Da: Books Puddle, New York, NY, U.S.A.
Condizione: New. pp. 236.
Da: Books Puddle, New York, NY, U.S.A.
Condizione: New. pp. 223.
Da: GreatBookPrices, Columbia, MD, U.S.A.
Condizione: New.
Da: PBShop.store US, Wood Dale, IL, U.S.A.
PAP. Condizione: New. New Book. Shipped from UK. Established seller since 2000.
Da: Revaluation Books, Exeter, Regno Unito
EUR 85,24
Quantità: 1 disponibili
Aggiungi al carrelloPaperback. Condizione: Brand New. rep rev edition. 240 pages. 9.25x6.10x0.63 inches. In Stock.
Da: PBShop.store UK, Fairford, GLOS, Regno Unito
EUR 92,92
Quantità: 1 disponibili
Aggiungi al carrelloPAP. Condizione: New. New Book. Shipped from UK. Established seller since 2000.
Da: GreatBookPrices, Columbia, MD, U.S.A.
Condizione: As New. Unread book in perfect condition.
Da: GreatBookPricesUK, Woodford Green, Regno Unito
EUR 92,91
Quantità: 1 disponibili
Aggiungi al carrelloCondizione: New.
Da: Ria Christie Collections, Uxbridge, Regno Unito
EUR 100,18
Quantità: Più di 20 disponibili
Aggiungi al carrelloCondizione: New. In.
Lingua: Inglese
Editore: Springer International Publishing, Springer International Publishing, 2018
ISBN 10: 3319834401 ISBN 13: 9783319834405
Da: AHA-BUCH GmbH, Einbeck, Germania
EUR 53,49
Quantità: 1 disponibili
Aggiungi al carrelloTaschenbuch. Condizione: Neu. Druck auf Anfrage Neuware - Printed after ordering - This book contains extended and revised versions of the best papers presented at the 23rd IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2015, held in Daejeon, Korea, in October 2015. The 10 papers included in the book were carefully reviewed and selected from the 44 full papers presented at the conference. The papers cover a wide range of topics in VLSI technology and advanced research. They address the current trend toward increasing chip integration and technology process advancements bringing about new challenges both at the physical and system-design levels, as well as in the test of these systems.
Lingua: Inglese
Editore: Springer International Publishing, 2016
ISBN 10: 331946096X ISBN 13: 9783319460963
Da: AHA-BUCH GmbH, Einbeck, Germania
EUR 53,49
Quantità: 1 disponibili
Aggiungi al carrelloBuch. Condizione: Neu. Druck auf Anfrage Neuware - Printed after ordering - This book contains extended and revised versions of the best papers presented at the 23rd IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2015, held in Daejeon, Korea, in October 2015. The 10 papers included in the book were carefully reviewed and selected from the 44 full papers presented at the conference. The papers cover a wide range of topics in VLSI technology and advanced research. They address the current trend toward increasing chip integration and technology process advancements bringing about new challenges both at the physical and system-design levels, as well as in the test of these systems.
Da: GreatBookPricesUK, Woodford Green, Regno Unito
EUR 106,51
Quantità: 1 disponibili
Aggiungi al carrelloCondizione: As New. Unread book in perfect condition.
Da: preigu, Osnabrück, Germania
EUR 50,35
Quantità: 5 disponibili
Aggiungi al carrelloTaschenbuch. Condizione: Neu. VLSI-SoC: Design for Reliability, Security, and Low Power | 23rd IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2015, Daejeon, Korea, October 5-7, 2015, Revised Selected Papers | Youngsoo Shin (u. a.) | Taschenbuch | IFIP Advances in Information and Communication Technology | xiii | Englisch | 2018 | Springer | EAN 9783319834405 | Verantwortliche Person für die EU: Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg, juergen[dot]hartmann[at]springer[dot]com | Anbieter: preigu.
Lingua: Inglese
Editore: Springer Nature Switzerland AG, CH, 2019
ISBN 10: 3030094553 ISBN 13: 9783030094553
Da: Rarewaves.com USA, London, LONDO, Regno Unito
EUR 125,25
Quantità: 1 disponibili
Aggiungi al carrelloPaperback. Condizione: New. Softcover Reprint of the Original 1st 2018 ed.
Da: Ria Christie Collections, Uxbridge, Regno Unito
EUR 115,68
Quantità: Più di 20 disponibili
Aggiungi al carrelloCondizione: New. In.
Da: Revaluation Books, Exeter, Regno Unito
EUR 117,74
Quantità: 1 disponibili
Aggiungi al carrelloPaperback. Condizione: Brand New. reprint edition. 9.25x6.10 inches. In Stock.
Da: Mispah books, Redhill, SURRE, Regno Unito
EUR 106,27
Quantità: 1 disponibili
Aggiungi al carrelloPaperback. Condizione: New. NEW. SHIPS FROM MULTIPLE LOCATIONS. book.
Da: Books Puddle, New York, NY, U.S.A.
Condizione: New. pp. 152.
Da: Mispah books, Redhill, SURRE, Regno Unito
EUR 113,43
Quantità: 1 disponibili
Aggiungi al carrelloHardcover. Condizione: Like New. Like New. book.
Lingua: Inglese
Editore: Springer International Publishing, 2019
ISBN 10: 3030094553 ISBN 13: 9783030094553
Da: moluna, Greven, Germania
EUR 106,22
Quantità: 1 disponibili
Aggiungi al carrelloCondizione: New. Introduces a highly promising patterning solution for next generation technologyProvides a comprehensive overview of directed self-assembly lithography (DSAL) friendly physical design and DSAL-aware mask synthesis Written by leading .
Da: Revaluation Books, Exeter, Regno Unito
EUR 153,46
Quantità: 2 disponibili
Aggiungi al carrelloHardcover. Condizione: Brand New. 152 pages. 9.25x6.10x0.32 inches. In Stock.
Lingua: Inglese
Editore: Springer International Publishing, Springer International Publishing, 2019
ISBN 10: 3030094553 ISBN 13: 9783030094553
Da: AHA-BUCH GmbH, Einbeck, Germania
EUR 106,99
Quantità: 1 disponibili
Aggiungi al carrelloTaschenbuch. Condizione: Neu. Druck auf Anfrage Neuware - Printed after ordering - This book discusses physical design and mask synthesis of directed self-assembly lithography (DSAL). It covers the basic background of DSAL technology, physical design optimizations such as placement and redundant via insertion, and DSAL mask synthesis as well as its verification. Directed self-assembly lithography (DSAL) is a highly promising patterning solution in sub-7nm technology.
Lingua: Inglese
Editore: Springer International Publishing, 2018
ISBN 10: 3319762931 ISBN 13: 9783319762937
Da: AHA-BUCH GmbH, Einbeck, Germania
EUR 106,99
Quantità: 1 disponibili
Aggiungi al carrelloBuch. Condizione: Neu. Druck auf Anfrage Neuware - Printed after ordering - This book discusses physical design and mask synthesis of directed self-assembly lithography (DSAL). It covers the basic background of DSAL technology, physical design optimizations such as placement and redundant via insertion, and DSAL mask synthesis as well as its verification. Directed self-assembly lithography (DSAL) is a highly promising patterning solution in sub-7nm technology.
Lingua: Inglese
Editore: Springer Nature Switzerland AG, CH, 2019
ISBN 10: 3030094553 ISBN 13: 9783030094553
Da: Rarewaves.com UK, London, Regno Unito
EUR 117,67
Quantità: 1 disponibili
Aggiungi al carrelloPaperback. Condizione: New. Softcover Reprint of the Original 1st 2018 ed.
Da: Mispah books, Redhill, SURRE, Regno Unito
EUR 180,29
Quantità: 1 disponibili
Aggiungi al carrelloPaperback. Condizione: New. NEW. SHIPS FROM MULTIPLE LOCATIONS. book.
Da: Brook Bookstore On Demand, Napoli, NA, Italia
EUR 46,22
Quantità: Più di 20 disponibili
Aggiungi al carrelloCondizione: new. Questo è un articolo print on demand.
Da: Brook Bookstore On Demand, Napoli, NA, Italia
EUR 46,22
Quantità: Più di 20 disponibili
Aggiungi al carrelloCondizione: new. Questo è un articolo print on demand.
Lingua: Inglese
Editore: Springer International Publishing Sep 2016, 2016
ISBN 10: 331946096X ISBN 13: 9783319460963
Da: BuchWeltWeit Ludwig Meier e.K., Bergisch Gladbach, Germania
EUR 53,49
Quantità: 2 disponibili
Aggiungi al carrelloBuch. Condizione: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -This book contains extended and revised versions of the best papers presented at the 23rd IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2015, held in Daejeon, Korea, in October 2015. The 10 papers included in the book were carefully reviewed and selected from the 44 full papers presented at the conference. The papers cover a wide range of topics in VLSI technology and advanced research. They address the current trend toward increasing chip integration and technology process advancements bringing about new challenges both at the physical and system-design levels, as well as in the test of these systems. 240 pp. Englisch.
Lingua: Inglese
Editore: Springer International Publishing Apr 2018, 2018
ISBN 10: 3319834401 ISBN 13: 9783319834405
Da: BuchWeltWeit Ludwig Meier e.K., Bergisch Gladbach, Germania
EUR 53,49
Quantità: 2 disponibili
Aggiungi al carrelloTaschenbuch. Condizione: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -This book contains extended and revised versions of the best papers presented at the 23rd IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2015, held in Daejeon, Korea, in October 2015. The 10 papers included in the book were carefully reviewed and selected from the 44 full papers presented at the conference. The papers cover a wide range of topics in VLSI technology and advanced research. They address the current trend toward increasing chip integration and technology process advancements bringing about new challenges both at the physical and system-design levels, as well as in the test of these systems. 240 pp. Englisch.
Da: Majestic Books, Hounslow, Regno Unito
EUR 77,26
Quantità: 4 disponibili
Aggiungi al carrelloCondizione: New. Print on Demand pp. 236.