Ioannis savidis (2 risultati)

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  • Lingua: Inglese

    Editore: Morgan Kaufmann Pub, 2017

    0124105017 / 9780124105010

    • Brossura

    Da: Revaluation Books, Exeter, Regno UnitoRevaluation Books

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    Condizione: Nuovo

    EUR 134,03

    EUR 23,58 spedizione 
    Spedito da Regno Unito a U.S.A.

    Quantità: 1 disponibile

    Paperback. Condizione: Brand New. 2nd edition. 718 pages. 9.00x7.25x2.00 inches. In Stock.

  • Lingua: Inglese

    Editore: Elsevier Science Jul 2017, 2017

    0124105017 / 9780124105010

    • Brossura
    • Print on Demand

    Da: BuchWeltWeit Ludwig Meier e.K., Bergisch Gladbach, GermaniaBuchWeltWeit Ludwig Meier e.K.

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    Condizione: Nuovo

    EUR 87,95

    EUR 23,00 spedizione 
    Spedito da Germania a U.S.A.

    Quantità: 2 disponibili

    Taschenbuch. Condizione: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -Three-Dimensional Integrated Circuit Design, Second Eition, expands the original with more than twice as much new content, adding the latest developments in circuit models, temperature considerations, power management, memory issues, and heterogeneous integration. 3-D IC experts Pavlidis, Savidis, and Friedman cover the full product development cycle throughout the book, emphasizing not only physical design, but also algorithms and system-level considerations to increase speed while conserving energy. A handy, comprehensive reference or a practical design guide, this book provides effective solutions to specific challenging problems concerning the design of three-dimensional integrated circuits. Expanded with new chapters and updates throughout based on the latest research in 3-D integration: Manufacturing techniques for 3-D ICs with TSVs Electrical modeling and closed-form expressions of through silicon vias Substrate noise coupling in heterogeneous 3-D ICs Design of 3-D ICs with inductive links Synchronization in 3-D ICs Variation effects on 3-D ICs Correlation of WID variations for intra-tier buffers and wires 768 pp. Englisch. …