Jun so pak (17 risultati)

Condizione: Very Good. : Este libro aborda el diseño eléctrico de Through Silicon Via (TSV), un componente esencial en la integración 3D de circuitos electrónicos. Explora las características y desafíos del diseño, ofreciendo información valiosa para ingenieros y estudiantes en el campo de la ingeniería electrónica y el diseño de circuitos. EAN: 9789401790376 Tipo: Libros Categoría: Tecnología Título: Electrical Design of Through Silicon Via Autor: Manho Lee| Jun So Pak| Joungho Kim Idioma: eng Páginas: 280 Formato: Tapa dura Año de publicación: 2014.…

Condizione: New. In English.

Condizione: New. pp. 292.

Hardcover. Condizione: Brand New. 2014 edition. 390 pages. 9.50x6.50x1.00 inches. In Stock.

Taschenbuch. Condizione: Neu. Druck auf Anfrage Neuware - Printed after ordering - Through Silicon Via (TSV) is a key technology for realizing three-dimensional integrated circuits (3D ICs) for future high-performance and low-power systems with small form factors. This book covers both qualitative and quantitative approaches to give insights of modeling TSV in a various viewpoints such as signal integrity, power integrity and thermal integrity. Most of the analysis in this book includes simulations, numerical modelings and measurements for verification. The author and co-authors in each chapter have studied deep into TSV for many years and the accumulated technical know-hows and tips for related subjects are comprehensively covered.…

Buch. Condizione: Neu. Druck auf Anfrage Neuware - Printed after ordering - Through Silicon Via (TSV) is a key technology for realizing three-dimensional integrated circuits (3D ICs) for future high-performance and low-power systems with small form factors. This book covers both qualitative and quantitative approaches to give insights of modeling TSV in a various viewpoints such as signal integrity, power integrity and thermal integrity. Most of the analysis in this book includes simulations, numerical modelings and measurements for verification. The author and co-authors in each chapter have studied deep into TSV for many years and the accumulated technical know-hows and tips for related subjects are comprehensively covered.…

Hardcover. Condizione: gut. 2014. Electrical Design of Through Silicon Via In deutscher Sprache. pages.

Paperback. Condizione: Like New. LIKE NEW. SHIPS FROM MULTIPLE LOCATIONS. book.

Condizione: new. Questo è un articolo print on demand.

Buch. Condizione: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -Through Silicon Via (TSV) is a key technology for realizing three-dimensional integrated circuits (3D ICs) for future high-performance and low-power systems with small form factors. This book covers both qualitative and quantitative approaches to give insights of modeling TSV in a various viewpoints such as signal integrity, power integrity and thermal integrity. Most of the analysis in this book includes simulations, numerical modelings and measurements for verification. The author and co-authors in each chapter have studied deep into TSV for many years and the accumulated technical know-hows and tips for related subjects are comprehensively covered. 292 pp. Englisch.…

Condizione: New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. Provides fundamental modeling of TSV which is a very essential part of 3D ICsIncludes both numerical formula analysis and qualitative explanationsApproach from various view points: signal integrity, power integrity and etc.H. …

Condizione: New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. Provides fundamental modeling of TSV which is a very essential part of 3D ICsIncludes both numerical formula analysis and qualitative explanationsApproach from various view points: signal integrity, power integrity and etc.H. …

PAP. Condizione: New. New Book. Shipped from UK. THIS BOOK IS PRINTED ON DEMAND. Established seller since 2000.

Condizione: New. Print on Demand pp. 292 52:B&W 6.14 x 9.21in or 234 x 156mm (Royal 8vo) Case Laminate on White w/Gloss Lam.

Condizione: New. PRINT ON DEMAND pp. 292.

Buch. Condizione: Neu. This item is printed on demand - Print on Demand Titel. Neuware -Through Silicon Via (TSV) is a key technology for realizing three-dimensional integrated circuits (3D ICs) for future high-performance and low-power systems with small form factors. This book covers both qualitative and quantitative approaches to give insights of modeling TSV in a various viewpoints such as signal integrity, power integrity and thermal integrity. Most of the analysis in this book includes simulations, numerical modelings and measurements for verification. The author and co-authors in each chapter have studied deep intoTSV for many years and the accumulated technical know-hows and tips for related subjects are comprehensively covered.Springer-Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg 292 pp. Englisch.…

Taschenbuch. Condizione: Neu. This item is printed on demand - Print on Demand Titel. Neuware -Through Silicon Via (TSV) is a key technology for realizing three-dimensional integrated circuits (3D ICs) for future high-performance and low-power systems with small form factors. This book covers both qualitative and quantitative approaches to give insights of modeling TSV in a various viewpoints such as signal integrity, power integrity and thermal integrity. Most of the analysis in this book includes simulations, numerical modelings and measurements for verification. The author and co-authors in each chapter have studied deep intoTSV for many years and the accumulated technical know-hows and tips for related subjects are comprehensively covered.Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg 292 pp. Englisch.…