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Hardback. Condizione: New. Failure analysis is the preferred method to investigate product or process reliability and to ensure optimum performance of electrical components and systems. The physics-of-failure approach is the only internationally accepted solution for continuously improving the reliability of materials, devices and processes. The models have been developed from the physical and chemical phenomena that are responsible for degradation or failure of electronic components and materials and now replace popular distribution models for failure mechanisms such as Weibull or lognormal. Reliability engineers need practical orientation around the complex procedures involved in failure analysis. This guide acts as a tool for all advanced techniques, their benefits and vital aspects of their use in a reliability programme. Using twelve complex case studies, the authors explain why failure analysis should be used with electronic components, when implementation is appropriate and methods for its successful use. Inside you will find detailed coverage on: a synergistic approach to failure modes and mechanisms, along with reliability physics and the failure analysis of materials, emphasizing the vital importance of cooperation between a product development team involvedthe reasons why failure analysis is an important tool for improving yield and reliability by corrective actionsthe design stage, highlighting the 'concurrent engineering' approach and DfR (Design for Reliability) failure analysis during fabrication, covering reliability monitoring, process monitors and package reliability reliability resting after fabrication, including reliability assessment at this stage and corrective actions a large variety of methods, such as electrical methods, thermal methods, optical methods, electron microscopy, mechanical methods, X-Ray methods, spectroscopic, acoustical, and laser methodsnew challenges in reliability testing, such as its use in microsystems and nanostructures This practical yet comprehensive reference is useful for manufacturers and engineers involved in the design, fabrication and testing of electronic components, devices, ICs and electronic systems, as well as for users of components in complex systems wanting to discover the roots of the reliability flaws for their products.

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Condizione: New. Failure analysis is the preferred method to investigate product or process reliability and to ensure optimum performance of electrical components and systems. The physics-of-failure approach is the only internationally accepted solution for continuously improving the reliability of materials, devices and processes. Series: Quality and Reliability Engineering Series. Num Pages: 340 pages, Illustrations. BIC Classification: TJF. Category: (P) Professional & Vocational. Dimension: 249 x 177 x 22. Weight in Grams: 754. . 2011. 1st Edition. Hardcover. . . . .

Condizione: Sehr gut. Zustand: Sehr gut | Seiten: 509 | Sprache: Englisch | Produktart: Bücher | Keine Beschreibung verfügbar.

Condizione: New. pp. xxii + 317.

Condizione: New. The objective of this book is to better understand why components fail, addressing the needs of engineers who will apply reliability principles in design, manufacture, testing, and field service. It so contributes to new approaches and the development of el.

Condizione: New. Failure analysis is the preferred method to investigate product or process reliability and to ensure optimum performance of electrical components and systems. The physics-of-failure approach is the only internationally accepted solution for continuously improving the reliability of materials, devices and processes. Series: Quality and Reliability Engineering Series. Num Pages: 340 pages, Illustrations. BIC Classification: TJF. Category: (P) Professional & Vocational. Dimension: 249 x 177 x 22. Weight in Grams: 754. . 2011. 1st Edition. Hardcover. . . . . Books ship from the US and Ireland.

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Taschenbuch. Condizione: Neu. Druck auf Anfrage Neuware - Printed after ordering - The first detailed studies of electronic components reliability were undertaken to improve the performance of communications and navigational systems used by the American army. The techniques then developed were subsequently refined and applied to equipment used for many other applications where high reliability was of paramount importance - for example in civil airline electronic systems. The evolution of good and reliable products is the responsibility of technical and professional persons, engineers and designers. These individuals cannot succeed unless they are given adequate opportunity to apply their arts and mysteries so as to bring the end-product to the necessary level of satisfaction. Few managements, however, are yet aware of the far greater potential value of the reliability of their products or services. Yet customer satisfaction depends, in most cases, far more on the reliability of performance than on quality in the industrial sense. There was a time when reliable design could be prescribed simply as 'picking good parts and using them right'. Nowadays the complexity of systems, particularly electronic systems, and the demand for ultrahigh reliability in many applications mean that sophisticated methods based on numerical analysis and probability techniques have been brought to bear - particularly in the early stages of design - on determining the feasibility of systems.

Hardback. Condizione: New. Failure analysis is the preferred method to investigate product or process reliability and to ensure optimum performance of electrical components and systems. The physics-of-failure approach is the only internationally accepted solution for continuously improving the reliability of materials, devices and processes. The models have been developed from the physical and chemical phenomena that are responsible for degradation or failure of electronic components and materials and now replace popular distribution models for failure mechanisms such as Weibull or lognormal. Reliability engineers need practical orientation around the complex procedures involved in failure analysis. This guide acts as a tool for all advanced techniques, their benefits and vital aspects of their use in a reliability programme. Using twelve complex case studies, the authors explain why failure analysis should be used with electronic components, when implementation is appropriate and methods for its successful use. Inside you will find detailed coverage on: a synergistic approach to failure modes and mechanisms, along with reliability physics and the failure analysis of materials, emphasizing the vital importance of cooperation between a product development team involvedthe reasons why failure analysis is an important tool for improving yield and reliability by corrective actionsthe design stage, highlighting the 'concurrent engineering' approach and DfR (Design for Reliability) failure analysis during fabrication, covering reliability monitoring, process monitors and package reliability reliability resting after fabrication, including reliability assessment at this stage and corrective actions a large variety of methods, such as electrical methods, thermal methods, optical methods, electron microscopy, mechanical methods, X-Ray methods, spectroscopic, acoustical, and laser methodsnew challenges in reliability testing, such as its use in microsystems and nanostructures This practical yet comprehensive reference is useful for manufacturers and engineers involved in the design, fabrication and testing of electronic components, devices, ICs and electronic systems, as well as for users of components in complex systems wanting to discover the roots of the reliability flaws for their products.

Buch. Condizione: Neu. Neuware - Failure analysis is the preferred method to investigate product or process reliability and to ensure optimum performance of electrical components and systems. The physics-of-failure approach is the only internationally accepted solution for continuously improving the reliability of materials, devices and processes. The models have been developed from the physical and chemical phenomena that are responsible for degradation or failure of electronic components and materials and now replace popular distribution models for failure mechanisms such as Weibull or lognormal.Reliability engineers need practical orientation around the complex procedures involved in failure analysis. This guide acts as a tool for all advanced techniques, their benefits and vital aspects of their use in a reliability programme. Using twelve complex case studies, the authors explain why failure analysis should be used with electronic components, when implementation is appropriate and methods for its successful use.Inside you will find detailed coverage on:\* a synergistic approach to failure modes and mechanisms, along with reliability physics and the failure analysis of materials, emphasizing the vital importance of cooperation between a product development team involved\* the reasons why failure analysis is an important tool for improving yield and reliability by corrective actions\* the design stage, highlighting the 'concurrent engineering' approach and DfR (Design for Reliability)\* failure analysis during fabrication, covering reliability monitoring, process monitors and package reliability\* reliability resting after fabrication, including reliability assessment at this stage and corrective actions\* a large variety of methods, such as electrical methods, thermal methods, optical methods, electron microscopy, mechanical methods, X-Ray methods, spectroscopic, acoustical, and laser methods\* new challenges in reliability testing, such as its use in microsystems and nanostructuresThis practical yet comprehensive reference is useful for manufacturers and engineers involved in the design, fabrication and testing of electronic components, devices, ICs and electronic systems, as well as for users of components in complex systems wanting to discover the roots of the reliability flaws for their products.

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