Franzon p d (5 risultati)
EDA for IC Implementation, Circuit Design, and Process Technology (Electronic Design Automation for Integrated Circuits Hdbk)
Scheffer, Louis [Editor]; Lavagno, Luciano [Editor]; Martin, Grant [Editor]; Martin, Grant [Editor]; Franzon, Paul D. [Contributor]; Schellenberg, Franklin [Contributor]; Khatri, Sunil P. [Contributor]; Hogan, James H. [Contributor]; Hutton, Michael D. [Contributor]; Bales, Mark [Contributor]; Dutton, Robert W. [Contributor]; Kariat, Vinod [Contributor]; Mo, Fan [Contributor]; Verghese, Nishath [Contributor]; Johnson, Mark Donald [Contributor]; Monteiro, Jose C. [Contributor]; Rutenbar, Rob A. [Contributor]; Blaauw, David T. [Contributor]; Todd, Robert A. [Contributor]; Stok, Leon [Contributor]; Roychowdhury, Jaijeet [Contributor]; Iverson, Ralph B. [Contributor]; Kahng, Andrew B. [Contributor]; Kuehlmann, Andreas [Contributor]; Kao, William H. [Contributor]; Cohn, John Maxwell [Contributor]; Gielen, Georges G.E. [Contributor]; Dragone, Nicola [Contributor]; Tiwari, Vivek [Contributor]; Shenoy, Narendra [Contributor]; Betz, Vaughn [Contributor]; Hathaway, David J. [Contributor]; Kan, E
Lingua: Inglese
Editore: CRC Press, 2006
Serie: Libro 1 di 2 - Electronic Design Automation for Integrated Circuits Hdbk
- Rilegato
Da: Swan Trading Company, GEORGETOWN, TX, U.S.A.Swan Trading Company
Contatta il venditoreVenditore con 5 stelleCondizione: Usato - Buono
EUR 163,06
Spedizione gratuitaSpedito in U.S.A.Quantità: 1 disponibili
hardcover. Condizione: Good. Hardcover ex-library with typical marks shows moderate cover wear. Text is unmarked. Ships FAST.
Lingua: Inglese
Editore: CRC Press 2006-03-23, 2006
Serie: Libro 1 di 2 - Electronic Design Automation for Integrated Circuits Hdbk
- Rilegato
Da: Chiron Media, Wallingford, Regno UnitoChiron Media
Contatta il venditoreVenditore con 5 stelleCondizione: Nuovo
EUR 208,46
EUR 18,11 spedizioneSpedito da Regno Unito a U.S.A.Quantità: 5 disponibili
Hardcover. Condizione: New.
EDA for IC Implementation, Circuit Design, and Process Technology (Electronic Design Automation for Integrated Circuits Hdbk)
Scheffer, Louis [Editor]; Lavagno, Luciano [Editor]; Martin, Grant [Editor]; Martin, Grant [Editor]; Franzon, Paul D. [Contributor]; Schellenberg, Franklin [Contributor]; Khatri, Sunil P. [Contributor]; Hogan, James H. [Contributor]; Hutton, Michael D. [Contributor]; Bales, Mark [Contributor]; Dutton, Robert W. [Contributor]; Kariat, Vinod [Contributor]; Mo, Fan [Contributor]; Verghese, Nishath [Contributor]; Johnson, Mark Donald [Contributor]; Monteiro, Jose C. [Contributor]; Rutenbar, Rob A. [Contributor]; Blaauw, David T. [Contributor]; Todd, Robert A. [Contributor]; Stok, Leon [Contributor]; Roychowdhury, Jaijeet [Contributor]; Iverson, Ralph B. [Contributor]; Kahng, Andrew B. [Contributor]; Kuehlmann, Andreas [Contributor]; Kao, Willia
Lingua: Inglese
Editore: CRC Press, 2006
Serie: Libro 1 di 2 - Electronic Design Automation for Integrated Circuits Hdbk
- Rilegato
Da: BennettBooksLtd, Los Angeles, CA, U.S.A.BennettBooksLtd
Contatta il venditoreVenditore con 5 stelleCondizione: Nuovo
EUR 254,72
EUR 6,11 spedizioneSpedito in U.S.A.Quantità: 1 disponibili
Hardcover. Condizione: New. In shrink wrap. Looks like an interesting title.
- Rilegato
Da: Kennys Bookshop and Art Galleries Ltd., Galway, GY, IrlandaKennys Bookshop and Art Galleries Ltd.
Contatta il venditoreVenditore con 5 stelleCondizione: Nuovo
EUR 257,99
EUR 9,50 spedizioneSpedito da Irlanda a U.S.A.Quantità: 15 disponibili
Condizione: New. Provides a framework for understanding the multichip module (MCM) technologies available for package selection. This book is useful for engineers concerned with the design and systems integration of products and technical managers who decide how to apply to technologies. Num Pages: 875 pages, biography. BIC Clas…sification: UM. Category: (P) Professional & Vocational; (XV) Technical / Manuals. Dimension: 229 x 152 x 55. Weight in Grams: 1500. . 1992. Hardback. . . . .
- Brossura
Da: Kennys Bookstore, Olney, MD, U.S.A.Kennys Bookstore
Contatta il venditoreVenditore con 5 stelleCondizione: Nuovo
EUR 329,28
EUR 9,24 spedizioneSpedito in U.S.A.Quantità: 15 disponibili
Condizione: New. Provides a framework for understanding the multichip module (MCM) technologies available for package selection. This book is useful for engineers concerned with the design and systems integration of products and technical managers who decide how to apply to technologies. Num Pages: 875 pages, biography. BIC Clas…sification: UM. Category: (P) Professional & Vocational; (XV) Technical / Manuals. Dimension: 229 x 152 x 55. Weight in Grams: 1500. . 1992. Hardback. . . . . Books ship from the US and Ireland.
