J eric holmes (46 risultati)

Audio Book (Cassette). Condizione: Near Fine. 1st Edition. Light wear. Tight binding. Edited by Ben Bova. Cover art by Schoenherr for "Enter a Pilgrim" by Gordon R. Dickson. Includes "Stargate" (pt. 3 of 3) by Tak Hallus [Stephen Robinett]; "Paleontology: An Experimental Science" by Robert Olsen; "The Ninth Circle" (novelette) by Robert B. Marcus; "And Keep Us From Our Castles" (novelette) by Cynthia Bunn. Article: "The Split Brain" by J. Eric Holmes, MD. Illustrated by John Schoenherr, Leo Summers, and Kelly Freas. …

Condizione: Very Good. Former library copy. Pages intact with possible writing/highlighting. Binding strong with minor wear. Dust jackets/supplements may not be included. Includes library markings. Stock photo provided. Product includes identifying sticker. Better World Books: Buy Books. Do Good.

Hardcover. Condizione: Good. No Jacket. 13th Edition. red faux leather.

Paperback. Condizione: Fine. facsimile reprint, pristine copy.

SingleIssueMagazine. Condizione: Very Good+ to Near Fine. Vol. XCIII, No. 6. Edited by Ben Bova. Cover art by Schoenherr for "Enter a Pilgrim" by Gordon R. Dickson. Includes "Stargate" (pt. 3 of 3) by Tak Hallus [Stephen Robinett]; "Paleontology: An Experimental Science" by Robert Olsen; "The Ninth Circle" (novelette) by Robert B. Marcus; "And Keep Us From Our Castles" (novelette) by Cynthia Bunn. Article: "The Split Brain" by J. Eric Holmes, MD. Illustrated by John Schoenherr, Leo Summers, and Kelly Freas. Tanning; light wear; minor creasing; accidental pen marks on rear. Book.…

Soft cover. Condizione: Very Good. No Jacket. 1st Edition. Very good condtion. Spine tips are worn. Spine edge is rubbed. Corners are bumped. Remains of small sticker on front cover. Spellminders AD&D playing aid included in center of magazine. Contains a special section on Dwarves.

hardcover. Condizione: Good. Hardcover ex-library with typical marks shows moderate cover wear. Text is unmarked. Ships FAST.

Soft cover. Condizione: Fine. 144 pages : illustrations (chiefly color), color maps ; 26 cm ; ISBN 9781845379162, 1845379160 ; OCLC 172984655 ; color photographic stiff paper wrappers ; Contents: Traditional Japanese gardens -- The elements of a Japanese garden -- Plant directory -- Resources ; Originally published: 2000 ; An introduction to the traditions of Japanese Zen gardens, using natural materials. Emphasizing the value of shape in trees and shrubs with the subtlety of colour through the varied greens of foliage and moss, it explains how western plants and materials can be used to achieve the natural, minimalist look so beloved by Japanese garden designers. ; YOKO KAWAGUCHI was born in Tokyo and educated in the United States, Canada and Japan. She has lived in the UK for the last twenty years. The author of Serene Gardens: Creating Japanese Design and Detail in the Western Garden, she lectures on Japanese garden history, and has appeared on BBC Radio Four's Woman's Hour and the BBC World Service. ; FINE. Book. …

Condizione: As New. Unread book in perfect condition.

Condizione: New.

Condizione: New.

Condizione: New.

Paperback / softback. Condizione: New. New copy - Usually dispatched within 4 working days.

Condizione: New.

Condizione: As New. Unread book in perfect condition.

Condizione: New.

Condizione: New.

Paperback. Condizione: New. The success of future innovative technology relies upon a community with a shared vision. Here, we present an overview of the latest technological progress in the field of printed electronics for use in harsh or extreme environments. Each chapter unlocksscientific and engineering discoveries that will undoubtedly lead to progression from proof of concept to device creation.The main topics covered in this book include some of the most promising materials, methods, and the ability to integrate printed materials with commercial components to provide the basis for the next generation of electronics that are dubbed "survivable" in environments with high g-forces, corrosion, vibration, and large temperature fluctuations. A wide variety of materials are discussed that contribute to robust hybrid electronics, including printable conductive composite inks, ceramics and ceramic matrix composites, polymer-erived ceramics, thin metal films, elastomers, solders and epoxies, to name a few. Collectively, these materials and associated components are used to construct conductive traces, interconnects, antennas, pressure sensors, temperature sensors, power inducting devices, strain sensors and gauges, soft actuators, supercapacitors, piezo ionic elements, resistors, waveguides, filters, electrodes, batteries, various detectors, monitoring devices, transducers, and RF systems and graded dielectric, or graded index (GRIN) structures. New designs that incorporate the electronics as embedded materials into channels, slots and other methods to protect the electronics from the extreme elements of the operational environment are also envisioned to increase their survivability while remaining cognizant of the required frequency of replacement, reapplication and integration of power sources. Lastly, the ability of printer manufacturers, software providers and users to work together to build multi-axis, multi-material and commercial-off-the-shelf (COTS) integration into user-friendly systems will be a great advancement for the field of printed electronics.Therefore, the blueprint for manufacturing resilient hybrid electronics consists of novel designs that exploit the benefits of advances in additive manufacturing that are then efficiently paired with commercially available components to produce devices that exceed known constraints. As a primary example, metals can be deposited onto polymers in a variety of ways, including aerosol jetting, microdispensing, electroplating, sintering, vacuum deposition, supersonic beam cluster deposition, and plasma-based techniques, to name a few. Taking these scientific discoveries and creatively combining them into robotic, multi-material factories of the future could be one shared aim of the printed electronics community toward survivable device creation.…

Paperback. Condizione: Brand New. 186 pages. 9.18x6.12x9.21 inches. In Stock.

Condizione: As New. Unread book in perfect condition.

Condizione: New.

Condizione: New.

Hard Cover. No Jacket. Publisher: Prentice-Hall, 1985, Good, Red Gilt, HB, ISBN: 0-13-701186-5, prev. owner's name inscribed inside front and back covers. Book.

Condizione: As New. Unread book in perfect condition.

Condizione: New.

Hardback. Condizione: New. New copy - Usually dispatched within 4 working days.

Condizione: New. 1st edition NO-PA16APR2015-KAP.

Condizione: New.

Condizione: New.

Paperback. Condizione: New. The success of future innovative technology relies upon a community with a shared vision. Here, we present an overview of the latest technological progress in the field of printed electronics for use in harsh or extreme environments. Each chapter unlocksscientific and engineering discoveries that will undoubtedly lead to progression from proof of concept to device creation.The main topics covered in this book include some of the most promising materials, methods, and the ability to integrate printed materials with commercial components to provide the basis for the next generation of electronics that are dubbed "survivable" in environments with high g-forces, corrosion, vibration, and large temperature fluctuations. A wide variety of materials are discussed that contribute to robust hybrid electronics, including printable conductive composite inks, ceramics and ceramic matrix composites, polymer-erived ceramics, thin metal films, elastomers, solders and epoxies, to name a few. Collectively, these materials and associated components are used to construct conductive traces, interconnects, antennas, pressure sensors, temperature sensors, power inducting devices, strain sensors and gauges, soft actuators, supercapacitors, piezo ionic elements, resistors, waveguides, filters, electrodes, batteries, various detectors, monitoring devices, transducers, and RF systems and graded dielectric, or graded index (GRIN) structures. New designs that incorporate the electronics as embedded materials into channels, slots and other methods to protect the electronics from the extreme elements of the operational environment are also envisioned to increase their survivability while remaining cognizant of the required frequency of replacement, reapplication and integration of power sources. Lastly, the ability of printer manufacturers, software providers and users to work together to build multi-axis, multi-material and commercial-off-the-shelf (COTS) integration into user-friendly systems will be a great advancement for the field of printed electronics.Therefore, the blueprint for manufacturing resilient hybrid electronics consists of novel designs that exploit the benefits of advances in additive manufacturing that are then efficiently paired with commercially available components to produce devices that exceed known constraints. As a primary example, metals can be deposited onto polymers in a variety of ways, including aerosol jetting, microdispensing, electroplating, sintering, vacuum deposition, supersonic beam cluster deposition, and plasma-based techniques, to name a few. Taking these scientific discoveries and creatively combining them into robotic, multi-material factories of the future could be one shared aim of the printed electronics community toward survivable device creation.…