Editore: Industrial and Scientific Conference Management
Da: ThriftBooks-Atlanta, AUSTELL, GA, U.S.A.
Hardcover. Condizione: Fair. No Jacket. Readable copy. Pages may have considerable notes/highlighting. ~ ThriftBooks: Read More, Spend Less.
Da: books4less (Versandantiquariat Petra Gros GmbH & Co. KG), Welling, Germania
EUR 127,00
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Aggiungi al carrellogebundene Ausgabe. Condizione: Gut. 603 Seiten; Das hier angebotene Buch stammt aus einer teilaufgelösten wissenschaftlichen Bibliothek und trägt die entsprechenden Kennzeichnungen (Rückenschild, Instituts-Stempel.); Schnitt und Einband sind etwas staubschmutzig; der Buchzustand ist ansonsten ordentlich und dem Alter entsprechend gut. Text in ENGLISCHER Sprache! Sprache: Englisch Gewicht in Gramm: 1600.
EUR 197,82
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Aggiungi al carrelloCondizione: New. In.
Condizione: New. pp. 628.
Lingua: Inglese
Editore: Springer Berlin Heidelberg, 2013
ISBN 10: 3662131633 ISBN 13: 9783662131633
Da: AHA-BUCH GmbH, Einbeck, Germania
EUR 192,59
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Aggiungi al carrelloTaschenbuch. Condizione: Neu. Druck auf Anfrage Neuware - Printed after ordering - The assembly of electronic circuit boards has emerged as one of the most significant growth areas for robotics and automated assembly. This comprehensive volume, which is an edited collection of material mostly published in 'Assembly Engineering' and 'Electronic Packaging and Production', will provide an essential reference for engineers working in this field, including material on Multi Layer Boards, Chip-on-board and numerous case studies. Frank J. Riley is senior vice-president of the Bodine Corporation and a world authority on assembly automation.
EUR 279,22
Quantità: 2 disponibili
Aggiungi al carrelloPaperback. Condizione: Brand New. reprint edition. 603 pages. 9.75x8.00x1.25 inches. In Stock.
EUR 303,94
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Aggiungi al carrelloPaperback. Condizione: Like New. LIKE NEW. SHIPS FROM MULTIPLE LOCATIONS. book.
Da: Brook Bookstore On Demand, Napoli, NA, Italia
EUR 150,28
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Aggiungi al carrelloCondizione: new. Questo è un articolo print on demand.
Lingua: Inglese
Editore: Springer Berlin Heidelberg, 2013
ISBN 10: 3662131633 ISBN 13: 9783662131633
Da: moluna, Greven, Germania
EUR 162,51
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Aggiungi al carrelloCondizione: New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. The assembly of electronic circuit boards has emerged as one of the most significant growth areas for robotics and automated assembly. This comprehensive volume, which is an edited collection of material mostly published in Assembly Engineering and Elect.
Lingua: Inglese
Editore: Springer Berlin Heidelberg Okt 2013, 2013
ISBN 10: 3662131633 ISBN 13: 9783662131633
Da: BuchWeltWeit Ludwig Meier e.K., Bergisch Gladbach, Germania
EUR 192,59
Quantità: 2 disponibili
Aggiungi al carrelloTaschenbuch. Condizione: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -The assembly of electronic circuit boards has emerged as one of the most significant growth areas for robotics and automated assembly. This comprehensive volume, which is an edited collection of material mostly published in 'Assembly Engineering' and 'Electronic Packaging and Production', will provide an essential reference for engineers working in this field, including material on Multi Layer Boards, Chip-on-board and numerous case studies. Frank J. Riley is senior vice-president of the Bodine Corporation and a world authority on assembly automation. 628 pp. Englisch.
Lingua: Inglese
Editore: Springer Berlin Heidelberg, Springer Berlin Heidelberg Okt 2013, 2013
ISBN 10: 3662131633 ISBN 13: 9783662131633
Da: buchversandmimpf2000, Emtmannsberg, BAYE, Germania
EUR 192,59
Quantità: 1 disponibili
Aggiungi al carrelloTaschenbuch. Condizione: Neu. This item is printed on demand - Print on Demand Titel. Neuware -The assembly of electronic circuit boards has emerged as one of the most significant growth areas for robotics and automated assembly. This comprehensive volume, which is an edited collection of material mostly published in 'Assembly Engineering' and 'Electronic Packaging and Production', will provide an essential reference for engineers working in this field, including material on Multi Layer Boards, Chip-on-board and numerous case studies. Frank J. Riley is senior vice-president of the Bodine Corporation and a world authority on assembly automation.Springer-Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg 628 pp. Englisch.
Da: Majestic Books, Hounslow, Regno Unito
EUR 273,69
Quantità: 4 disponibili
Aggiungi al carrelloCondizione: New. Print on Demand pp. 628 39:B&W 8 x 10 in or 254 x 203mm Perfect Bound on White w/Gloss Lam.
Da: Biblios, Frankfurt am main, HESSE, Germania
EUR 273,61
Quantità: 4 disponibili
Aggiungi al carrelloCondizione: New. PRINT ON DEMAND pp. 628.