K sreenivas rao (27 risultati)
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Editore: Springer, Berlin|Springer Nature Singapore|Springer, 2023
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Innovations in Signal Processing and Embedded Systems : Proceedings of Icispes 2021
Mandal, Jyotsna Kumar (EDT); Hinchey, Mike (EDT); Rao, K. Sreenivas (EDT)
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Hardcover. Condizione: new. Hardcover. This book covers four sections such as artificial intelligence and machine learning; VLSI and signal processing; robotics and automation; and communications and networking. This book is a collection of selected papers presented at the First International Conference on Innovations in Signal…Processing and Embedded Systems (ICISPES 2021), organized by MLR Institute of Technology, Hyderabad, India, during October 2223, 2021. The topics covered are advanced communication technologies, IoT-based systems and applications, application AI in computer vision, natural language processing, reinforcement learning, ANN and deep neural networks, RNN, GAN, CNN and RBM, SOC, NOC design, VLSI and CAD/CAM, cross-layer design, fault tolerance and computation theories, FPGA in outer space, nanotechnology, semiconductor technology, signal and image processing, high-performance computing, pattern recognition and computer vision innovations in robotics, reconfigurable robots, and MEMS/NEMS. Shipping may be from multiple locations in the US or from the UK, depending on stock availability.
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Innovations in Signal Processing and Embedded Systems : Proceedings of Icispes 2021
Mandal, Jyotsna Kumar (EDT); Hinchey, Mike (EDT); Rao, K. Sreenivas (EDT)
Lingua: Inglese
Editore: Springer, 2022
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Editore: Springer, 2023
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Taschenbuch. Condizione: Neu. Innovations in Signal Processing and Embedded Systems | Proceedings of ICISPES 2021 | Jyotsna Kumar Mandal (u. a.) | Taschenbuch | Algorithms for Intelligent Systems | xiv | Englisch | 2023 | Springer | EAN 9789811916717 | Verantwortliche Person für die EU: Springer Verlag GmbH, Tiergartenstr. 17, 6…9121 Heidelberg, juergen[dot]hartmann[at]springer[dot]com | Anbieter: preigu.
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Condizione: Hervorragend. Zustand: Hervorragend | Seiten: 512 | Sprache: Englisch | Produktart: Bücher | This book covers four sections such as artificial intelligence and machine learning; VLSI and signal processing; robotics and automation; and communications and networking. This book is a collection of selected papers present…ed at the First International Conference on Innovations in Signal Processing and Embedded Systems (ICISPES 2021), organized by MLR Institute of Technology, Hyderabad, India, during October 22¿23, 2021. The topics covered are advanced communication technologies, IoT-based systems and applications, application AI in computer vision, natural language processing, reinforcement learning, ANN and deep neural networks, RNN, GAN, CNN and RBM, SOC, NOC design, VLSI and CAD/CAM, cross-layer design, fault tolerance and computation theories, FPGA in outer space, nanotechnology, semiconductor technology, signal and image processing, high-performance computing, pattern recognition and computer vision innovations in robotics, reconfigurable robots, and MEMS/NEMS.
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Buch. Condizione: Neu. Druck auf Anfrage Neuware - Printed after ordering - This book covers four sections such as artificial intelligence andmachine learning; VLSI and signal processing; robotics and automation; and communications and networking.This book is a collection of selected papers presented at the First International C…onference on Innovations in Signal Processing and Embedded Systems (ICISPES 2021), organized by MLR Institute of Technology, Hyderabad, India, during October 22-23, 2021. The topics covered are advanced communication technologies, IoT-based systems and applications, application AI in computer vision, natural language processing, reinforcement learning, ANN and deep neural networks, RNN, GAN, CNN and RBM,SOC, NOC design, VLSI and CAD/CAM, cross-layer design, fault tolerance and computation theories, FPGA in outer space, nanotechnology, semiconductor technology, signal and image processing, high-performance computing, pattern recognition and computer visioninnovations in robotics, reconfigurable robots, and MEMS/NEMS.
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Lingua: Inglese
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Taschenbuch. Condizione: Neu. Druck auf Anfrage Neuware - Printed after ordering - This book covers four sections such as artificial intelligence andmachine learning; VLSI and signal processing; robotics and automation; and communications and networking.This book is a collection of selected papers presented at the First Internat…ional Conference on Innovations in Signal Processing and Embedded Systems (ICISPES 2021), organized by MLR Institute of Technology, Hyderabad, India, during October 22-23, 2021. The topics covered are advanced communication technologies, IoT-based systems and applications, application AI in computer vision, natural language processing, reinforcement learning, ANN and deep neural networks, RNN, GAN, CNN and RBM,SOC, NOC design, VLSI and CAD/CAM, cross-layer design, fault tolerance and computation theories, FPGA in outer space, nanotechnology, semiconductor technology, signal and image processing, high-performance computing, pattern recognition and computer visioninnovations in robotics, reconfigurable robots, and MEMS/NEMS.
Innovations in Signal Processing and Embedded Systems: Proceedings of Icispes 2021
Mandal, Jyotsna Kumar (Editor)/ Hinchey, Mike (Editor)/ Rao, K. Sreenivas (Editor)
Lingua: Inglese
Editore: Springer Nature, 2022
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Hardcover. Condizione: Brand New. 512 pages. 9.25x6.10x1.26 inches. In Stock.
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Condizione: New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. Autor/Autorin: Gopal Krishna U.B.B.E: Mechanical Engineering from Malnad College of Engineering, Hassan VTU,Karnataka , India.M.Tech: Studied Manufacturing Science and Engineering at Siddaganga Institute of Technolog…y, Tumkur,karnataka, India.Assis.
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Taschenbuch. Condizione: Neu. nach der Bestellung gedruckt Neuware - Printed after ordering - Metal Matrix Composites (MMCs) have been developed to meet the demand for lighter materials with high specific strength, stiffness and wear resistance properties. Particulate reinforced aluminium matrix composites (AMCs) are attractive…materials due to their strength, ductility and toughness. Their ability to be produced by conventional methods adds to the advantage. The aluminium matrix can be strengthened by reinforcing with hard ceramic particles like SiC, Al2O3 and B4C etc. Judicious selection of the variables is important to optimize the properties of composites. In this work an effort is made to enhance the mechanical properties like tensile strength and hardness of AMCs by reinforcing 6061Al matrix with B4C particles. By stir casting route, aluminium matrix was reinforced with boron carbide particulates of 37, 44, 63, 105, 250µ sizes. The micro-structure and mechanical properties of the fabricated AMCs were analyzed. The optical micro-structure images reveal the homogeneous dispersion of B4C particles in the matrix. The tensile strength and hardness were found to increase with the increase in the particle size.
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Taschenbuch. Condizione: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -This book covers four sections such as artificial intelligence andmachine learning; VLSI and signal processing; robotics and automation; and communications and networking.This book is a collection of selected papers presented at th…e First International Conference on Innovations in Signal Processing and Embedded Systems (ICISPES 2021), organized by MLR Institute of Technology, Hyderabad, India, during October 22-23, 2021. The topics covered are advanced communication technologies, IoT-based systems and applications, application AI in computer vision, natural language processing, reinforcement learning, ANN and deep neural networks, RNN, GAN, CNN and RBM,SOC, NOC design, VLSI and CAD/CAM, cross-layer design, fault tolerance and computation theories, FPGA in outer space, nanotechnology, semiconductor technology, signal and image processing, high-performance computing, pattern recognition and computer visioninnovations in robotics, reconfigurable robots, and MEMS/NEMS. 512 pp. Englisch.
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Da: BuchWeltWeit Ludwig Meier e.K., Bergisch Gladbach, GermaniaBuchWeltWeit Ludwig Meier e.K.
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Buch. Condizione: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -This book covers four sections such as artificial intelligence andmachine learning; VLSI and signal processing; robotics and automation; and communications and networking.This book is a collection of selected papers presented at the First… International Conference on Innovations in Signal Processing and Embedded Systems (ICISPES 2021), organized by MLR Institute of Technology, Hyderabad, India, during October 22-23, 2021. The topics covered are advanced communication technologies, IoT-based systems and applications, application AI in computer vision, natural language processing, reinforcement learning, ANN and deep neural networks, RNN, GAN, CNN and RBM,SOC, NOC design, VLSI and CAD/CAM, cross-layer design, fault tolerance and computation theories, FPGA in outer space, nanotechnology, semiconductor technology, signal and image processing, high-performance computing, pattern recognition and computer visioninnovations in robotics, reconfigurable robots, and MEMS/NEMS. 512 pp. Englisch.
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Taschenbuch. Condizione: Neu. This item is printed on demand - Print on Demand Titel. Neuware -This book covers four sections such as artificial intelligence and machine learning; VLSI and signal processing; robotics and automation; and communications and networking. This book is a collection of selected papers presented at the…First International Conference on Innovations in Signal Processing and Embedded Systems (ICISPES 2021), organized by MLR Institute of Technology, Hyderabad, India, during October 22-23, 2021. The topics covered are advanced communication technologies, IoT-based systems and applications, application AI in computer vision, natural language processing, reinforcement learning, ANN and deep neural networks, RNN, GAN, CNN and RBM, SOC, NOC design, VLSI and CAD/CAM, cross-layer design, fault tolerance and computation theories, FPGA in outer space, nanotechnology, semiconductor technology, signal and image processing, high-performance computing, pattern recognition and computer vision innovations in robotics, reconfigurable robots, and MEMS/NEMS.Springer-Verlag KG, Sachsenplatz 4-6, 1201 Wien 512 pp. Englisch.
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Buch. Condizione: Neu. This item is printed on demand - Print on Demand Titel. Neuware -This book covers four sections such as artificial intelligence and machine learning; VLSI and signal processing; robotics and automation; and communications and networking. This book is a collection of selected papers presented at the First I…nternational Conference on Innovations in Signal Processing and Embedded Systems (ICISPES 2021), organized by MLR Institute of Technology, Hyderabad, India, during October 22-23, 2021. The topics covered are advanced communication technologies, IoT-based systems and applications, application AI in computer vision, natural language processing, reinforcement learning, ANN and deep neural networks, RNN, GAN, CNN and RBM, SOC, NOC design, VLSI and CAD/CAM, cross-layer design, fault tolerance and computation theories, FPGA in outer space, nanotechnology, semiconductor technology, signal and image processing, high-performance computing, pattern recognition and computer vision innovations in robotics, reconfigurable robots, and MEMS/NEMS.Springer-Verlag KG, Sachsenplatz 4-6, 1201 Wien 512 pp. Englisch.
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Condizione: New. PRINT ON DEMAND pp. 512.
