Da: Books Puddle, New York, NY, U.S.A.
Condizione: New. pp. 236.
Da: Books Puddle, New York, NY, U.S.A.
Condizione: New. pp. 223.
Da: Revaluation Books, Exeter, Regno Unito
EUR 83,63
Quantità: 1 disponibili
Aggiungi al carrelloPaperback. Condizione: Brand New. rep rev edition. 240 pages. 9.25x6.10x0.63 inches. In Stock.
Lingua: Inglese
Editore: Springer International Publishing, Springer International Publishing Sep 2016, 2016
ISBN 10: 331946096X ISBN 13: 9783319460963
Da: buchversandmimpf2000, Emtmannsberg, BAYE, Germania
EUR 53,49
Quantità: 2 disponibili
Aggiungi al carrelloBuch. Condizione: Neu. Neuware -This book contains extended and revised versions of the best papers presented at the 23rd IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2015, held in Daejeon, Korea, in October 2015. The 10 papers included in the book were carefully reviewed and selected from the 44 full papers presented at the conference. The papers cover a wide range of topics in VLSI technology and advanced research. They address the current trend toward increasing chip integration and technology process advancements bringing about new challenges both at the physical and system-design levels, as well as in the test of these systems.Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg 240 pp. Englisch.
Lingua: Inglese
Editore: Springer International Publishing, Springer International Publishing Apr 2018, 2018
ISBN 10: 3319834401 ISBN 13: 9783319834405
Da: buchversandmimpf2000, Emtmannsberg, BAYE, Germania
EUR 53,49
Quantità: 2 disponibili
Aggiungi al carrelloTaschenbuch. Condizione: Neu. Neuware -This book contains extended and revised versions of the best papers presented at the 23rd IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2015, held in Daejeon, Korea, in October 2015. The 10 papers included in the book were carefully reviewed and selected from the 44 full papers presented at the conference. The papers cover a wide range of topics in VLSI technology and advanced research. They address the current trend toward increasing chip integration and technology process advancements bringing about new challenges both at the physical and system-design levels, as well as in the test of these systems.Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg 240 pp. Englisch.
Lingua: Inglese
Editore: Springer International Publishing, Springer International Publishing, 2018
ISBN 10: 3319834401 ISBN 13: 9783319834405
Da: AHA-BUCH GmbH, Einbeck, Germania
EUR 53,49
Quantità: 1 disponibili
Aggiungi al carrelloTaschenbuch. Condizione: Neu. Druck auf Anfrage Neuware - Printed after ordering - This book contains extended and revised versions of the best papers presented at the 23rd IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2015, held in Daejeon, Korea, in October 2015. The 10 papers included in the book were carefully reviewed and selected from the 44 full papers presented at the conference. The papers cover a wide range of topics in VLSI technology and advanced research. They address the current trend toward increasing chip integration and technology process advancements bringing about new challenges both at the physical and system-design levels, as well as in the test of these systems.
Lingua: Inglese
Editore: Springer International Publishing, 2016
ISBN 10: 331946096X ISBN 13: 9783319460963
Da: AHA-BUCH GmbH, Einbeck, Germania
EUR 53,49
Quantità: 1 disponibili
Aggiungi al carrelloBuch. Condizione: Neu. Druck auf Anfrage Neuware - Printed after ordering - This book contains extended and revised versions of the best papers presented at the 23rd IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2015, held in Daejeon, Korea, in October 2015. The 10 papers included in the book were carefully reviewed and selected from the 44 full papers presented at the conference. The papers cover a wide range of topics in VLSI technology and advanced research. They address the current trend toward increasing chip integration and technology process advancements bringing about new challenges both at the physical and system-design levels, as well as in the test of these systems.
EUR 106,35
Quantità: Più di 20 disponibili
Aggiungi al carrelloHardcover. Condizione: New.
EUR 119,31
Quantità: 3 disponibili
Aggiungi al carrelloCondizione: New. pp. 220.
Condizione: New. pp. 220.
Da: Mispah books, Redhill, SURRE, Regno Unito
EUR 106,27
Quantità: 1 disponibili
Aggiungi al carrelloPaperback. Condizione: New. NEW. SHIPS FROM MULTIPLE LOCATIONS. book.
Da: Lucky's Textbooks, Dallas, TX, U.S.A.
EUR 128,96
Quantità: Più di 20 disponibili
Aggiungi al carrelloCondizione: New.
Da: Mispah books, Redhill, SURRE, Regno Unito
EUR 113,43
Quantità: 1 disponibili
Aggiungi al carrelloHardcover. Condizione: Like New. Like New. book.
EUR 136,08
Quantità: Più di 20 disponibili
Aggiungi al carrelloCondizione: New.
EUR 134,21
Quantità: 3 disponibili
Aggiungi al carrelloCondizione: New. pp. 220.
Da: Ria Christie Collections, Uxbridge, Regno Unito
EUR 136,48
Quantità: Più di 20 disponibili
Aggiungi al carrelloCondizione: New. In.
Da: Ria Christie Collections, Uxbridge, Regno Unito
EUR 136,48
Quantità: Più di 20 disponibili
Aggiungi al carrelloCondizione: New. In.
EUR 138,69
Quantità: Più di 20 disponibili
Aggiungi al carrelloCondizione: New.
Da: California Books, Miami, FL, U.S.A.
EUR 158,66
Quantità: Più di 20 disponibili
Aggiungi al carrelloCondizione: New.
EUR 144,85
Quantità: Più di 20 disponibili
Aggiungi al carrelloCondizione: New. In.
EUR 162,77
Quantità: Più di 20 disponibili
Aggiungi al carrelloCondizione: As New. Unread book in perfect condition.
Da: Kennys Bookshop and Art Galleries Ltd., Galway, GY, Irlanda
EUR 162,52
Quantità: 15 disponibili
Aggiungi al carrelloCondizione: New. 2022. Hardcover. . . . . .
Da: Books Puddle, New York, NY, U.S.A.
Condizione: New. 1st ed. 2022 edition NO-PA16APR2015-KAP.
Da: Books Puddle, New York, NY, U.S.A.
Condizione: New. 1st ed. 2022 edition NO-PA16APR2015-KAP.
EUR 164,55
Quantità: Più di 20 disponibili
Aggiungi al carrelloCondizione: As New. Unread book in perfect condition.
Lingua: Inglese
Editore: Elsevier Science Publishing Co Inc, US, 2015
ISBN 10: 0124201407 ISBN 13: 9780124201408
Da: Rarewaves.com USA, London, LONDO, Regno Unito
EUR 188,07
Quantità: Più di 20 disponibili
Aggiungi al carrelloHardback. Condizione: New. This book is the first to cover the recently developed MPEG-V standard, explaining the fundamentals of each part of the technology and exploring potential applications. Written by experts in the field who were instrumental in the development of the standard, this book goes beyond the scope of the official standard documentation, describing how to use the technology in a practical context and how to combine it with other information such as audio, video, images, and text. Each chapter follows an easy-to-understand format, first examining how each part of the standard is composed, then covers intended uses and applications for each particular effect. With this book, you will learn how to: Use the MPEG-V standard to develop applications Develop systems for various use cases using MPEG-V Synchronize the virtual world and real world Create and render sensory effects for media Understand and use MPEG-V for the research of new types of media related technology and services.
Da: Revaluation Books, Exeter, Regno Unito
EUR 192,58
Quantità: 2 disponibili
Aggiungi al carrelloPaperback. Condizione: Brand New. 478 pages. 8.27x5.83x1.07 inches. In Stock.
Da: Revaluation Books, Exeter, Regno Unito
EUR 193,73
Quantità: 2 disponibili
Aggiungi al carrelloHardcover. Condizione: Brand New. 478 pages. 8.27x5.83x1.06 inches. In Stock.
EUR 160,98
Quantità: Più di 20 disponibili
Aggiungi al carrelloGebunden. Condizione: New. Covers the developed MPEG-V standard, explaining the fundamentals of each part of the technology and exploring potential applications. This book goes beyond the scope of the official standard documentation, describing how to use the technology in a practica.
Da: Kennys Bookstore, Olney, MD, U.S.A.
Condizione: New. 2022. Hardcover. . . . . . Books ship from the US and Ireland.