Da: Better World Books: West, Reno, NV, U.S.A.
Condizione: Very Good. Former library copy. Pages intact with possible writing/highlighting. Binding strong with minor wear. Dust jackets/supplements may not be included. Includes library markings. Stock photo provided. Product includes identifying sticker. Better World Books: Buy Books. Do Good.
Condizione: Good. [ No Hassle 30 Day Returns ][ Ships Daily ] [ Underlining/Highlighting: NONE ] [ Writing: SOME ] [ Edition: Sixth ] Publisher: The National Book Depot Date: 1/1/2002 Binding: Paperback Pages: 128 Sixth edition.
Lingua: Inglese
Editore: Motilal Banarsidass Publishers Pvt. Ltd., 2004
ISBN 10: 8120803620 ISBN 13: 9788120803626
Da: Majestic Books, Hounslow, Regno Unito
EUR 12,85
Quantità: 4 disponibili
Aggiungi al carrelloCondizione: New. pp. xiv + 355-738.
EUR 13,80
Quantità: 4 disponibili
Aggiungi al carrelloCondizione: New. pp. 247.
Lingua: Inglese
Editore: Motilal Banarsidass Publishers Pvt. Ltd. MLBD, 2004
ISBN 10: 8120803620 ISBN 13: 9788120803626
Da: Books Puddle, New York, NY, U.S.A.
Condizione: New. pp. xiv + 355-738 Index.
Condizione: New. pp. 247.
Lingua: Inglese
Editore: Motilal Banarsidass Publishers Pvt. Ltd., 2017
ISBN 10: 8120803612 ISBN 13: 9788120803619
Da: Majestic Books, Hounslow, Regno Unito
EUR 15,12
Quantità: 4 disponibili
Aggiungi al carrelloCondizione: New. pp. xxix + 354.
EUR 14,24
Quantità: 4 disponibili
Aggiungi al carrelloCondizione: New. pp. 247.
Lingua: Inglese
Editore: Motilal Banarsidass Publishers Pvt. Ltd. MLBD, 2017
ISBN 10: 8120803612 ISBN 13: 9788120803619
Da: Books Puddle, New York, NY, U.S.A.
Condizione: New. pp. xxix + 354 Index.
Editore: Jawahar Publishers & Distributors
ISBN 10: 8173610886 ISBN 13: 9788173610882
Da: Majestic Books, Hounslow, Regno Unito
EUR 5,86
Quantità: 4 disponibili
Aggiungi al carrelloCondizione: New. pp. iv + 188.
Editore: Bharatiya Book Corporation
Da: Majestic Books, Hounslow, Regno Unito
EUR 8,19
Quantità: 4 disponibili
Aggiungi al carrelloCondizione: New.
Da: Books in my Basket, New Delhi, India
EUR 15,82
Quantità: 2 disponibili
Aggiungi al carrelloHardcover. Condizione: New. ISBN:8131603296,432pp.
Editore: Rawat Publications, Jaipur, 2010
Da: Yak and Yeti Books, Denver, CO, U.S.A.
Hardcover. Condizione: New. Condizione sovraccoperta: New. xii, 420p. This anthropological study is an outcome of the author's lifelong involvement with the people and culture of Rawain-Jaunpur in India. The book not only studies the religious phenomenon of the Mahasu from a sociological perspective, but also beautifully highlights the life of the ordinary man of the region, as it is woven in and around their Devta - the Mahasu. Cult, Religion and Society brings out the continuity and deep-rootedness of the Indian cultural stream. It highlights the linkage between the local beliefs and practices with the Sanskritic tradition. The book describes heritage and identity through the concept of unity in diversity, underlying the main idea that unity is attitudinal but diversity is real. Thus, it provides a seasoned reorientation to many methodological issues associated with sociology of religion.
Da: Vedams eBooks (P) Ltd, New Delhi, India
EUR 28,82
Quantità: 5 disponibili
Aggiungi al carrelloHardcover. Condizione: New. Contents Preface In memoriam Acknowledgements 1 Prelude 2 Concepts and explanations 3 Mahasu Desh land and people 4 Social structural setting 5 Mahasu Katha 6 Mahasu Devta 7 Mahasu Puja 8 Other dimensions of Mahasu Puja 9 Managing the cult 10 Cult religion and society Bibliography Index This anthropological study is an outcome of the authors lifelong involvement with the people and culture of Rawain Jaunpur It started as a fallout of a study on polyandry in this area But it assumed multi dimensionality with deeper probing The book not only studies the phenomenon of Mahasu from sociological perspective but also beautifully highlights the life of the ordinary man of the region as it is woven in and around their Devta the Mahasu The book brings out the continuity and deep rootedness of Indian cultural stream It highlights the linkage between the local beliefs and practices with the Sanskritic tradition of the great Indian culture The book leans heavily on the attempts made by Indians to understand or explain themselves their heritage and identity through the concept of unity in diversity underlying the main idea that unity is attitudinal but diversity is real Thus the book provides a seasoned reorientation to many methodological issues associated with sociology of religion The book is a masterpiece in terms of methodology and theoretical acumen It knits up various theoretical perspectives into one stream of understanding through language culture perspective It is an exemplary academic gift for generations to come by an octogenarian trained in the traditions of pure anthropological methods of data collection 420 pp.
Lingua: Tedesco
Editore: Edition Bildperlen; 1. Edition (15. November 2024), 2024
ISBN 10: 3965460145 ISBN 13: 9783965460140
Da: Rarewaves.com USA, London, LONDO, Regno Unito
EUR 49,16
Quantità: 6 disponibili
Aggiungi al carrelloHardback. Condizione: New.
Condizione: New. New. In shrink wrap. Looks like an interesting title! 1.34.
Lingua: Inglese
Editore: VDM Verlag Dr. Mueller Aktiengesellschaft & Co. KG, 2013
ISBN 10: 3659472808 ISBN 13: 9783659472800
Da: Books Puddle, New York, NY, U.S.A.
Condizione: New. pp. 188.
Lingua: Inglese
Editore: LAP LAMBERT Academic Publishing, 2013
ISBN 10: 3659472808 ISBN 13: 9783659472800
Da: preigu, Osnabrück, Germania
EUR 61,05
Quantità: 5 disponibili
Aggiungi al carrelloTaschenbuch. Condizione: Neu. Heat Transfer Augmentation in a Semiconductor Device | G. S. Bhatt | Taschenbuch | 188 S. | Englisch | 2013 | LAP LAMBERT Academic Publishing | EAN 9783659472800 | Verantwortliche Person für die EU: preigu GmbH & Co. KG, Lengericher Landstr. 19, 49078 Osnabrück, mail[at]preigu[dot]de | Anbieter: preigu.
Lingua: Inglese
Editore: LAP LAMBERT Academic Publishing, 2013
ISBN 10: 3659472808 ISBN 13: 9783659472800
Da: Mispah books, Redhill, SURRE, Regno Unito
EUR 164,72
Quantità: 1 disponibili
Aggiungi al carrelloPaperback. Condizione: Like New. LIKE NEW. SHIPS FROM MULTIPLE LOCATIONS. book.
Da: Hay-on-Wye Booksellers, Hay-on-Wye, HEREF, Regno Unito
EUR 11,51
Quantità: 1 disponibili
Aggiungi al carrelloCondizione: Good. Very light shelf wear, boards have been plastic covered, with glue marks inside coveres where it has been stuck. Very small tear on flysheet. Contents pages have small creases and light mark at top. Rest of contents clean.
Lingua: Tedesco
Editore: Edition Bildperlen; 1. Edition (15. November 2024), 2024
ISBN 10: 3965460145 ISBN 13: 9783965460140
Da: Rarewaves.com UK, London, Regno Unito
EUR 45,26
Quantità: 6 disponibili
Aggiungi al carrelloHardback. Condizione: New.
Lingua: Inglese
Editore: LAP LAMBERT Academic Publishing Okt 2013, 2013
ISBN 10: 3659472808 ISBN 13: 9783659472800
Da: BuchWeltWeit Ludwig Meier e.K., Bergisch Gladbach, Germania
EUR 71,90
Quantità: 2 disponibili
Aggiungi al carrelloTaschenbuch. Condizione: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -With circuit densities continuing to increase at the rate of 30% per year, the problem associated with the thermal control of electronic devices will continue to multiply. Thermal control of electronic components has one principal objective to maintain relatively constant component temperature equal to or below the specified temperature. For the heat fluxes 1.0 to 10.0 W/cm2, forced air convection may be employed. Investigations have demonstrated that a component operating 10 C above the specified temperature can reduce the reliability of some systems by as much as 50%. New techniques that are capable of eliminating hot spots in the printed circuit boards with semiconductor chips must be developed. From reliability point of view, the peak temperatures are limited to lower values than in the past. These concerns have generated motivation for research study of forced convection cooling in electronic equipments with printed circuit boards. The flow in these channels is usually low due to small dimensions and so, a number of innovative techniques are imperative to achieve higher heat transfer. 188 pp. Englisch.
Lingua: Inglese
Editore: LAP LAMBERT Academic Publishing, 2013
ISBN 10: 3659472808 ISBN 13: 9783659472800
Da: moluna, Greven, Germania
EUR 58,12
Quantità: Più di 20 disponibili
Aggiungi al carrelloCondizione: New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. Autor/Autorin: Bhatt G. S.Dr. Bhatt has served some reputed engineering colleges in Bangalore, India, as a faculty over fifteen years. Dr. Bhatt has conducted a few training programs for the engineering faculty. He has published many research paper.
Lingua: Inglese
Editore: VDM Verlag Dr. Mueller Aktiengesellschaft & Co. KG, 2013
ISBN 10: 3659472808 ISBN 13: 9783659472800
Da: Majestic Books, Hounslow, Regno Unito
EUR 117,29
Quantità: 4 disponibili
Aggiungi al carrelloCondizione: New. Print on Demand pp. 188 2:B&W 6 x 9 in or 229 x 152 mm Perfect Bound on Creme w/Gloss Lam.
Lingua: Inglese
Editore: VDM Verlag Dr. Mueller Aktiengesellschaft & Co. KG, 2013
ISBN 10: 3659472808 ISBN 13: 9783659472800
Da: Biblios, Frankfurt am main, HESSE, Germania
EUR 117,78
Quantità: 4 disponibili
Aggiungi al carrelloCondizione: New. PRINT ON DEMAND pp. 188.
Lingua: Inglese
Editore: LAP LAMBERT Academic Publishing Okt 2013, 2013
ISBN 10: 3659472808 ISBN 13: 9783659472800
Da: buchversandmimpf2000, Emtmannsberg, BAYE, Germania
EUR 71,90
Quantità: 1 disponibili
Aggiungi al carrelloTaschenbuch. Condizione: Neu. This item is printed on demand - Print on Demand Titel. Neuware -With circuit densities continuing to increase at the rate of 30% per year, the problem associated with the thermal control of electronic devices will continue to multiply. Thermal control of electronic components has one principal objective to maintain relatively constant component temperature equal to or below the specified temperature. For the heat fluxes 1.0 to 10.0 W/cm2, forced air convection may be employed. Investigations have demonstrated that a component operating 10¿C above the specified temperature can reduce the reliability of some systems by as much as 50%. New techniques that are capable of eliminating hot spots in the printed circuit boards with semiconductor chips must be developed. From reliability point of view, the peak temperatures are limited to lower values than in the past. These concerns have generated motivation for research study of forced convection cooling in electronic equipments with printed circuit boards. The flow in these channels is usually low due to small dimensions and so, a number of innovative techniques are imperative to achieve higher heat transfer.VDM Verlag, Dudweiler Landstraße 99, 66123 Saarbrücken 188 pp. Englisch.
Lingua: Inglese
Editore: LAP LAMBERT Academic Publishing, 2013
ISBN 10: 3659472808 ISBN 13: 9783659472800
Da: AHA-BUCH GmbH, Einbeck, Germania
EUR 72,76
Quantità: 1 disponibili
Aggiungi al carrelloTaschenbuch. Condizione: Neu. nach der Bestellung gedruckt Neuware - Printed after ordering - With circuit densities continuing to increase at the rate of 30% per year, the problem associated with the thermal control of electronic devices will continue to multiply. Thermal control of electronic components has one principal objective to maintain relatively constant component temperature equal to or below the specified temperature. For the heat fluxes 1.0 to 10.0 W/cm2, forced air convection may be employed. Investigations have demonstrated that a component operating 10 C above the specified temperature can reduce the reliability of some systems by as much as 50%. New techniques that are capable of eliminating hot spots in the printed circuit boards with semiconductor chips must be developed. From reliability point of view, the peak temperatures are limited to lower values than in the past. These concerns have generated motivation for research study of forced convection cooling in electronic equipments with printed circuit boards. The flow in these channels is usually low due to small dimensions and so, a number of innovative techniques are imperative to achieve higher heat transfer.