Bakir c (37 risultati)

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Condizione: New. In English.

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Paperback. Condizione: New. 1st ed. 2013. This book provides new interdisciplinary and comparative answers as to why banking sectors in 'liberal' and 'coordinated' market economies operated under a shared set of rules during the Global Financial Crisis. Exploring the role of complex interactions among interdependent structures, institutions and agents defines this banking behaviour.…

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Condizione: New. 2013. 2013th Edition. hardcover. . . . . .

Condizione: New. CANER BAKIR is Associate Professor in the International Relations Department at Koc University, Istanbul, Turkey. He has worked as an Assistant Lecturer in the Accounting and Finance Department at Monash University, Melbourne, Australia. Prior to this, he w.

Condizione: New. pp. 214 1st ed. 2013 edition NO-PA16APR2015-KAP.

Paperback. Condizione: Brand New. 214 pages. 8.50x5.51x0.50 inches. In Stock.

Taschenbuch. Condizione: Neu. Bank Behaviour and Resilience | The Effect of Structures, Institutions and Agents | C. Bakir | Taschenbuch | xvii | Englisch | 2013 | Palgrave MacMillan UK | EAN 9781349300518 | Verantwortliche Person für die EU: Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg, juergen[dot]hartmann[at]springer[dot]com | Anbieter: preigu.…

Condizione: New. 2013. 2013th Edition. hardcover. . . . . . Books ship from the US and Ireland.

Paperback. Condizione: New. 1st ed. 2013. This book provides new interdisciplinary and comparative answers as to why banking sectors in 'liberal' and 'coordinated' market economies operated under a shared set of rules during the Global Financial Crisis. Exploring the role of complex interactions among interdependent structures, institutions and agents defines this banking behaviour.…

Hardcover. Condizione: Like New. LIKE NEW. SHIPS FROM MULTIPLE LOCATIONS. book.

Paperback. Condizione: Like New. LIKE NEW. SHIPS FROM MULTIPLE LOCATIONS. book.

Hardcover. Condizione: gut. 2019. Encyclopedia of Packaging Materials, Processes, and Mechanics - Set 1: Die-Attach and Wafer Bonding Technology (a 4-Volume Set) In deutscher Sprache. pages.

Condizione: New. This is a Brand-new US Edition. This Item may be shipped from US or any other country as we have multiple locations worldwide.

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Buch. Condizione: Neu. Neuware - Packaging materials, assembly processes, and the detailed understanding of multilayer mechanics have enabled much of the progress in miniaturization, reliability, and functional density achieved by modern electronic, microelectronic, and nanoelectronic products. The design and manufacture of miniaturized packages, providing low-loss electrical and/or optical communication, while protecting the semiconductor chips from environmental stresses and internal power cycling, require a carefully balanced selection of packaging materials and processes. Due to the relative fragility of these semiconductor chips, as well as the underlying laminated substrates and the bridging interconnect, selection of the packaging materials and processes is inextricably bound with the mechanical behavior of the intimately packaged multilayer structures, in all phases of development for traditional, as well as emerging, electronic product categories.The Encyclopedia of Packaging Materials, Processes, and Mechanics, compiled in 8, multi-volume sets, provides comprehensive coverage of the configurations and techniques, assembly materials and processes, modeling and simulation tools, and experimental characterization and validation techniques for electronic packaging. Each of the volumes presents the accumulated wisdom and shared perspectives of leading researchers and practitioners in the packaging of electronic components. The Encyclopedia of Packaging Materials, Processes, and Mechanics will provide the novice and student with a complete reference for a quick ascent on the packaging 'learning curve, ' the practitioner with a validated set of techniques and tools to face every challenge in packaging design and development, and researchers with a clear definition of the state-of-the-art and emerging needs to guide their future efforts. This encyclopedia will, thus, be of great interest to packaging engineers, electronic product development engineers, and product managers, as well as to researchers in the assembly and mechanical behavior of electronic and photonic components and systems. It will be most beneficial to undergraduate and graduate students studying materials, mechanical, electrical, and electronic engineering, with a strong interest in electronic packaging applications.…

Gebunden. Condizione: New. KlappentextPackaging materials, assembly processes, and the detailed understanding of multilayer mechanics have enabled much of the progress in miniaturization, reliability, and functional density achieved by modern electronic, microelec.

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Hardcover. Condizione: New. NEW. SHIPS FROM MULTIPLE LOCATIONS. book.

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Hardcover. Condizione: Brand New. 1080 pages. 10.08x7.60x2.72 inches. In Stock.

Condizione: new. Questo è un articolo print on demand.

PF. Condizione: New. This item is printed on demand. Brand new book, sourced directly from publisher. Dispatch time is 6-7 days from our warehouse. Book will be sent in robust, secure packaging to ensure it reaches you securely.

Taschenbuch. Condizione: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -This book provides new interdisciplinary and comparative answers as to why banking sectors in 'liberal' and 'coordinated' market economies operated under a shared set of rules during the Global Financial Crisis. Exploring the role of complex interactions among interdependent structures, institutions and agents defines this banking behaviour. 214 pp. Englisch.…