Loganathan arulmurugan (13 risultati)
A Transient Study on Heat Dissipation Problem in Microelectronics: An overview of thermal management for next generation microelectronic devices
Loganathan, Arulmurugan; S, Raghavendraprabhu; C, Muthumohan
- Brossura
Da: California Books, Miami, FL, U.S.A.California Books
Contatta il venditoreVenditore con 4 stelleCondizione: Nuovo
EUR 43,36
Spedizione gratuitaSpedito in U.S.A.Quantità: Più di 20 disponibili
Condizione: New.
A Transient Study on Heat Dissipation Problem in Microelectronics: An overview of thermal management for next generation microelectronic devices
Loganathan, Arulmurugan; S, Raghavendraprabhu; C, Muthumohan
- Brossura
Da: Ria Christie Collections, Uxbridge, Regno UnitoRia Christie Collections
Contatta il venditoreVenditore con 5 stelleCondizione: Nuovo
EUR 39,81
EUR 14,06 spedizioneSpedito da Regno Unito a U.S.A.Quantità: Più di 20 disponibili
Condizione: New. In.
- Brossura
Da: Chiron Media, Wallingford, Regno UnitoChiron Media
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EUR 36,89
EUR 18,18 spedizioneSpedito da Regno Unito a U.S.A.Quantità: 10 disponibili
Paperback. Condizione: New.
A Transient Study on Heat Dissipation Problem in Microelectronics: An overview of thermal management for next generation microelectronic devices
Loganathan, Arulmurugan; S, Raghavendraprabhu; C, Muthumohan
- Brossura
Da: Books Puddle, New York, NY, U.S.A.Books Puddle
Contatta il venditoreVenditore con 4 stelleCondizione: Nuovo
EUR 67,11
EUR 3,50 spedizioneSpedito in U.S.A.Quantità: 4 disponibili
Condizione: New.
Altre immagini- Brossura
Da: preigu, Osnabrück, Germaniapreigu
Contatta il venditoreVenditore con 5 stelleCondizione: Nuovo
EUR 36,35
EUR 70,00 spedizioneSpedito da Germania a U.S.A.Quantità: 5 disponibili
Taschenbuch. Condizione: Neu. A Transient Study on Heat Dissipation Problem in Microelectronics | An overview of thermal management for next generation microelectronic devices | Arulmurugan Loganathan (u. a.) | Taschenbuch | 52 S. | Englisch | 2020 | LAP LAMBERT Academic Publishing | EAN 9786202556989 | Verantwortliche Person fü…r die EU: preigu GmbH & Co. KG, Lengericher Landstr. 19, 49078 Osnabrück, mail[at]preigu[dot]de | Anbieter: preigu.
- Brossura
- Print on Demand
Da: PBShop.store US, Wood Dale, IL, U.S.A.PBShop.store US
Contatta il venditoreVenditore con 5 stelleCondizione: Nuovo
EUR 42,88
Spedizione gratuitaSpedito in U.S.A.Quantità: Più di 20 disponibili
PAP. Condizione: New. New Book. Shipped from UK. THIS BOOK IS PRINTED ON DEMAND. Established seller since 2000.
- Brossura
- Print on Demand
Da: PBShop.store UK, Fairford, GLOS, Regno UnitoPBShop.store UK
Contatta il venditoreVenditore con 5 stelleCondizione: Nuovo
EUR 41,88
EUR 3,86 spedizioneSpedito da Regno Unito a U.S.A.Quantità: Più di 20 disponibili
PAP. Condizione: New. New Book. Delivered from our UK warehouse in 4 to 14 business days. THIS BOOK IS PRINTED ON DEMAND. Established seller since 2000.
- Brossura
- Print on Demand
Da: BuchWeltWeit Ludwig Meier e.K., Bergisch Gladbach, GermaniaBuchWeltWeit Ludwig Meier e.K.
Contatta il venditoreVenditore con 5 stelleCondizione: Nuovo
EUR 39,90
EUR 23,00 spedizioneSpedito da Germania a U.S.A.Quantità: 2 disponibili
Taschenbuch. Condizione: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -The concern about thermal performance of microelectronics is on the increase due to recent over-heating induced failures which have led to product recalls. Removal of excess heat from microelectronic systems with the use of heat si…nks could improve thermal efficiency of the system. Challenges posed for the modeling of thermal phenomena in microelectronics from optimizing IC packaging thermal performance, assembly processes and reliability testing to predicting operational temperature in application environments. Precise thermal analysis is essential for designing an effective thermal management system of modern electronic devices such as batteries, LEDs, microelectronics, ICs, circuit boards, semiconductors and heat spreaders. The need for smaller, faster and lighter products has put considerable demands on the thermal management of microelectronics. This paper outlines the issues in thermal management of consumer and aerospace electronics. Some typical solutions for complex high-end systems are presented. The role of the thermal interface material is a key to the thermal management of high performance consumer electronics. 52 pp. Englisch.
A Transient Study on Heat Dissipation Problem in Microelectronics: An overview of thermal management for next generation microelectronic devices
Loganathan, Arulmurugan; S, Raghavendraprabhu; C, Muthumohan
- Brossura
- Print on Demand
Da: Majestic Books, Hounslow, Regno UnitoMajestic Books
Contatta il venditoreVenditore con 4 stelleCondizione: Nuovo
EUR 66,47
EUR 7,63 spedizioneSpedito da Regno Unito a U.S.A.Quantità: 4 disponibili
Condizione: New. Print on Demand.
A Transient Study on Heat Dissipation Problem in Microelectronics: An overview of thermal management for next generation microelectronic devices
Loganathan, Arulmurugan; S, Raghavendraprabhu; C, Muthumohan
- Brossura
- Print on Demand
Da: Biblios, frankfurt am main, HESSE, GermaniaBiblios
Contatta il venditoreVenditore con 4 stelleCondizione: Nuovo
EUR 68,37
EUR 9,95 spedizioneSpedito da Germania a U.S.A.Quantità: 4 disponibili
Condizione: New. PRINT ON DEMAND.
- Brossura
- Print on Demand
Da: moluna, Greven, Germaniamoluna
Contatta il venditoreVenditore con 5 stelleCondizione: Nuovo
EUR 34,25
EUR 48,99 spedizioneSpedito da Germania a U.S.A.Quantità: Più di 20 disponibili
Condizione: New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. Autor/Autorin: Loganathan ArulmuruganArulmurugan Loganathan is working as an Assistant Professor in the Department of Electronics and Communication Engineering, Bannari Amman Institute of Technology, Sathyamangalam,…Erode, Tamilnadu, India. His res.
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- Print on Demand
Da: buchversandmimpf2000, Emtmannsberg, BAYE, Germaniabuchversandmimpf2000
Contatta il venditoreVenditore con 5 stelleCondizione: Nuovo
EUR 39,90
EUR 60,00 spedizioneSpedito da Germania a U.S.A.Quantità: 1 disponibili
Taschenbuch. Condizione: Neu. This item is printed on demand - Print on Demand Titel. Neuware -The concern about thermal performance of microelectronics is on the increase due to recent over-heating induced failures which have led to product recalls. Removal of excess heat from microelectronic systems with the use of heat sinks…could improve thermal efficiency of the system. Challenges posed for the modeling of thermal phenomena in microelectronics from optimizing IC packaging thermal performance, assembly processes and reliability testing to predicting operational temperature in application environments. Precise thermal analysis is essential for designing an effective thermal management system of modern electronic devices such as batteries, LEDs, microelectronics, ICs, circuit boards, semiconductors and heat spreaders. The need for smaller, faster and lighter products has put considerable demands on the thermal management of microelectronics. This paper outlines the issues in thermal management of consumer and aerospace electronics. Some typical solutions for complex high-end systems are presented. The role of the thermal interface material is a key to the thermal management of high performance consumer electronics.VDM Verlag, Dudweiler Landstraße 99, 66123 Saarbrücken 52 pp. Englisch.
- Brossura
- Print on Demand
Da: AHA-BUCH GmbH, Einbeck, GermaniaAHA-BUCH GmbH
Contatta il venditoreVenditore con 5 stelleCondizione: Nuovo
EUR 40,89
EUR 60,48 spedizioneSpedito da Germania a U.S.A.Quantità: 1 disponibili
Taschenbuch. Condizione: Neu. nach der Bestellung gedruckt Neuware - Printed after ordering - The concern about thermal performance of microelectronics is on the increase due to recent over-heating induced failures which have led to product recalls. Removal of excess heat from microelectronic systems with the use of heat sinks c…ould improve thermal efficiency of the system. Challenges posed for the modeling of thermal phenomena in microelectronics from optimizing IC packaging thermal performance, assembly processes and reliability testing to predicting operational temperature in application environments. Precise thermal analysis is essential for designing an effective thermal management system of modern electronic devices such as batteries, LEDs, microelectronics, ICs, circuit boards, semiconductors and heat spreaders. The need for smaller, faster and lighter products has put considerable demands on the thermal management of microelectronics. This paper outlines the issues in thermal management of consumer and aerospace electronics. Some typical solutions for complex high-end systems are presented. The role of the thermal interface material is a key to the thermal management of high performance consumer electronics.
