralow topography and CMP for memory devices. Part two addresses consumables and process control for improved CMP and includes chapters on CMP pads, diamond disc pad conditioning, the use of FTIR spectroscopy for characterization of surface processes and approaches for defection characterization, mitigation, and reduction. Advances in Chemical Mechanical Planarization (CMP), Second Edition is an invaluable resource and key reference for materials scientists and engineers in academia and R&D. Englisch.…